Abstract: A pixel structure includes a pixel electrode, a data selection line and an isolation line. The isolation line is disposed along the pixel electrode. The pixel electrode is configured to store a pixel voltage. The data selection line is configured to transmit a data signal. The isolation line is configured to reduce an influence of an electric field of the data signal on the pixel voltage of the pixel electrode. A projection area of the isolation line is overlapped with a projection area of the pixel electrode.

Abstract: A display device includes a cover plate, a display, a frame, a flexible circuit board and a water-proof glue. The display is disposed on the cover plate. The frame is disposed on a periphery area of the cover plate and surrounds the display to form a trench. The flexible circuit board includes a first portion and a second portion. The first portion is attached to the front surface of the active array substrate, and the second portion is fastened to the cover plate in the trench. The water-proof glue fills the trench.

Abstract: A display panel includes a substrate, a plurality of first signal lines, a plurality of second signal lines, a plurality of pixel units, a plurality of transmitting lines, and a driving chip. The transmitting lines are disposed on the substrate and electrically connected to the second signal lines. The driving chip includes a plurality of first pins, a plurality of second pins, and a driving circuit. The first pins are electrically connected to the first signal lines, and the second pins are electrically connected to the transmitting lines. The first pins and the second pins are disposed alternately and evenly, such that the first signal lines and the transmitting lines do not intersect each other. The transmitting lines are disposed on the substrate evenly.

Abstract: An electronic-ink display device includes a cover plate, an electronic-ink display, a frame, and a water-proof glue. The electronic-ink display is disposed on the cover plate. The frame is disposed on a periphery area of the cover plate and surrounds the electronic-ink display to form a trench. Then, the water-proof glue fills the trench.

Abstract: A display is disclosed. The display includes a display panel including pixel units in an image-displaying region. Each of the pixel units includes an AND gate and a pixel electrode electrically connected to an output terminal of the AND gate.

Abstract: An electronic paper display apparatus including a display driving unit, an electronic paper display panel and a detection circuit unit is provided. The display driving unit generates at least one driving signal. The electronic paper display panel is coupled to the display driving unit. The display driving unit drives the electronic paper display panel to display an image by the at least one driving signal, and the electronic paper display panel outputs the at least one driving signal. The detection circuit unit is coupled to the electronic paper display panel to receive the at least one driving signal outputted by the electronic paper display panel, and detect a display status of the electronic paper display panel according to the at least one driving signal. Besides, a detection method of an electronic paper display apparatus is also provided.

Abstract: An electronic-ink display device includes a cover plate, an electronic-ink display, a frame, and a water-proof glue. The electronic-ink display is disposed on the cover plate. The frame is disposed on a periphery area of the cover plate and surrounds the electronic-ink display to form a trench. Then, the water-proof glue fills the trench.

Abstract: A display panel includes a substrate, a plurality of first signal lines, a plurality of second signal lines, a plurality of pixel units, a plurality of transmitting lines, and a driving chip. The transmitting lines are disposed on the substrate and electrically connected to the second signal lines. The driving chip includes a plurality of first pins, a plurality of second pins, and a driving circuit. The first pins are electrically connected to the first signal lines, and the second pins are electrically connected to the transmitting lines. The first pins and the second pins are disposed alternately and evenly, such that the first signal lines and the transmitting lines do not intersect each other. The transmitting lines are disposed on the substrate evenly.

Abstract: A display is disclosed. The display includes a display panel including pixel units in an image-displaying region. Each of the pixel units includes an AND gate and a pixel electrode electrically connected to an output terminal of the AND gate.

Abstract: A display panel includes a substrate, a plurality of first signal lines, a plurality of second signal lines, a plurality of pixel units, a plurality of transmitting lines, and a driving chip. The transmitting lines are disposed on the substrate and electrically connected to the second signal lines. The driving chip includes a plurality of first pins, a plurality of second pins, and a driving circuit. The first pins are electrically connected to the first signal lines, and the second pins are electrically connected to the transmitting lines. The first pins and the second pins are disposed alternately and evenly, such that the first signal lines and the transmitting lines do not intersect each other. The transmitting lines are disposed on the substrate evenly.

Abstract: A system and method for forming and heat treating metal castings is provided with a vertical heat treatment unit positioned adjacent and downstream from a pouring station at which a series of molds are filled with a molten metal to form the castings. The vertical heat treatment unit includes a vertically oriented furnace chamber in which the castings are received, and which has a reduced footprint to reduce the manufacturing floor space required for the vertical heat treatment unit, and to enable the vertical heat treatment unit to be positioned in close proximity to the pouring station.

Abstract: A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.

Abstract: An image scanning apparatus includes a housing. A first image sensor (linear scan imager) is attached at a first position along the housing. The first image sensor is configured and adapted to scan an image. A second image sensor (area scan imager) is attached at a second position along the housing. The second image sensor is configured and adapted to scan an image to detect movement of the apparatus in the X and Y axis. Movement in the Y axis of the apparatus as detected by the second image sensor is utilized to trigger the first image sensor. Movement in the X axis of the apparatus as detected by the second image sensor is utilized to correct image defects (e.g. skew) of the image captured by the first image sensor thereby allowing the second image sensor to capture a 2D inspection area.

Abstract: A furnace for heat treating a metal workpiece is provided. A method and system for processing a workpiece also are provided.

Abstract: A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.

Abstract: A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44) over the first plastic coating. A second plastic coating (46) is applied over the thin film electronic elements with electrodes (47) on top, with a portion lying directly over the associated electronic element, spaced by the second plastic coating. The rigid carrier substrate (40) is released from the first plastic coating, by a laser release process. This method enables traditional materials to be used as the base for the electronic element manufacture, for example thin film transistors. The second plastic coating can form part of the known field shielded pixel (FSP) technology.

Abstract: A photodiode (200), for instance a PN or a PIN photodiode, is disclosed. The photodiode receives incident radiation having first and second spectral distributions, where the first spectral distribution is spectrally shifted from the second spectral distribution. The photodiode has a first semiconductor layer (211) capable of absorbing incident radiation (231) having a first spectral distribution without generating a photocurrent, while simultaneously transmitting incident radiation having a second spectral distribution to the intrinsic layer (212) for generating a photocurrent (213). The photodiode may be used in connection with detecting the presence of target molecules that has been labeled with labeling agents, such as fluorophores or quantum dots. The labeling agents are characterized by the Stokes shift and, therefore, they emit fluorescent radiation having the second spectral distribution that is spectrally shifted from the illumination radiation having the first spectral distribution.

Abstract: A furnace for heat treating a metal workpiece is provided. A method and system for processing a workpiece also are provided.

Abstract: Disclosed is a method for dislodging a mold from a casting formed within the mold. The mold may be removed from the casting by scoring the mold and applying a force sufficient to cause the mold to fracture and break into pieces. Additionally, the mold may be fractured by either explosive charges placed in the mold pack or by high energy pulsations directed at the mold. Once the mold is fractured and broken into various pieces it may then be dislodged from the casting.

Abstract: A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44) over the first plastic coating. A second plastic coating (46) is applied over the thin film electronic elements with electrodes (47) on top, with a portion lying directly over the associated electronic element, spaced by the second plastic coating. The rigid carrier substrate (40) is released from the first plastic coating, by a laser release process. This method enables traditional materials to be used as the base for the electronic element manufacture, for example thin film transistors. The second plastic coating can form part of the known field shielded pixel (FSP) technology.