Patents by Inventor I-Chien Huang

I-Chien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 11132031
    Abstract: An electronic device including a first body, a second body, a hinge structure, an electronic assembly and a linkage mechanism is provided. The first body and the second body are pivoted to each other through the hinge structure. The electronic assembly is disposed on the first body. The linkage mechanism is disposed in the first body and connected between the hinge structure and the electronic assembly. When the second body is closed to the first body, the electronic assembly is hidden between the first body and the second body. When the second body is opened relative to the first body with an opening angle less than a predetermined angle, the hinge structure does not drive the linkage mechanism. When the second body is opened relative to the first body with the opening angle not less than the predetermined angle, the hinge structure drives the linkage mechanism and the linkage mechanism drives the electronic assembly to be opened relative to the first body.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: September 28, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Ko-Yen Lu, Chun-Chieh Chen, Chen-Ming Lee, Yi-Hung Chen, I-Chien Huang
  • ELECTRONIC DEVICE
    Publication number: 20210011525
    Abstract: An electronic device including a first body, a second body, a hinge structure, an electronic assembly and a linkage mechanism is provided. The first body and the second body are pivoted to each other through the hinge structure. The electronic assembly is disposed on the first body. The linkage mechanism is disposed in the first body and connected between the hinge structure and the electronic assembly. When the second body is closed to the first body, the electronic assembly is hidden between the first body and the second body. When the second body is opened relative to the first body with an opening angle less than a predetermined angle, the hinge structure does not drive the linkage mechanism. When the second body is opened relative to the first body with the opening angle not less than the predetermined angle, the hinge structure drives the linkage mechanism and the linkage mechanism drives the electronic assembly to be opened relative to the first body.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Ko-Yen Lu, Chun-Chieh Chen, Chen-Ming Lee, Yi-Hung Chen, I-Chien Huang