Abstract: A controllable advanced decomposition equipment for industrial process-water containing non-biodegradable organics and in-organics, which is configured in multiple stages, includes: an ozone dissolving tank, a hydroxyl radical forming tank, and a gas-liquid separation tank as a unit process are configured in multiple stages. A G/L ratio is controlled by adjusting an ozone-gas amount and a circulating-water amount, thus maximizing ozone availability in the ozone dissolving tank, and then a current density is adjusted in the hydroxyl-radical forming tank to maximize the generated amount of hydroxyl radicals due to the charging of semiconductor catalyst, thus controlling the treatment efficiency of non-biodegradable process water.

Abstract: There is provided a main unit and a distributed antenna system including the same. The main unit for constituting a distributed antenna system that receives a base station signal from at least one base station, transmits the base station signal to at least one user terminal, and includes a plurality of main units, the main unit includes: a first receiver for receiving a first group of base station signals; a second receiver for receiving a second group of base station signals from another main unit; a signal combiner for combining the first and second groups of base station signals; and a delay compensator for compensating for time delay corresponding to a path between the main unit and the other main unit with respect to the first group of base station signals before combining the first and second groups of base station signals.

Abstract: The present invention, which relates to a multi-path communication device for sharing a feedback path for digital pre-distortion, includes: a DPD processing unit configured to output a plurality of pre-distorted signals by respectively pre-distorting a plurality of input signals, to output an nth control signal when an nth input signal is input, and to output an nth pre-distorted signal using an nth feedback signal input in response to the nth control signal; a power amplifying unit configured to amplify each of the plurality of pre-distorted signals and output a plurality of amplified signals; a signal combining unit configured to combine some of each of the plurality of amplified signals and output combined feedback signal; and a signal selection unit configured to select and output only the nth feedback signal from the combined feedback signal according to the input nth control signal, thereby preventing an increase in the size of a device and manufacturing cost thereof caused by a plurality of DPD feedbac

Abstract: The present invention, which relates to a multi-path communication device for sharing a feedback path for digital pre-distortion, includes: a DPD processing unit configured to output a plurality of pre-distorted signals by respectively pre-distorting a plurality of input signals, to output an nth control signal when an nth input signal is input, and to output an nth pre-distorted signal using an nth feedback signal input in response to the nth control signal; a power amplifying unit configured to amplify each of the plurality of pre-distorted signals and output a plurality of amplified signals; a signal combining unit configured to combine some of each of the plurality of amplified signals and output combined feedback signal; and a signal selection unit configured to select and output only the nth feedback signal from the combined feedback signal according to the input nth control signal, thereby preventing an increase in the size of a device and manufacturing cost thereof caused by a plurality of DPD feedbac

Abstract: The present invention, which relates to a multi-path communication device for sharing a feedback path for digital pre-distortion, includes: a DPD processing unit configured to output a plurality of pre-distorted signals by respectively pre-distorting a plurality of input signals, to output an nth control signal when an nth input signal is input, and to output an nth pre-distorted signal using an nth feedback signal input in response to the nth control signal; a power amplifying unit configured to amplify each of the plurality of pre-distorted signals and output a plurality of amplified signals; a signal combining unit configured to combine some of each of the plurality of amplified signals and output combined feedback signal; and a signal selection unit configured to select and output only the nth feedback signal from the combined feedback signal according to the input nth control signal, thereby preventing an increase in the size of a device and manufacturing cost thereof caused by a plurality of DPD feedbac

Abstract: The present invention, which relates to a multi-path communication device for sharing a feedback path for digital pre-distortion, includes: a DPD processing unit configured to output a plurality of pre-distorted signals by respectively pre-distorting a plurality of input signals, to output an nth control signal when an nth input signal is input, and to output an nth pre-distorted signal using an nth feedback signal input in response to the nth control signal; a power amplifying unit configured to amplify each of the plurality of pre-distorted signals and output a plurality of amplified signals; a signal combining unit configured to combine some of each of the plurality of amplified signals and output combined feedback signal; and a signal selection unit configured to select and output only the nth feedback signal from the combined feedback signal according to the input nth control signal, thereby preventing an increase in the size of a device and manufacturing cost thereof caused by a plurality of DPD feedbac

Abstract: There is provided a main unit and a distributed antenna system including the same. The main unit for constituting a distributed antenna system that receives a base station signal from at least one base station, transmits the base station signal to at least one user terminal, and includes a plurality of main units, the main unit includes: a first receiver for receiving a first group of base station signals; a second receiver for receiving a second group of base station signals from another main unit; a signal combiner for combining the first and second groups of base station signals; and a delay compensator for compensating for time delay corresponding to a path between the main unit and the other main unit with respect to the first group of base station signals before combining the first and second groups of base station signals.

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract: A chip on film (COF) package and a method for manufacturing same are provided. The COF package comprises a base film, a semiconductor chip mounted on the base film, a signal-inputting portion mounted on the base film, a first passive element mounted on the base film and comprising first and second terminals and a first signal line formed on the base film and connecting the first passive element to the semiconductor chip, wherein the first signal line comprises a connection pad connected to the first terminal of the first passive element and a first test line connected to the signal-inputting portion.

Abstract: A chip on film (COF) package and a method for manufacturing same are provided. The COF package comprises a base film, a semiconductor chip mounted on the base film, a signal-inputting portion mounted on the base film, a first passive element mounted on the base film and comprising first and second terminals and a first signal line formed on the base film and connecting the first passive element to the semiconductor chip, wherein the first signal line comprises a connection pad connected to the first terminal of the first passive element and a first test line connected to the signal-inputting portion.

Abstract: The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

Abstract: A variable directional microphone assembly and method of manufacturing the same, which includes a printed circuit board including a connection terminal provided to a surface thereof, and a semiconductor integrated circuit device mounted to another surface thereof, a microphone body including a first mounting space for mounting the semiconductor integrated circuit device, two second mounting spaces, and a coil spring insertion hole, the first mounting space being provided to a surface of the microphone body, the second mounting spaces being provided to another surface of the microphone body, two microphone devices mounted to the second mounting spaces, the insertion hole allowing the microphone device to be in contact with the printed circuit board, a coil spring inserted into the coil spring insertion hole to electrically connect the microphone device to the printed circuit board, and a case including a sound hole in a bottom thereof.

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract: A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.

Abstract: Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved.

Abstract: The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

Abstract: A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receiving data and control signals and transmitting the data and control signals to the semiconductor chip, a plurality of passive elements connected to terminals of the semiconductor chip, and a plurality of test pads for testing one or more terminals of the semiconductor chip that are not connected to the signal-input portion. The test pads of the COF package are capable of testing a plurality of internal terminals which are integrated into one terminal and do not connected to the signal-input portion, thereby easily testing the electrical function of the chip.

Abstract: Disclosed is a necklace type radio headset capable of overcoming problems of conventional headsets, in which cables connected between earphones of a headset easily get tangled with each other or with other objects in a storing place of the headset while the headset is not used. The headset according to the present invention includes casings connected via a cable and enclosing one or more Bluetooth modules and respective speakers therein, and the casings are detachably coupled to each other by a coupling means, so that a user can wear the headset around his or her neck like a necklace because the cable always maintains a ring shape. As the coupling means, one of the casings has a depression for receiving a speaker housing to be inserted into a user's ear, and the speaker housing is input in the depression while it is not used. Further, since either or both of the casings have respective permanent magnets, the casings are coupled by attractive magnetic force exerted between the permanent magnets.

Abstract: The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

Abstract: A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receiving data and control signals and transmitting the data and control signals to the semiconductor chip, a plurality of passive elements connected to terminals of the semiconductor chip, and a plurality of test pads for testing one or more terminals of the semiconductor chip that are not connected to the signal-input portion. The test pads of the COF package are capable of testing a plurality of internal terminals which are integrated into one terminal and do not connected to the signal-input portion, thereby easily testing the electrical function of the chip.