Abstract: Provided in one embodiment of the present invention is a difluorophosphate preparation method comprising the steps of: injecting, into a reactor, a phosphorus compound, a nonaqueous solvent, and an alkali metal salt, which is a phosphate, borate, oxide or hydroxide of an alkali metal, thereby generating dichlorophosphate; injecting an ammonium-containing fluorinating agent into the dichlorophosphate, thereby preparing a reaction product; and removing impurities from the reaction product and obtaining difluorophosphate.

Abstract: A display device includes a sensor layer including an active area and a non-active area at least partially surrounding the active area. A first sensor electrode is disposed in the active area of the sensor layer. A first wire is disposed in the non-active area of the sensor layer. The first wire includes a first wiring portion electrically connected to the first sensor electrode, having at least a part thereof extending in a first direction, and including at least two wiring layers, and a second wiring portion electrically connected to the first wiring portion, extending in a second direction crossing the first direction, and including a single wiring layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

Abstract: The imprinting device according to a representative embodiment includes: a stamp holder configured such that a stamp is mounted thereon; a substrate holder arranged in a first direction with respect to the stamp holder and configured such that a substrate is mounted thereon; an ultraviolet emitter configured to emit ultraviolet rays toward the substrate mounted on the substrate holder; and a pressing module configured to move at least one of the substrate holder or the stamp holder such that the substrate holder and the stamp mounted on the stamp holder come into contact with each other, wherein the imprinting device is configured to allow the stamp to be mounted on the stamp holder in a state in which the substrate holder and the stamp holder are spaced apart from each other by a predetermined distance or more.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

Abstract: An embodiment mounting and demounting device for a wireless electronic device includes a pair of holder wings arranged symmetrically to each other and configured to press both sides of the wireless electronic device, a holder wing adjusting device configured to apply a force to adjust a gap between the holder wings using a driving force of a drive motor, a lifting implementing device configured to interlock with the holder wing adjusting device to lift the wireless electronic device upward in a case in which the holder wings are spread apart by a predetermined reference gap or more, a lower housing wrapped around a lower side of the holder wings, the holder wing adjusting device, and the lifting implementing device, and an upper housing coupled to an upper side of the lower housing and configured to allow the wireless electronic device to pass through in an up and down direction.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.