Abstract: A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, and M blocks are arranged in a horizontal direction and N blocks are arranged in a vertical direction, and at least one light emitting device disposed on each of the blocks. The backlight control module is configured to perform a dimming control of the M×N blocks such that the at least one light emitting device in one block can be controlled independently from other light emitting devices disposed in the remaining blocks that are disposed in the horizontal direction and in the vertical direction with respect to the one block.

Abstract: Embodiments of the disclosure provide a backlight module using MJT LEDs and a backlight unit including the same. More specifically, embodiments of the disclosure provide a backlight module, which includes MJT LEDs configured to increase an effective light emitting area of each of light emitting cells and optical members capable of uniformly dispersing light emitted from the MJT LEDs. In addition, embodiments of the disclosure provide a backlight unit using the backlight module, thereby reducing the number of LEDs constituting the backlight unit while allowing operation at low current.

Abstract: A direct type backlight unit disposed under a liquid crystal panel includes a backlight module including a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, light emitting devices disposed on the printed circuit board such that at least one light emitting device is disposed in each block, each of the light emitting devices including light emitting cells disposed on a single substrate, and optical members disposed on the light emitting devices, each of the optical members being configured to change a light beam distribution of a corresponding light emitting device, and a backlight control module configured to control dimming levels of the light emitting devices and to independently control the light emitting devices disposed in different blocks.

Abstract: A direct type backlight unit disposed under a liquid crystal panel includes a backlight module including a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, light emitting devices disposed on the printed circuit board such that at least one light emitting device is disposed in each block, each of the light emitting devices including light emitting cells disposed on a single substrate, and optical members disposed on the light emitting devices, each of the optical members being configured to change a light beam distribution of a corresponding light emitting device, and a backlight control module configured to control dimming levels of the light emitting devices and to independently control the light emitting devices disposed in different blocks.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: Embodiments of the disclosure provide a backlight module using MJT LEDs and a backlight unit including the same. More specifically, embodiments of the disclosure provide a backlight module, which includes MJT LEDs configured to increase an effective light emitting area of each of light emitting cells and optical members capable of uniformly dispersing light emitted from the MJT LEDs. In addition, embodiments of the disclosure provide a backlight unit using the backlight module, thereby reducing the number of LEDs constituting the backlight unit while allowing operation at low current.

Abstract: A method of fabricating a light-emitting device including the steps of forming a first resin including a phosphor on a light-emitting diode chip mounted on a package body, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, correcting the color coordinates by forming a second resin on the first resin, and curing the first resin and the second resin after correcting the color coordinates, in which the first resin is not fully cured before measuring and correcting the color coordinates.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: A method of fabricating a light-emitting device including the steps of forming a first resin including a phosphor on a light-emitting diode chip mounted on a package body, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, correcting the color coordinates by forming a second resin on the first resin, and curing the first resin and the second resin after correcting the color coordinates, in which the first resin is not fully cured before measuring and correcting the color coordinates.

Abstract: A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (LED) chip electrically connected to the first and the second electrodes, and a phosphor sheet disposed on an upper surface of the LED chip, a first transparent part disposed under the phosphor sheet, and a second transparent part disposed between the phosphor sheet and the LED chip. The first transparent part contacts the second transparent part.

Abstract: A method of fabricating a light-emitting device, the method including forming a first resin comprising a phosphor inside a cavity of a package body on which a light-emitting diode chip is mounted, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, and correcting the color coordinates by forming a second resin on the first resin. The first resin is not fully cured before measuring and correcting the color coordinates.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: A light emitting device is disclosed. The light emitting device includes: a light emitting diode emitting light having a peak wavelength in the range of 415 nm to 435 nm; and a wavelength conversion unit disposed on the light emitting diode, wherein the wavelength conversion unit includes cyan phosphors emitting light having a peak wavelength in a cyan light wavelength band and red phosphors emitting light having a peak wavelength in a red light wavelength band, and a ratio of an output of light having a wavelength in the range of 435 nm to 465 nm to a total output of light emitted from the light emitting device is approximately equal to or less than 3%.

Abstract: A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, and M blocks are arranged in a horizontal direction and N blocks are arranged in a vertical direction, and at least one light emitting device disposed on each of the blocks. The backlight control module is configured to perform a dimming control of the M×N blocks such that the at least one light emitting device in one block can be controlled independently from other light emitting devices disposed in the remaining blocks that are disposed in the horizontal direction and in the vertical direction with respect to the one block.

Abstract: A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks, and light emitting diode (LED) chips disposed on the blocks, and the backlight control module is configured to perform a dimming control of the LED chips. Each of the LED chips includes light emitting cells spaced apart from each other, each of the light emitting cells including a lower semiconductor layer, an upper semiconductor layer, and an active layer therebewteen, in which the lower semiconductor layers are partially exposed, connection structures electrically connecting the light emitting cells to each other, and an insulation layer disposed between the light emitting cells and the connection structures, the insulation layer covering a portion of the exposed lower semiconductor layers and having a width wider than the connection structures.

Abstract: A direct type backlight unit disposed under a liquid crystal panel includes a backlight module including a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, light emitting devices disposed on the printed circuit board such that at least one light emitting device is disposed in each block, each of the light emitting devices including light emitting cells disposed on a single substrate, and optical members disposed on the light emitting devices, each of the optical members being configured to change a light beam distribution of a corresponding light emitting device, and a backlight control module configured to control dimming levels of the light emitting devices and to independently control the light emitting devices disposed in different blocks.

Abstract: A display device includes a display panel and a backlight unit configured to provide light towards the display panel. The backlight unit includes a backlight module including multi junction technology (MJT) light emitting diodes (LEDs) disposed on blocks disposed on a printed circuit board, an operating power generator configured to generate a DC voltage based on an input voltage, and an operation controller configured to independently control an operation of each of the blocks, the operation controller disposed in an IC of drive circuits. Each of the blocks includes at least one of the MJT LEDs, a single anode, and a single cathode. Each of the MJT LEDs includes at least two light emitting cells disposed in a single LED chip, and anodes of the blocks are connected to the operating power generator, and cathodes of the blocks are directly connected to the IC of drive circuits.

Abstract: The present invention relates to an LED lamp. In the LED lamp, light may be emitted in lateral and rear directions as well as in a front direction to obtain light distribution characteristics similar to those of an incandescent lamp, and heat generated when the LED emits light may be effectively dissipated.