Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Abstract: A method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.

Abstract: A semiconductor package including a buffer structure including a first redistribution layer, a first buffer chip on the first redistribution layer, a second redistribution layer on the first buffer chip, and a first molding layer filling between the first redistribution layer and the second redistribution layer, and a first chip stack and a first semiconductor chip on the buffer structure and spaced apart from each other, wherein the first buffer chip overlaps at least a portion of the first semiconductor chip in a first direction from the buffer structure toward the first semiconductor chip, may be provided.

Abstract: The present embodiment may provide a touch sensing circuit including: an analog signal processing circuit including one or more adjustable filters configured to receive a touch sensing signal from a touch electrode of a panel and to transmit some of a frequency region of the touch sensing signal; and a touch control circuit configured to determine a change in capacitance of the touch electrode attributable to an object approaching the panel and to transmit a controlling signal to control the adjustable filters of the analog signal processing circuit. The adjustable filter of the present embodiment may include a variable resistor or a variable capacitor. A resistance value or capacitance value of the adjustable filter may be changed in response to the controlling signal, thus changing a frequency pass band of the touch sensing signal.

Abstract: The present disclosure provides a touch sensing circuit comprising an analog signal processing circuit configured to receive a plurality of sensing signals having different frequencies from touch electrodes; and a digital signal processing circuit configured to receive output data of the analog signal processing circuit and perform a discrete Fourier transform. In addition, the present disclosure provides a touch sensing circuit comprising the digital signal processing circuit of the touch sensing circuit that separates the plurality of sensing signals through the discrete Fourier transform and allowing a simultaneous sensing of a finger touch and a stylus pen touch.

Abstract: A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first region of the chip body spaced apart from the chip pad and connected to the chip pad through a redistribution wiring structure, and a redistribution wiring connection pad disposed in the first region of the chip body or a second region of the chip body and connected to the chip pad through the redistribution wiring structure.

Abstract: The present disclosure relates to a touch circuit and a touch sensing method. A touch circuit may include a driving circuit configured to transmit a driving signal to a touch electrode, a sensing circuit configured to sense a change in capacitance generated in the touch electrode, and a touch control circuit configured to control a polarity of the driving signal transmitted by the driving circuit. The polarity of the driving signal controlled by the touch control circuit may be determined based on a location of the touch electrode. Touch sensitivity can be improved by differently controlling a polarity of a driving signal transmitted to an adjacent touch electrode.

Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Abstract: The present embodiment may provide a touch sensing circuit including: an analog signal processing circuit including one or more adjustable filters configured to receive a touch sensing signal from a touch electrode of a panel and to transmit some of a frequency region of the touch sensing signal; and a touch control circuit configured to determine a change in capacitance of the touch electrode attributable to an object approaching the panel and to transmit a controlling signal to control the adjustable filters of the analog signal processing circuit. The adjustable filter of the present embodiment may include a variable resistor or a variable capacitor. A resistance value or capacitance value of the adjustable filter may be changed in response to the controlling signal, thus changing a frequency pass band of the touch sensing signal.

Abstract: The present disclosure relates to a touch circuit and a touch sensing method. A touch circuit may include a driving circuit configured to transmit a driving signal to a touch electrode, a sensing circuit configured to sense a change in capacitance generated in the touch electrode, and a touch control circuit configured to control a polarity of the driving signal transmitted by the driving circuit. The polarity of the driving signal controlled by the touch control circuit may be determined based on a location of the touch electrode. Touch sensitivity can be improved by differently controlling a polarity of a driving signal transmitted to an adjacent touch electrode.

Abstract: The present disclosure provides a touch sensing circuit comprising an analog signal processing circuit configured to receive a plurality of sensing signals having different frequencies from touch electrodes; and a digital signal processing circuit configured to receive output data of the analog signal processing circuit and perform a discrete Fourier transform. In addition, the present disclosure provides a touch sensing circuit comprising the digital signal processing circuit of the touch sensing circuit that separates the plurality of sensing signals through the discrete Fourier transform and allowing a simultaneous sensing of a finger touch and a stylus pen touch.

Abstract: The present disclosure provides a technology for mitigating retransmission in a low ground mass (LGM) state and improving the touch sensitivity by not driving two adjacent sensor electrodes simultaneously.

Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Abstract: A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first region of the chip body spaced apart from the chip pad and connected to the chip pad through a redistribution wiring structure, and a redistribution wiring connection pad disposed in the first region of the chip body or a second region of the chip body and connected to the chip pad through the redistribution wiring structure.

Abstract: A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first region of the chip body spaced apart from the chip pad and connected to the chip pad through a redistribution wiring structure, and a redistribution wiring connection pad disposed in the first region of the chip body or a second region of the chip body and connected to the chip pad through the redistribution wiring structure.

Abstract: The present disclosure provides a technology for mitigating retransmission in a low ground mass (LGM) state and improving the touch sensitivity by not driving two adjacent sensor electrodes simultaneously.

Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

Abstract: Disclosed is a touch sensing device for preventing touch sensing performance from being reduced by a parasitic capacitance. The touch sensing device includes a plurality of buffers buffering a difference between a reference signal and a reception signal received from a touch electrode through a touch sensing line and generating first and second currents corresponding to a buffered signal, a plurality of current mirror unit respectively connected to the plurality of buffers, a plurality of filter circuits generating a first filter signal and a second filter signal by removing common noise included in a first output signal output from an nth current mirror unit of the plurality of current mirror units and a second output signal output from an (n?1)th current mirror unit of the plurality of current mirror units, and a plurality of integrators respectively connected to the plurality of filter circuits.

Abstract: A touch sensing device of a current driving type, which separately drives a parasitic capacitor by using an electric charge controller, includes a parasitic capacitance charger connected to a touch sensing line to charge a parasitic capacitor of a touch electrode connected to the touch sensing line with a predetermined charging current during a charging period and a sensing unit connected to the touch sensing line during a first driving period to drive a capacitor of the touch electrode with a first driving current corresponding to a difference voltage between a first voltage, charged into the parasitic capacitor when a touch does not occur, and a second voltage charged into the parasitic capacitor when a touch occurs and to sense a first touch voltage of the capacitor based on the first driving current during a first sensing period.