Patents by Inventor Hyo Seon LEE

Hyo Seon LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11174309
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor and Ang2, and related methods and compositions.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Eun Kim, Seung Ja Oh, Hyo Seon Lee, Sang Yeul Han
  • Patent number: 10934350
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor through Ang2, and methods of using the same.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Kyun Kim, Sunghyun Kim, Sang Yeul Han, Seung Hyun Lee, Su Jin Kim, Yong In Kim, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee
  • Patent number: 10229876
    Abstract: A wiring structure includes a substrate, a lower insulation layer on the substrate, a lower wiring in the lower insulation layer, a first etch-stop layer covering the lower wiring and including a metallic dielectric material, a second etch-stop layer on the first etch-stop layer and the lower insulation layer, an insulating interlayer on the second etch-stop layer, and a conductive pattern extending through the insulating interlayer, the second etch-stop layer and the first etch-stop layer and electrically connected to the lower wiring.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: March 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Jung Kim, Young-Bae Kim, Jong-Sam Kim, Jin-Hyeung Park, Jeong-Hoon Ahn, Hyeok-Sang Oh, Kyoung-Woo Lee, Hyo-Seon Lee, Suk-Hee Jang
  • Publication number: 20180273613
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor through Ang2, and methods of using the same.
    Type: Application
    Filed: June 11, 2018
    Publication date: September 27, 2018
    Inventors: Seok Kyun Kim, Sunghyun Kim, Sang Yeul Han, Seung Hyun Lee, Su Jin Kim, Yong In Kim, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee
  • Patent number: 10047154
    Abstract: An Ang2 specific antibody, a method of inhibiting angiogenesis or a method of treating a disease related to the activation and/or overproduction of Ang2 using the antibody, and a composition for diagnosing a disease related to the activation and/or overproduction of Ang2 including the antibody.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: August 14, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Kyun Kim, Sang Yeul Han, Kwang Hoon Lee, Kyung Eun Kim, Chung Ho Kim, Yong In Kim, Hyung-Chan Kim, Yoon Sook Lee, Hyo Seon Lee
  • Patent number: 9994632
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor through Ang2, and methods of using the same.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: June 12, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Kyun Kim, Sunghyun Kim, Sang Yeul Han, Seung Hyun Lee, Su Jin Kim, Yong In Kim, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee
  • Patent number: 9931400
    Abstract: Provided is a method of combination therapy for prevention or treatment of c-Met-induced or angiogenesis factor-induced diseases including co-administering an angiogenesis inhibitor and an anti-c-Met antibody or an antigen-binding fragment thereof to a patient.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: April 3, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Ju Jeong, Kyung Ah Kim, Yun Jeong Song, Ji Min Lee, Hyo Seon Lee, Jae Hyun Choi, Saet Byoul Lee
  • Publication number: 20180086825
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor and Ang2, and related methods and compositions.
    Type: Application
    Filed: November 27, 2017
    Publication date: March 29, 2018
    Inventors: Kyung Eun Kim, Seung Ja Oh, Hyo Seon Lee, Sang Yeul Han
  • Patent number: 9902767
    Abstract: A method for the prevention and/or treatment of a disease accompanied by vascular leakage and/or vascular inflammation comprising administering an anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and forms a complex with a Tie2 receptor and Ang2.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo Seon Lee, Kyung Eun Kim, Seung Ja Oh, Sang Yeul Han
  • Patent number: 9828422
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor and Ang2, and related methods and compositions.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Eun Kim, Seung Ja Oh, Hyo Seon Lee, Sang Yeul Han
  • Patent number: 9716043
    Abstract: In a method of forming a wiring structure, a first mask having a first opening including a first portion extending in a second direction and a second portion extending in a first direction is formed. A second mask including a second opening overlapping the first portion of the first opening and third openings each overlapping the second portion of the first opening is designed. The second mask is fabricated to include a fourth opening by enlarging the second opening. The fourth opening overlaps a boundary between the first and second portions of the first opening. An insulating interlayer is etched using the first and second masks to form first and second via holes corresponding to the fourth and third openings, and a trench corresponding to the first opening. First and second vias and a wiring are formed to fill the first and second via holes and the trench.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: July 25, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Hyeung Park, Yeon-Joo Kim, In-Hwan Kim, Jun-Jung Kim, Kyoung-Pil Park, Jeong-Hoon Ahn, Sang-Chul Lee, Joon-Nyung Lee, Hyo-Seon Lee
  • Patent number: 9580497
    Abstract: An Ang2 specific antibody, a method of preventing and/or treating a disease related to the activation and/or overproduction (overexpression) of Ang2 by administering the antibody to a subject, and a method of screening a candidate substance for diagnosing, preventing, or treating a disease related to activation or overproduction of Ang2.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: February 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Eun Kim, Yoon Sook Lee, Sang Yeul Han, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee, Seok Kyun Kim
  • Publication number: 20160379891
    Abstract: In a method of forming a wiring structure, a first mask having a first opening including a first portion extending in a second direction and a second portion extending in a first direction is formed. A second mask including a second opening overlapping the first portion of the first opening and third openings each overlapping the second portion of the first opening is designed. The second mask is fabricated to include a fourth opening by enlarging the second opening. The fourth opening overlaps a boundary between the first and second portions of the first opening. An insulating interlayer is etched using the first and second masks to form first and second via holes corresponding to the fourth and third openings, and a trench corresponding to the first opening. First and second vias and a wiring are formed to fill the first and second via holes and the trench.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 29, 2016
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: JIN-HYEUNG PARK, Yeon-Joo Kim, In-Hwan Kim, Jun-Jung Kim, Kyoung-Pil Park, Jeong-Hoon Ahn, Sang-Chul Lee, Joon-Nyung Lee, Hyo-Seon Lee
  • Patent number: 9527910
    Abstract: Provided are an anti-Ang-2 antibody or antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang-2), related compositions and pharmaceutical compositions, and methods for using such compositions and pharmaceutical compositions.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: December 27, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon Sook Lee, Chung Ho Kim, Kyung Eun Kim, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee, Sang Yeul Han
  • Patent number: 9505841
    Abstract: A method of preventing or treating cancer using an anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes to a Tie2 receptor while bound with Ang2.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: November 29, 2016
    Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyung Eun Kim, Sang Yeul Han, Gou Young Koh, Hyo Seon Lee, Chan Kim
  • Publication number: 20160343660
    Abstract: A wiring structure includes a substrate, a lower insulation layer on the substrate, a lower wiring in the lower insulation layer, a first etch-stop layer covering the lower wiring and including a metallic dielectric material, a second etch-stop layer on the first etch-stop layer and the lower insulation layer, an insulating interlayer on the second etch-stop layer, and a conductive pattern extending through the insulating interlayer, the second etch-stop layer and the first etch-stop layer and electrically connected to the lower wiring.
    Type: Application
    Filed: March 17, 2016
    Publication date: November 24, 2016
    Inventors: Jun-Jung KIM, Young-Bae KIM, Jong-Sam KIM, Jin-Hyeung PARK, Jeong-Hoon AHN, Hyeok-Sang OH, Kyoung-Woo LEE, Hyo-Seon LEE, Suk-Hee JANG
  • Publication number: 20160101154
    Abstract: Angiopoietin-2 (Ang2) derived peptides, polypeptides, and peptide complexes, and a method for inhibition of binding between Ang2 and integrin and prevention and/or treatment of a disease caused by the activation of Ang2 or the binding between Ang2 and integrin using the peptide, polypeptides, and peptide complexes.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 14, 2016
    Inventors: Sang Yeul Han, Chung Ho Kim, Kyung Eun Kim, Hyung-Chan Kim, Kwang-Hoon Lee, Hyo Seon Lee
  • Publication number: 20150337033
    Abstract: An anti-Ang2 antibody or an antigen-binding fragment thereof that specifically binds to an angiogenesis-inducing factor Angiopoietin-2 (Ang2) and complexes with a Tie2 receptor through Ang2, and methods of using the same.
    Type: Application
    Filed: May 26, 2015
    Publication date: November 26, 2015
    Inventors: Seok Kyun Kim, Sunghyun Kim, Sang Yeul Han, Seung Hyun Lee, Su Jin Kim, Yong In Kim, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee
  • Patent number: 9193768
    Abstract: There are provided an angiopoietin-2 (Ang2) derived peptides, polypeptides, and peptide complexes, and a method for inhibition of binding between Ang2 and integrin and prevention and/or treatment of a disease caused by the activation of Ang2 or the binding between Ang2 and integrin using the peptide, polypeptides, and peptide complexes.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Yeul Han, Chung Ho Kim, Kyung Eun Kim, Hyung-Chan Kim, Kwang-Hoon Lee, Hyo Seon Lee
  • Publication number: 20150210761
    Abstract: An Ang2 specific antibody, a method of preventing and/or treating a disease related to the activation and/or overproduction (overexpression) of Ang2 by administering the antibody to a subject, and a method of screening a candidate substance for diagnosing, preventing, or treating a disease related to activation or overproduction of Ang2.
    Type: Application
    Filed: January 27, 2015
    Publication date: July 30, 2015
    Inventors: Kyung Eun Kim, Yoon Sook Lee, Sang Yeul Han, Hyung-Chan Kim, Kwang Hoon Lee, Hyo Seon Lee, Seok Kyun Kim