Patents by Inventor Hyo-San Kim

Hyo-San Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200398353
    Abstract: A cutting insert of the present invention comprises: an upper surface and a lower surface; first and second lateral surfaces; first and second cutting edge parts; and corner cutting edges, wherein the first cutting edge part includes: a first main cutting edge for forming one end at a portion spaced farthest away from the corner cutting edge; a first sub-cutting edge connected to the corner cutting edge; and a first auxiliary cutting edge for connecting the first main cutting edge and the first sub-cutting edge so as to form a step between the same, and the first sub-cutting edge and the corner cutting edge form one straight line when viewed toward the first lateral surface, and are inclined upward in the direction opposite to the direction toward the lower surface while gradually going in the direction toward the second cutting edge part.
    Type: Application
    Filed: December 6, 2018
    Publication date: December 24, 2020
    Applicant: KORLOY INC.
    Inventors: Min Seok OH, Ki Chan NAM, Byeong Yun LEE, Hyo San KIM, Young Heum KIM
  • Publication number: 20200368829
    Abstract: A cutting insert for groove machining is provided, which includes a front cutting edge, a chip breaker groove extending from a rear direction of the front cutting edge in a lengthwise direction of the cutting insert, land portions formed on both sides of the chip breaker groove, and inclined surfaces in continuity with the land portions and extending from the land portions to a rear direction of the cutting insert, in which a distance in a transverse direction between left and right walls of the chip breaker groove gradually increases from an entrance of the chip breaker groove toward a boundary between the land portions and the inclined surfaces, and then gradually decreases upon passing the boundary, and the cutting insert is symmetrical about a longitudinal center line thereof.
    Type: Application
    Filed: April 24, 2020
    Publication date: November 26, 2020
    Applicant: KORLOY INC.
    Inventors: Sung Guen SHIN, Byung Hoon MIN, Hyo San KIM, Young Heum KIM
  • Publication number: 20200216758
    Abstract: An etchant composition and a method of fabricating a semiconductor device, the composition including an inorganic acid; about 0.01 parts by weight to about 0.5 parts by weight of colloidal silica; about 0.01 parts by weight to about 30 parts by weight of an ammonium-based additive; and about 20 parts by weight to about 50 parts by weight of a solvent, all parts by weight being based on 100 parts by weight of the inorganic acid.
    Type: Application
    Filed: September 10, 2019
    Publication date: July 9, 2020
    Applicant: Soulbrain Co., Ltd.
    Inventors: Jung-ah KIM, Young-chan KIM, Hyo-san LEE, Hoon HAN, Jin-uk LEE, Jung-hun LIM, Ik-hee KIM
  • Publication number: 20200071566
    Abstract: A slurry composition for a chemical mechanical polishing (CMP) process includes about 0.1% by weight to about 10% by weight of polishing particles, about 0.001% by weight to about 1% by weight of an amine compound, about 0.001% by weight to about 1% by weight of a first cationic compound that is amino acid, about 0.001% by weight to about 1% by weight of a second cationic compound that is organic acid, and about 1% by weight to about 5% by weight of polyhydric alcohol including at least two hydroxyl groups.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Applicant: KCTECH CO., LTD.
    Inventors: Sang-hyun Park, Hyo-san Lee, Won-ki Hur, Jung-yoon Kim, Jun-ha Hwang, Chang-gil Kwon, Sung-pyo Lee
  • Patent number: 10576582
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Patent number: 10525566
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: January 7, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki Hong, Yung-jun Kim, Sung-oh Park, Hyo-san Lee, Joo-han Lee, Kyu-min Oh, Sun-gyu Park, Seh-kwang Lee, Chan-ki Yang
  • Patent number: 10493535
    Abstract: The present disclosure relates to a cutting insert. The cutting insert according to the exemplary embodiment of the present disclosure has a dot formed between a main cutting edge and a chip breaker, and the dot has a bridge formed between the main cutting edges. Therefore, a chip, which is produced during a cutting process, may come into contact with three points on a main cutting edge land portion, the bridge, and the dot. The chip may discharge heat generated from the cutting insert while the chip comes into contact with the three points.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: December 3, 2019
    Assignee: KORLOY INC
    Inventors: Dong Sub An, Sung Hun Kim, Hyo San Kim, Sang Ho Lim, Young Heum Kim
  • Patent number: 10464145
    Abstract: The technical objective of the present invention is to provide a cutting insert that has an improved fastening property with a cutting tool, thereby preventing reduction of the service life. To this end, the cutting insert according to the present invention has three corners along the circumference thereof; an upper main cutting edge, which is formed on the edge between the upper surface and the first side surface, and an upper sub cutting edge, which is formed on the edge between the upper surface and the second side surface, are continuously disposed between respective corners; the lower surface has the same shape as that of the upper surface; and the angle defined between the upper main cutting edge and the upper sub cutting edge, which are placed on both sides with reference to each corner, is larger than or equal to 85° and is smaller than 90°.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: November 5, 2019
    Assignee: KORLOY INC.
    Inventors: Nam-seon Lee, Ki-chan Nam, Kane-hee Lee, Hyo-san Kim, Young-heum Kim
  • Patent number: 10395951
    Abstract: In a method of cleaning a substrate, a protecting liquid may be sprayed to a surface of the substrate from a first position in a first spray direction. Cleaning droplets may be injected on to the surface of the substrate. The protecting liquid may be sprayed to the surface of the substrate from a second position different from the first position in a second spray direction. For example, the protecting liquid may be always sprayed from the central portion toward the edge portions in the substrate so that the protecting liquid on the substrate may have a uniform thickness.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-Hoon Kim, Kyoung-Seob Kim, Dong-Chul Kim, Hyo-San Lee
  • Publication number: 20190241844
    Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.
    Type: Application
    Filed: January 17, 2019
    Publication date: August 8, 2019
    Inventors: Mi Hyun PARK, Jung-Min OH, Young-Hoo KIM, Hyo San LEE, Tae Keun KIM, Ye Rim YEON, Hae Rim OH, Ji Soo JEONG, Min Hee CHO
  • Patent number: 10357833
    Abstract: The technical objective of the present invention is to provide a cutting insert that can minimize a phenomenon in which the cutting insert is lifted up from a seat surface of a cutting tool while a cutting process is being performed, and can increase an area by which the cutting insert is fastened to the cutting tool.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: July 23, 2019
    Assignee: KORLOY INC.
    Inventors: Min Seok Oh, Ki Chan Nam, Tae Kyun Kim, Nam Seon Lee, Hyo San Kim, Young Heum Kim
  • Patent number: 10343221
    Abstract: A cutting insert and a cutting tool having same. The cutting insert includes: an upper surface; a lower surface having a flat surface; a fastening hole penetrating the upper surface and the lower surface; side surfaces each connecting to the upper surface and the lower surface; and cutting edges formed by the upper surface and the side surfaces. A first cutting edge is inclined downward. A major side surface comprises a first major side surface connected to the upper surface so as to constitute the first cutting edge, and a second major side surface connected to the first major side surface and the lower surface. A minor side surface comprises a first minor side surface connected to the upper surface so as to constitute a second cutting edge, and a third minor side surface connected to the upper surface and the lower surface.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: July 9, 2019
    Assignee: KORLOY INC.
    Inventors: Ki-Chan Nam, Young-Heum Kim, Hyo-San Kim
  • Patent number: 10332762
    Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: June 25, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-hoo Kim, Il-sang Lee, In-gi Kim, Kyoung-hwan Kim, Hyo-san Lee, Sang-won Bae, Tae-hong Kim, Yong-jun Choi
  • Publication number: 20190030628
    Abstract: The technical objective of the present invention is to provide a cutting insert that can minimize a phenomenon in which the cutting insert is lifted up from a seat surface of a cutting tool while a cutting process is being performed, and can increase an area by which the cutting insert is fastened to the cutting tool.
    Type: Application
    Filed: November 29, 2016
    Publication date: January 31, 2019
    Applicant: KORLOY INC.
    Inventors: Min Seok OH, Ki Chan NAM, Tae Kyun KIM, Nam Seon LEE, Hyo San KIM, Young Heum KIM
  • Publication number: 20190009345
    Abstract: The present disclosure relates to a cutting insert. The cutting insert according to the exemplary embodiment of the present disclosure has a dot formed between a main cutting edge and a chip breaker, and the dot has a bridge formed between the main cutting edges. Therefore, a chip, which is produced during a cutting process, may come into contact with three points on a main cutting edge land portion, the bridge, and the dot. The chip may discharge heat generated from the cutting insert while the chip comes into contact with the three points.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 10, 2019
    Applicant: KORLOY INC
    Inventors: Dong Sub An, Sung Hun Kim, Hyo San Kim, Sang Ho Lim, Young Heum Kim
  • Patent number: 10086447
    Abstract: A cutting insert and a cutting tool having same are provided. The cutting insert includes an upper surface, a lower surface having a flat surface, side surfaces connecting to each of the upper surface and the lower surface, and cutting edges being formed by the upper surface and the side surfaces. A first cutting edge among the cutting edges is inclined downward. A major side surface among the side surfaces comprises a first major side surface connected to the upper surface so as to constitute the first cutting edge, and a second major side surface connected to the first major side surface and the lower surface. The first major side surface has a reversely positive surface, and the second major side surface has a reversely positive surface or a negative surface, and a minor side surface among the side surfaces has a positive surface or a negative surface.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 2, 2018
    Assignee: KORLOY INC.
    Inventors: Ki-Chan Nam, Young-Heum Kim, Kane-Hee Lee, Hyo-San Kim
  • Publication number: 20180200808
    Abstract: The technical objective of the present invention is to provide a cutting insert that has an improved fastening property with a cutting tool, thereby preventing reduction of the service life. To this end, the cutting insert according to the present invention has three corners along the circumference thereof; an upper main cutting edge, which is formed on the edge between the upper surface and the first side surface, and an upper sub cutting edge, which is formed on the edge between the upper surface and the second side surface, are continuously disposed between respective corners; the lower surface has the same shape as that of the upper surface; and the angle defined between the upper main cutting edge and the upper sub cutting edge, which are placed on both sides with reference to each corner, is larger than or equal to 85° and is smaller than 90°.
    Type: Application
    Filed: May 27, 2016
    Publication date: July 19, 2018
    Applicant: KORLOY INC.
    Inventors: Nam-seon LEE, Ki-chan NAM, Kane-hee LEE, Hyo-san KIM, Young-heum KIM
  • Patent number: D824438
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 31, 2018
    Inventors: Byung Hoon Min, Sung Guen Shin, Dong Sub An, Hyo San Kim, Young Heum Kim
  • Patent number: D837847
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: January 8, 2019
    Inventors: Byung Hoon Min, Sung Guen Shin, Dong Sub An, Hyo San Kim, Young Heum Kim
  • Patent number: D898085
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: October 6, 2020
    Assignee: KORLOY INC.
    Inventors: Tae Kyun Kim, Hyo San Kim, Young Heum Kim, Ki Chan Nam