Abstract: Provided is a tribenzazole amine derivative represented by Formula 1 that effectively absorbs high energy UV light from an external light source to minimize damage to organic materials present in an organic electroluminescent device, contributing to a substantial improvement in the lifetime of the organic electroluminescent device. Also provided is an organic electroluminescent device using the tribenzazole amine derivative. The organic electroluminescent device includes a first electrode, a second electrode, and an organic layer arranged between the first and second electrodes. The organic layer includes the tribenzazole amine derivative.

Abstract: A vehicle includes a vehicle battery; a vehicle sensor configured to detect a current, a voltage and a temperature of the vehicle battery; and an alternator configured to output a target voltage to the vehicle battery. A controller is configured to calculate state of charge (SOC) estimation based on the current, voltage and temperature of the vehicle battery, calculate an initial SOC based on a direct current internal resistance (DCIR) map and apply the initial SOC to the SOC estimation, when an open circuit voltage (OCV) is maintained in a predetermined range after engine-off, and adjust an available SOC range based on a difference between an actual battery charge current amount, to which the initial SOC is applied, and the calculated SOC estimation.

Abstract: A vehicle includes a vehicle battery; a vehicle sensor configured to detect a current, a voltage and a temperature of the vehicle battery; and an alternator configured to output a target voltage to the vehicle battery. A controller is configured to calculate state of charge (SOC) estimation based on the current, voltage and temperature of the vehicle battery, calculate an initial SOC based on a direct current internal resistance (DCIR) map and apply the initial SOC to the SOC estimation, when an open circuit voltage (OCV) is maintained in a predetermined range after engine-off, and adjust an available SOC range based on a difference between an actual battery charge current amount, to which the initial SOC is applied, and the calculated SOC estimation.

Abstract: A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Abstract: A mobile terminal wherein a second antenna is mounted in a flexible PCB of a side key positioned at a location separated from a first antenna is provided. The mobile terminal includes: a main body; the first antenna and a printed circuit board (PCB) positioned on the inside of the main body; a side key positioned at a side surface of the outside of the main body; and a flexible PCB of the side key positioned on the inside of the main body. The flexible PCB of the side key including the second antenna. Therefore, by mounting a second antenna in a flexible PCB of a side key positioned at a location separated from a first antenna, an emission and reception performance of the first antenna and the second antenna can be improved.

Abstract: A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract: A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: A mobile terminal wherein a second antenna is mounted in a flexible PCB of a side key positioned at a location separated from a first antenna is provided. The mobile terminal includes: a main body; the first antenna and a printed circuit board (PCB) positioned on the inside of the main body; a side key positioned at a side surface of the outside of the main body; and a flexible PCB of the side key positioned on the inside of the main body. The flexible PCB of the side key including the second antenna. Therefore, by mounting a second antenna in a flexible PCB of a side key positioned at a location separated from a first antenna, an emission and reception performance of the first antenna and the second antenna can be improved.

Abstract: Disclosed are a system and method for encoding and decoding an image. The image compression system includes an image segmentation unit (110) for segmenting a first image into a plurality of sub-images; a first encoding unit (120) for encoding the sub-images to output sub-image bitstreams; a BMAP construction unit (130) for calculating the quantity of information of each sub-image bitstream and generating BMAP information using the calculated quantity of information and information on construction of each sub-image; and a bitstream combining unit (150) for combining the sub-image bitstreams and BMAP information.

Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

Abstract: Disclosed are a system and method for encoding and decoding an image. The image compression system includes an image segmentation unit (110) for segmenting a first image into a plurality of sub-images; a first encoding unit (120) for encoding the sub-images to output sub-image bitstreams; a BMAP construction unit (130) for calculating the quantity of information of each sub-image bitstream and generating BMAP information using the calculated quantity of information and information on construction of each sub-image; and a bitstream combining unit (150) for combining the sub-image bitstreams and BMAP information.