Abstract: A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Abstract: A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Abstract: Disclosed herein is a device and method for automatically controlling continuous auto focus. The device includes a lens unit installed in a camera module, and configured to receive images of an external subject; a lens actuation unit for moving the lens unit along an optical axis so as to focus on a subject; an image sensor for receiving the external images, converting the external images into image signals, and outputting the image signals; a computation unit for detecting focus values and feature parameters; a mode determination unit for automatically performing switching between general mode, specific mode and tracking mode, setting the mode, and automatically setting a fixed or variable window according to the set mode using the detected feature parameters; and a lens control unit for generating a control signal for controlling the lens actuation unit so as to perform continuous auto focus according to the detected focus values.

Abstract: A camera module package comprises an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section; an FPCB that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing.

Abstract: An apparatus for correcting motion caused by hand shake performs hand shake correction in due consideration of both linear motion and rotation by detecting linear motion of a capturing device by comparing preceding and subsequent image frames and detecting rotation of the capturing device using a gyro sensor. The apparatus for correcting motion caused by hand shake may include a rotation detection unit detecting the amount of rotation of a capturing device by using a gyro sensor, a linear-motion detection unit comparing preceding and subsequent image frames generated by an image sensor unit to detect the amount of linear motion of the capturing device, and an output image determination unit correcting the detected amount of rotation and the detected amount of linear motion in an image frame input from the image sensor to generate a corrected output image frame.

Abstract: A camera module package comprises an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section; an FPCB that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing.