Patents by Inventor Hyung-Woo Kim

Hyung-Woo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240080320
    Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
  • Patent number: 11919073
    Abstract: An apparatus and method for manufacturing iron-based mixed powder with excellent flowability is provided. The apparatus includes a hopper which stores and discharges a main raw material of iron-based powder, a transport means which transports the main raw material of iron-based powder discharged from the hopper, a magnetizing means that applies magnetic force to the main raw material transported and falling from the transport means to process the main raw material of iron-based powder into a main raw material bundle in a crumbly type in which the main raw material of iron-based powder is agglomerated with each other, a first mixer in which the main raw material bundle in a magnetized state and an auxiliary raw material of iron-based powder are loaded and mixed while being rotated and transported, and a second mixer in which a first iron-based mixed powder is mixed while being rotated and transported.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: March 5, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Hyung Seok Kwak, Jin Woo Kim, Joon Chul Yun, Hyun Gon Lyu
  • Patent number: 11915449
    Abstract: The present invention relates to a method and an apparatus for estimating a user pose using a three-dimensional virtual space model. The method of estimating a user pose including the position and orientation information of a user for a three-dimensional space includes a step of receiving user information including an image acquired in a three-dimensional space, a step of confirming a three-dimensional virtual space model constructed based on spatial information including depth information and image information for the three-dimensional space, a step of generating corresponding information corresponding to the user information in the three-dimensional virtual space model, a step of calculating similarity between the corresponding information and the user information, and a step of estimating a user pose based on the similarity.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: February 27, 2024
    Assignee: Korea University Research and Business Foundation
    Inventors: Nak Ju Doh, Ga Hyeon Lim, Jang Hun Hyeon, Dong Woo Kim, Bum Chul Jang, Hyung A Choi
  • Publication number: 20230368696
    Abstract: The present disclosure relates to a coding test device and a coding test method. The coding test device according to one embodiment includes a problem provider for providing a test problem including an initial condition to a user terminal, a code receiver for receiving first algorithm code corresponding to the initial condition from the user terminal, and an additional condition provider for determining whether a predetermined passing condition for the first algorithm code is satisfied and providing an additional condition related to the initial condition to the user terminal based on the result of determination for the first algorithm code.
    Type: Application
    Filed: May 2, 2023
    Publication date: November 16, 2023
    Applicant: JA-IN Lab. Co., Ltd
    Inventors: Hyung Woo LEE, Dae Seok SHIN, Dae Sung JANG, Seong In KIM, Hyung Woo KIM, Byoung Ho LEE, Hyeon Ho LEE, Hoo Min LEE
  • Publication number: 20230263601
    Abstract: Disclosed is a dental implant abutment having a function of buffering occlusal force transmitted through a prosthesis and configured to be elastically coupled to the prosthesis without using an adhesive. A prosthesis fastening protrusion protrudes outward from an outer surface of an upper portion thereof on which a prosthesis is mounted. The diameter of the prosthesis fastening protrusion being greater than the diameter of a portion located directly therebelow. Indentations divide the upper portion of the abutment into a plurality of sections. The indentations continuously extend downward a predetermined length from a top end surface of the abutment. A predetermined lengthwise portion of each of the indentations has a spiral or oblique shape.
    Type: Application
    Filed: October 14, 2021
    Publication date: August 24, 2023
    Inventor: Hyung Woo KIM
  • Publication number: 20230263602
    Abstract: The present invention relates generally to a denture attachment. More particularly, the present invention relates to a denture attachment, wherein a user can detachably fasten a first fastening part coupled to a denture to a second fastening part placed on top of a natural tooth's root or implant fixture by a simple operation, and furthermore, even when occlusal force is continuously applied to the denture, the applied force can be buffered by an elastic rib structure of the attachment itself. Consequently, it is possible to extend not only lifespan of the attachment, but also lifespan of the implant fixture or natural tooth's root, and to provide superior performance with a significantly smaller volume than existing attachments, while providing excellent durability.
    Type: Application
    Filed: November 4, 2021
    Publication date: August 24, 2023
    Inventor: Hyung Woo KIM
  • Publication number: 20230248478
    Abstract: Proposed is a dental implant abutment having a function of buffering occlusal force transmitted through a prosthesis and configured to be elastically coupled to the prosthesis without using an adhesive. A prosthesis fastening protrusion protrudes outward from an outer surface of an upper portion thereof on which a prosthesis is mounted. The diameter of the prosthesis fastening protrusion being greater than the diameter of a portion located directly therebelow. Indentations divide the upper portion of the abutment into a plurality of sections. The indentations continuously extend downward a predetermined length from a top end surface of the abutment. A predetermined lengthwise portion of each of the indentations has a spiral or oblique shape.
    Type: Application
    Filed: December 30, 2020
    Publication date: August 10, 2023
    Inventor: Hyung Woo KIM
  • Patent number: 11638632
    Abstract: The present invention provides a dental implant including: a fixture and an abutment including a coupling leg, and the fixture and the abutment are elastically coupled with each other, the dental implant including: a fixture axial hole inner inclined surface in which an inner diameter of an axial hole is gradually and downwardly reduced from a predetermined position of an inner inclined surface of the fixture; a first coupling part formed with a coupling hole at a predetermined position of the fixture; and a first associated coupling part formed with a coupling protrusion complementarily coupled with the first coupling part, wherein when the first associated coupling part is separated from the first coupling part by rotating the abutment, the coupling protrusion upwardly pushes the abutment from the fixture by elastic repulsion with the axial hole inner inclined surface of the fixture, thus the abutment becomes separated from the fixture.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: May 2, 2023
    Assignee: DENFLEX CO., LTD
    Inventors: Hyung Woo Kim, Gyun Hwan Kim
  • Patent number: 11628045
    Abstract: Provided is a torque wrench for an implant procedure including: a first body having a predetermined length, and including a head portion having an end to which a torque wrench driver bit is coupled; at least one second body having a predetermined length, provided at one side of the first body, and including a coupling portion formed in a longitudinal direction thereof; and a second shaft rotatably coupled to the coupling portion of the second body, including a second gear provided at one end thereof and a knob provided at the other end thereof, and configured such that, in response to rotation of the knob, the second shaft transmits torque to the torque wrench driver bit through the first gear engaged with the second gear.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 18, 2023
    Inventor: Hyung-Woo Kim
  • Publication number: 20230113422
    Abstract: A method of identifying user information in a transaction and an apparatus for performing the method of identifying user information in a transaction can include transmitting, by an originator virtual asset service provider (O-VASP), a first user confirmation transaction to a beneficiary virtual asset service provider (B-VASP) based on remittance information, receiving, by the O-VASP, a second user confirmation transaction from the B-VASP; and transmitting, by the O-VASP, virtual transaction assets generated based on the remittance information to a beneficiary wallet.
    Type: Application
    Filed: February 23, 2021
    Publication date: April 13, 2023
    Inventors: Hyung Woo KIM, Baek Soo KIM, Jong Ho KIM
  • Patent number: 11532181
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a microphone, a camera, an output device, a memory, and a processor. The processor implements the method, including receiving a voice input and/or capturing an image, and analyze the first voice input or the image to determine at least one of a user's intent, emotion, and situation based on predefined keywords and expressions, identifying a category based on the input, selecting first information based on the category, selecting and outputting a first query prompting confirmation of output of the first information, detect a first responsive input to the first query, and when a condition to output the first information is satisfied, output a second query, detecting a second input responsive to the second query, and selectively outputting the first information based on the second input.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 20, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Ju Yu, Ja Min Goo, Seong Hoon You, Ki Young Kwon, Ki Won Kim, Eun Young Kim, Ji Min Kim, Chul Kwi Kim, Hyung Woo Kim, Joo Namkung, Ji Hyun Park, Sae Gee Oh, Dong Kyu Lee, Im Sung Lee, Chan Won Lee, Si Hak Jang
  • Publication number: 20220101326
    Abstract: An apparatus and a method for cybersecurity, the apparatus comprising a processor being configured to execute instructions in a memory to control the apparatus to receive an input for a subject address in a target blockchain system and to obtain a list of addresses involved in a predefined number of hops of transactions upstream and/or downstream of the subject address in the target blockchain system. Suspicious transaction behaviour of addresses in the obtained list of addresses upstream and/or downstream of the subject address are identified by the apparatus. A risk score indicative of degree of cybersecurity threat for the subject address taking into consideration the suspicious transaction behaviour is then calculated.
    Type: Application
    Filed: December 31, 2019
    Publication date: March 31, 2022
    Applicant: UPPSALA PTE. LTD.
    Inventors: Hyung Woo KIM, Cheong Leng TAN, Chek Chuan Narong Chong, Jia Hao Donovan TAN, Athul Harilal, Kar Wing YEUNG
  • Patent number: 11165728
    Abstract: Various embodiments of the present disclosure relate to an electronic device and a method for delivering a message by the same.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: November 2, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Im-Sung Lee, Ki-Won Kim, Sae Gee Oh, Ja-Min Goo, Kiyoung Kwon, Eun-Young Kim, Jimin Kim, Chulkwi Kim, Hyung-Woo Kim, Joo Namkung, Ji-Hyun Park, Seong-Hoon You, Yong-Ju Yu, Dongkyu Lee, Chanwon Lee, Si-Hak Jang
  • Patent number: 11158574
    Abstract: One illustrative device disclosed herein includes a layer of insulating material with its upper surface positioned at a first level and a recessed conductive interconnect structure positioned at least partially within the layer of insulating material, wherein a recessed upper surface of the recessed conductive interconnect structure is positioned at a second level that is below the first level. In this example, the device also includes a conductive cap layer positioned on the recessed upper surface of the recessed conductive interconnect structure, wherein an upper surface of the conductive cap layer is substantially co-planar with the upper surface of the layer of insulating material and a memory cell positioned above the conductive cap layer, wherein the memory cell comprises a lower conductive material that is conductively coupled to the conductive cap layer.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: October 26, 2021
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Nicholas LiCausi, Julien Frougier, Keith Donegan, Hyung Woo Kim
  • Patent number: 11121087
    Abstract: One illustrative device disclosed herein includes a layer of insulating material having an upper surface positioned at a first level and a recessed conductive interconnect structure positioned at least partially within the layer of insulating material, wherein the recessed conductive interconnect structure has a recessed upper surface that is positioned at a second level that is below the first level. In this example, the device also includes a recess defined in the recessed conductive interconnect structure, a memory cell positioned above the recessed conductive interconnect structure and a conductive via plug that is conductively coupled to the recessed conductive interconnect structure and a lower conductive material of the memory cell, wherein at least a portion of the conductive via plug is positioned in the recess defined in the recessed conductive interconnect.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: September 14, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Nicholas LiCausi, Julien Frougier, Keith Donegan, Hyung Woo Kim
  • Patent number: 11107467
    Abstract: An electronic device includes an audio input module, a memory storing a speech recognition application, a first application, and a second application, a communication circuit communicating with a first NLU server associated with the first application and a second NLU server associated with the second application, and a processor electrically connected to the audio input module, the memory, and the communication circuit and executing the speech recognition application.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Kyu Lee, Ja Min Goo, Hyung Woo Kim, Seung Hyuk Yu, Jin Hong Jeong, Ji Hyun Park, Kyung Hee Lee, Ju Yeong Lee
  • Publication number: 20210193573
    Abstract: One illustrative device disclosed herein includes a layer of insulating material with its upper surface positioned at a first level and a recessed conductive interconnect structure positioned at least partially within the layer of insulating material, wherein a recessed upper surface of the recessed conductive interconnect structure is positioned at a second level that is below the first level. In this example, the device also includes a conductive cap layer positioned on the recessed upper surface of the recessed conductive interconnect structure, wherein an upper surface of the conductive cap layer is substantially co-planar with the upper surface of the layer of insulating material and a memory cell positioned above the conductive cap layer, wherein the memory cell comprises a lower conductive material that is conductively coupled to the conductive cap layer.
    Type: Application
    Filed: December 24, 2019
    Publication date: June 24, 2021
    Inventors: Nicholas LiCausi, Julien Frougier, Keith Donegan, Hyung Woo Kim
  • Publication number: 20210193584
    Abstract: One illustrative device disclosed herein includes a layer of insulating material having an upper surface positioned at a first level and a recessed conductive interconnect structure positioned at least partially within the layer of insulating material, wherein the recessed conductive interconnect structure has a recessed upper surface that is positioned at a second level that is below the first level. In this example, the device also includes a recess defined in the recessed conductive interconnect structure, a memory cell positioned above the recessed conductive interconnect structure and a conductive via plug that is conductively coupled to the recessed conductive interconnect structure and a lower conductive material of the memory cell, wherein at least a portion of the conductive via plug is positioned in the recess defined in the recessed conductive interconnect.
    Type: Application
    Filed: December 24, 2019
    Publication date: June 24, 2021
    Inventors: Nicholas LiCausi, Julien Frougier, Keith Donegan, Hyung Woo Kim
  • Patent number: 11012814
    Abstract: A movable electronic device includes at least one camera module, a driving module configured to support movement on a specified path of the electronic device, and a processor electrically connected to the camera module and the driving module. The processor is configured to control the electronic device to perform capture while moving on a specified first path and to set the first path to a second path based on state information about at least one Internet of Things (IoT) device obtained based on a capture image on the first path.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: May 18, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung Woo Kim, Ja Min Goo, Ji Hyun Park, Seung Hyuk Yu, Dong Kyu Lee, Jin Hong Jeong, Kyung Hee Lee, Ju Yeong Lee
  • Patent number: D975852
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: January 17, 2023
    Inventor: Hyung Woo Kim