Patents by Inventor Hyun-Kook Lee

Hyun-Kook Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11120734
    Abstract: An electronic device includes a display panel, a first power regulator to supply first power to an anode of light emitting diode and second power to a cathode of the light emitting diode, and a DDI including a second power regulator to supply third power to the anode of the light emitting diode and fourth power to the cathode of the light emitting diode, and connected with the first power regulator, and a processor. The processor outputs first content based on the first power and the second power, in a first operating mode, outputs second content based on the third power and the fourth power, in a second operating mode, and controls the third power to be higher than the first power, and the fourth power to be higher than the second power, when an operating mode is switched.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: September 14, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Kon Bae, Dong Hwy Kim, Hyun Jun Park, Hong Kook Lee, Dong Kyoon Han
  • Publication number: 20190115366
    Abstract: A vertical memory device is provided as follows. A substrate has a cell array region and a connection region adjacent to the cell array region. A first gate stack includes gate electrode layers spaced apart from each other in a first direction perpendicular to the substrate. The gate electrode layers extends from the cell array region to the connection region in a second direction perpendicular to the first direction to form a first stepped structure on the connection region. The first stepped structure includes a first gate electrode layer and a second gate electrode layer sequentially stacked. The second gate electrode layer includes a first region having the same length as a length of the first gate electrode layer and a second region having a shorter length than the length of the first gate electrode layer.
    Type: Application
    Filed: December 6, 2018
    Publication date: April 18, 2019
    Inventors: BYOUNG IL LEE, Joong Shik Shin, Dong Seog Eun, Kyung Jun Shin, Hyun Kook Lee
  • Patent number: 10211220
    Abstract: A semiconductor device includes gate electrodes and interlayer insulating layers alternately stacked on a substrate, a channel layer penetrating through the gate electrodes and the interlayer insulating layers, and a gate dielectric layer disposed on an external surface of the channel layer between the gate electrodes and the channel layer. In addition, the channel layer includes a first region extended in a direction perpendicular to a top surface of the substrate and a second region connected to the first region in a lower portion of the first region and including a plane inclined with respect to the top surface of the substrate.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Il Lee, Kyung Jun Shin, Dong Seog Eun, Ji Hye Kim, Hyun Kook Lee
  • Patent number: 10204919
    Abstract: A vertical memory device is provided as follows. A substrate has a cell array region and a connection region adjacent to the cell array region. A first gate stack includes gate electrode layers spaced apart from each other in a first direction perpendicular to the substrate. The gate electrode layers extends from the cell array region to the connection region in a second direction perpendicular to the first direction to form a first stepped structure on the connection region. The first stepped structure includes a first gate electrode layer and a second gate electrode layer sequentially stacked. The second gate electrode layer includes a first region having the same length as a length of the first gate electrode layer and a second region having a shorter length than the length of the first gate electrode layer.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: February 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Il Lee, Joong Shik Shin, Dong Seog Eun, Kyung Jun Shin, Hyun Kook Lee
  • Publication number: 20170358597
    Abstract: A semiconductor device includes gate electrodes and interlayer insulating layers alternately stacked on a substrate, a channel layer penetrating through the gate electrodes and the interlayer insulating layers, and a gate dielectric layer disposed on an external surface of the channel layer between the gate electrodes and the channel layer. In addition, the channel layer includes a first region extended in a direction perpendicular to a top surface of the substrate and a second region connected to the first region in a lower portion of the first region and including a plane inclined with respect to the top surface of the substrate.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Inventors: Byoung Il LEE, Kyung Jun SHIN, Dong Seog EUN, Ji Hye KIM, Hyun Kook LEE
  • Patent number: 9792918
    Abstract: Provided are an audio encoding method and apparatus and an audio decoding method and apparatus in which audio signals can be encoded or decoded so that sound images can be localized at any desired position for each object audio signal. The audio decoding method generating a third downmix signal by combining a first downmix signal extracted from a first audio signal and a second downmix signal extracted from a second audio signal; generating third object-based side information by combining first object-based side information extracted from the first audio signal and second object-based side information extracted from the second audio signal; converting the third object-based side information into channel-based side information; and generating a multi-channel audio signal using the third downmix signal and the channel-based side information.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: October 17, 2017
    Assignee: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 9773806
    Abstract: A semiconductor device includes gate electrodes and interlayer insulating layers alternately stacked on a substrate, a channel layer penetrating through the gate electrodes and the interlayer insulating layers, and a gate dielectric layer disposed on an external surface of the channel layer between the gate electrodes and the channel layer. In addition, the channel layer includes a first region extended in a direction perpendicular to a top surface of the substrate and a second region connected to the first region in a lower portion of the first region and including a plane inclined with respect to the top surface of the substrate.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: September 26, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byoung Il Lee, Kyung Jun Shin, Dong Seog Eun, Ji Hye Kim, Hyun Kook Lee
  • Publication number: 20170170191
    Abstract: A vertical memory device is provided as follows. A substrate has a cell array region and a connection region adjacent to the cell array region. A first gate stack includes gate electrode layers spaced apart from each other in a first direction perpendicular to the substrate. The gate electrode layers extends from the cell array region to the connection region in a second direction perpendicular to the first direction to form a first stepped structure on the connection region. The first stepped structure includes a first gate electrode layer and a second gate electrode layer sequentially stacked. The second gate electrode layer includes a first region having the same length as a length of the first gate electrode layer and a second region having a shorter length than the length of the first gate electrode layer.
    Type: Application
    Filed: August 31, 2016
    Publication date: June 15, 2017
    Inventors: BYOUNG IL LEE, JOONG SHIK SHIN, DONG SEOG EUN, KYUNG JUN SHIN, HYUN KOOK LEE
  • Patent number: 9659568
    Abstract: A method of decoding an audio signal, and which includes extracting spectral data and a loss signal compensation parameter from an audio signal bitstream; detecting a loss signal based on the spectral data; generating first compensation data corresponding to the loss signal using a random signal based on the loss signal compensation parameter; generating a scale factor by adding a scale factor difference value to a scale factor reference value if the scale factor corresponds to a band quantized to zero, and the scale factor reference value is included in the loss signal compensation parameter; and generating second compensation data by applying the scale factor to the first compensation data.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: May 23, 2017
    Assignee: LG Electronics Inc.
    Inventors: Jae Hyun Lim, Dong Soo Kim, Hyun Kook Lee, Sung Yong Yoon, Hee Suk Pang
  • Patent number: 9613630
    Abstract: An apparatus for processing a signal and method thereof are disclosed. The present invention includes receiving coding mode information indicating a speech coding scheme or an audio coding scheme, linear prediction coding degree information indicating a linear prediction coding degree, and the signal including at least one of a speech signal and an audio signal; decoding the signal according to the speech coding scheme or the audio coding scheme based on the coding mode information; decoding linear prediction coding coefficients of the signal based on the linear prediction coding degree information; and generating an output signal by applying the decoded linear prediction coding coefficients to the decoded signal. In this case, the linear prediction coding degree information is determined based on a variation of a value of an LPC residual generated from performing the linear prediction coding on the signal.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: April 4, 2017
    Assignee: LG Electronics Inc.
    Inventors: Sung Yong Yoon, Tack Sung Choi, Hyun Kook Lee
  • Publication number: 20160314793
    Abstract: Provided are an audio encoding method and apparatus and an audio decoding method and apparatus in which audio signals can be encoded or decoded so that sound images can be localized at any desired position for each object audio signal. The audio decoding method generating a third downmix signal by combining a first downmix signal extracted from a first audio signal and a second downmix signal extracted from a second audio signal; generating third object-based side information by combining first object-based side information extracted from the first audio signal and second object-based side information extracted from the second audio signal; converting the third object-based side information into channel-based side information; and generating a multi-channel audio signal using the third downmix signal and the channel-based side information.
    Type: Application
    Filed: July 1, 2016
    Publication date: October 27, 2016
    Applicant: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 9449601
    Abstract: An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal and object-based side information, the downmix signal comprising at least two downmix channel signals; extracting gain information from the object-based side information and generating modification information for modifying the downmix channel signals on a channel-by-channel basis based on the gain information; and modifying the downmix channel signals by applying the modification information to the downmix channel signals.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: September 20, 2016
    Assignee: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 9384742
    Abstract: Provided are an audio encoding method and apparatus and an audio decoding method and apparatus in which audio signals can be encoded or decoded so that sound images can be localized at any desired position for each object audio signal. The audio decoding method generating a third downmix signal by combining a first downmix signal extracted from a first audio signal and a second downmix signal extracted from a second audio signal; generating third object-based side information by combining first object-based side information extracted from the first audio signal and second object-based side information extracted from the second audio signal; converting the third object-based side information into channel-based side information; and generating a multi-channel audio signal using the third downmix signal and the channel-based side information.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: July 5, 2016
    Assignee: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 9275648
    Abstract: A method of processing an audio signal is disclosed. The present invention includes receiving spectral data corresponding to a first band in a frequency band including the first band and a second band, determining a copy band based on frequency information of the copy band corresponding to a partial band of the first band, and generating spectral data of a target band corresponding to the second band using the spectral data of the copy band, wherein the copy band exists in an upper part of the first band.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: March 1, 2016
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyun Kook Lee, Dong Soo Kim, Sung Yong Yoon, Hee Suk Pang, Jae Hyun Lim
  • Patent number: 9031851
    Abstract: A method of processing a signal is disclosed. The present invention includes receiving a maximum number of band and a code value of at least one section length, calculating a bit number corresponding to the code value of the at least one section length using the maximum number of the band, and obtaining the section length information by decoding the code value of the section length based on the bit number. A method of processing a signal is disclosed. The present invention includes receiving factor information of a current frame, receiving flag information indicating whether a coding mode of the factor information is an absolute value mode or a relative value mode, and obtaining factor data of the current frame using factor data of a previous frame and the received factor information based on the flag information.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: May 12, 2015
    Assignee: LG Electronics Inc.
    Inventors: Sung Yong Yoon, Hee Suk Pang, Dong Soo Kim, Hyun Kook Lee, Jae Hyun Lim
  • Publication number: 20140303985
    Abstract: Provided are an audio encoding method and apparatus and an audio decoding method and apparatus in which audio signals can be encoded or decoded so that sound images can be localized at any desired position for each object audio signal. The audio decoding method generating a third downmix signal by combining a first downmix signal extracted from a first audio signal and a second downmix signal extracted from a second audio signal; generating third object-based side information by combining first object-based side information extracted from the first audio signal and second object-based side information extracted from the second audio signal; converting the third object-based side information into channel-based side information; and generating a multi-channel audio signal using the third downmix signal and the channel-based side information.
    Type: Application
    Filed: June 23, 2014
    Publication date: October 9, 2014
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Publication number: 20140297294
    Abstract: An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal and object-based side information, the downmix signal comprising at least two downmix channel signals; extracting gain information from the object-based side information and generating modification information for modifying the downmix channel signals on a channel-by-channel basis based on the gain information; and modifying the downmix channel signals by applying the modification information to the downmix channel signals.
    Type: Application
    Filed: June 16, 2014
    Publication date: October 2, 2014
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 8831958
    Abstract: An apparatus for processing an audio signal and method thereof are disclosed.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: September 9, 2014
    Assignee: LG Electronics Inc.
    Inventors: Hyun Kook Lee, Dong Soo Kim, Sung Yong Yoon, Hee Suk Pang, Jae Hyun Lim
  • Patent number: 8762157
    Abstract: Provided are an audio encoding method and apparatus and an audio decoding method and apparatus in which audio signals can be encoded or decoded so that sound images can be localized at any desired position for each object audio signal. The audio decoding method generating a third downmix signal by combining a first downmix signal extracted from a first audio signal and a second downmix signal extracted from a second audio signal; generating third object-based side information by combining first object-based side information extracted from the first audio signal and second object-based side information extracted from the second audio signal; converting the third object-based side information into channel-based side information; and generating a multi-channel audio signal using the third downmix signal and the channel-based side information.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: June 24, 2014
    Assignee: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee
  • Patent number: 8756066
    Abstract: An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal and object-based side information, the downmix signal comprising at least two downmix channel signals; extracting gain information from the object-based side information and generating modification information for modifying the downmix channel signals on a channel-by-channel basis based on the gain information; and modifying the downmix channel signals by applying the modification information to the downmix channel signals.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: June 17, 2014
    Assignee: LG Electronics Inc.
    Inventors: Dong Soo Kim, Hee Suk Pang, Jae Hyun Lim, Sung Yong Yoon, Hyun Kook Lee