Abstract: A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Abstract: Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

Abstract: A power module includes a substrate having a dielectric layer, a first power semiconductor device disposed on an upper part of the substrate, and a second power semiconductor device disposed on a lower part of the substrate.

Abstract: A power module includes a substrate having a dielectric layer, a first power semiconductor device disposed on an upper part of the substrate, and a second power semiconductor device disposed on a lower part of the substrate.

Abstract: A spacer structure, which connects an insulating substrate and a semiconductor chip of a double-sided-cooled power module, includes: a conductive material layer which is composed of a composite material; an underlying plating layer disposed on the conductive material layer; and a copper plating layer disposed on the underlying plating layer, in which the copper plating layer is in contact with a joining material that joins the spacer to the semiconductor chip and the insulating substrate.

Abstract: A display panel including: a display unit configured to provide a first image to one of a left eyeball and a right eyeball of a user and to provide a second image having the same tone as a tone of the first image to the other one of the left eyeball and the right eyeball of the user; a brightness correcting unit configured to generate second image data corresponding to the second image by using first image data corresponding to the first image; and a data driver configured to generate a first data signal based on the first image data, to generate a second data signal based on the second image data, and to provide the first and second data signals to the display unit, and the first image and the second image are displayed with different brightnesses during at least a part of an image display period.

Abstract: A spacer structure, which connects an insulating substrate and a semiconductor chip of a double-sided-cooled power module, includes: a conductive material layer which is composed of a composite material; an underlying plating layer disposed on the conductive material layer; and a copper plating layer disposed on the underlying plating layer, in which the copper plating layer is in contact with a joining material that joins the spacer to the semiconductor chip and the insulating substrate.

Abstract: An inverter includes: an upper module having three switching elements, among switching elements defining three poles of a three-phase inverter, which are connected to a positive electrode on a first substrate; and a lower module having three switching elements, among the switching elements defining the three poles of the three-phase inverter, connected to a negative electrode on a second substrate. The upper module and the lower module are configured to be stacked on each other, and a positive terminal of the upper module and a negative terminal of the lower module are stacked so as to be opposite each other with an insulator placed therebetween.

Abstract: A mura detection device includes an XYZ coordinate system conversion unit which receives a photographed image of a display device and converts the photographed image into XYZ image data according to XYZ chromatic coordinates, a background image generation unit which generates background image data obtained by removing a part of the XYZ image data, a color difference calculation unit which generates color difference image data by comparing the photographed image and the background image data, and a mura data generation unit which calculates a color mura index value using the color difference image data.

Abstract: Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.

Abstract: A display device includes a display panel including pixels; and a timing controller to calculate a grayscale usage ratio of input data and to determine an automatic-current-limit rate based on the grayscale usage ratio, the automatic-current-limit rate representing a power saving rate.

Abstract: A head mounted display device includes a display panel including a first display region and a second display region which is arranged at a first angle with respect to the first display region; a reflective panel arranged at a second angle with respect to the second display region, to output a first transmitted light by transmitting a first light which is output from the first display region, and to output a second reflected light by reflecting a second light output from the second display region; and a lens to collect the first transmitted light and the second reflected light.

Abstract: A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

Abstract: A mura detection device includes an XYZ coordinate system conversion unit which receives a photographed image of a display device and converts the photographed image into XYZ image data according to XYZ chromatic coordinates, a background image generation unit which generates background image data obtained by removing a part of the XYZ image data, a color difference calculation unit which generates color difference image data by comparing the photographed image and the background image data, and a mura data generation unit which calculates a color mura index value using the color difference image data.

Abstract: A method of compensating for Mura in a display panel includes displaying a high gray-scale image and a low gray-scale image on a display panel. The displayed images are photographed to generate a high gray-scale luminance image and a low gray-scale luminance image. An ELA Mura for-measurement image having moiré-removed luminance values is generated by dividing luminance values of the low gray-scale luminance image by luminance values of the high gray-scale luminance image. One-dimensional average data is obtained from the ELA Mura for-measurement image. The one-dimensional average data is transformed into frequency-domain data. Target frequency-domain data having a maximum peak value is identified from the frequency-domain data. A direction, an intensity, and a frequency of the ELA Mura are obtained from the target frequency-domain data. A filter is determined based on the obtained information. The filter is applied to image data.

Abstract: Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.

Abstract: A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

Abstract: A display panel including: a display unit configured to provide a first image to one of a left eyeball and a right eyeball of a user and to provide a second image having the same tone as a tone of the first image to the other one of the left eyeball and the right eyeball of the user; a brightness correcting unit configured to generate second image data corresponding to the second image by using first image data corresponding to the first image; and a data driver configured to generate a first data signal based on the first image data, to generate a second data signal based on the second image data, and to provide the first and second data signals to the display unit, and the first image and the second image are displayed with different brightnesses during at least a part of an image display period.