Patents by Inventor Ibrahim A Alhomoudi
Ibrahim A Alhomoudi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10732031Abstract: The invention provides an illumination measuring module which includes a housing and a photo detector. The housing is molded with a plurality of surfaces. Each surface of the housing is affixed with respective side edges of the plurality of the surfaces to form a predetermined shape. Each surface includes an external surface and an inner surface. One surface of the plurality of surfaces is a glass surface. The glass surface transmits illumination collected from an external ambience of the housing to one or more inner surfaces corresponding to the plurality of surfaces. On an inner surface of the glass surface, a plane white sheet is positioned which homogenously scatters illumination collected from the external ambience into the one or more inner surfaces in the housing. The photo detector measures scattered illumination diffused from the one or more inner surfaces corresponding to the plurality of surfaces.Type: GrantFiled: December 2, 2015Date of Patent: August 4, 2020Assignee: KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGYInventors: Mohammed I Alhussaini, Mohammed A Bahattab, Mark Mirza, Walther Glaubitt, Ibrahim A Alhomoudi
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Patent number: 10026618Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: GrantFiled: February 2, 2017Date of Patent: July 17, 2018Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGYInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Publication number: 20170160128Abstract: The invention provides an illumination measuring module which includes a housing and a photo detector. The housing is molded with a plurality of surfaces. Each surface of the housing is affixed with respective side edges of the plurality of the surfaces to form a predetermined shape. Each surface includes an external surface and an inner surface. One surface of the plurality of surfaces is a glass surface. The glass surface transmits illumination collected from an external ambience of the housing to one or more inner surfaces corresponding to the plurality of surfaces. On an inner surface of the glass surface, a plane white sheet is positioned which homogenously scatters illumination collected from the external ambience into the one or more inner surfaces in the housing. The photo detector measures scattered illumination diffused from the one or more inner surfaces corresponding to the plurality of surfaces.Type: ApplicationFiled: December 2, 2015Publication date: June 8, 2017Applicants: King Abdulaziz City for Science and Technology, Fraunhofer Institute for Silicate Research ISCInventors: Mohammed I Alhussaini, Mohammed A Bahattab, Mark Mirza, Walther Glaubitt, Ibrahim A Alhomoudi
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Publication number: 20170148635Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Patent number: 9564335Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: GrantFiled: February 17, 2016Date of Patent: February 7, 2017Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGYInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Publication number: 20160163553Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: ApplicationFiled: February 17, 2016Publication date: June 9, 2016Inventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Patent number: 9324564Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.Type: GrantFiled: July 13, 2015Date of Patent: April 26, 2016Assignees: International Business Machines Corporation, KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGYInventors: Ibrahim Alhomoudi, Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa, Ning Li
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Patent number: 9275867Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: GrantFiled: December 11, 2014Date of Patent: March 1, 2016Assignees: International Business Machines Corporation, King Abdulaziz City for Science and TechnologyInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Publication number: 20150325443Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.Type: ApplicationFiled: July 13, 2015Publication date: November 12, 2015Inventors: Ibrahim Alhomoudi, Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa, Ning Li
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Patent number: 9079269Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.Type: GrantFiled: November 22, 2011Date of Patent: July 14, 2015Assignee: International Business Machines CorporationInventors: Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa Cortes, Ning Li, Ibrahim Alhomoudi
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Publication number: 20150140830Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: ApplicationFiled: December 11, 2014Publication date: May 21, 2015Inventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Patent number: 8916450Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: GrantFiled: August 2, 2012Date of Patent: December 23, 2014Assignees: International Business Machines Corporation, King Abdulaziz City for Science and TechnologyInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Patent number: 8709957Abstract: A method for spalling local areas of a base substrate utilizing at least one stressor layer portion which is located on a portion, but not all, of an uppermost surface of a base substrate. The method includes providing a base substrate having a uniform thickness and a planar uppermost surface spanning across an entirety of the base substrate. At least one stressor layer portion having a shape is formed on at least a portion, but not all, of the uppermost surface of the base substrate. Spalling is performed which removes a material layer portion from the base substrate and provides a remaining base substrate portion. The material layer portion has the shape of the at least one stressor layer portion, while the remaining base substrate portion has at least one opening located therein which correlates to the shape of the at least one stressor layer.Type: GrantFiled: May 25, 2012Date of Patent: April 29, 2014Assignee: International Business Machines CorporationInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Ibrahim Alhomoudi
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Publication number: 20140034699Abstract: Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.Type: ApplicationFiled: August 2, 2012Publication date: February 6, 2014Applicants: KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Katherine L. Saenger, Ibrahim Alhomoudi
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Publication number: 20130316542Abstract: A method for spalling local areas of a base substrate utilizing at least one stressor layer portion which is located on a portion, but not all, of an uppermost surface of a base substrate. The method includes providing a base substrate having a uniform thickness and a planar uppermost surface spanning across an entirety of the base substrate. At least one stressor layer portion having a shape is formed on at least a portion, but not all, of the uppermost surface of the base substrate. Spalling is performed which removes a material layer portion from the base substrate and provides a remaining base substrate portion. The material layer portion has the shape of the at least one stressor layer portion, while the remaining base substrate portion has at least one opening located therein which correlates to the shape of the at least one stressor layer.Type: ApplicationFiled: May 25, 2012Publication date: November 28, 2013Applicants: KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Ibrahim Alhomoudi
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Publication number: 20130126493Abstract: Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.Type: ApplicationFiled: November 22, 2011Publication date: May 23, 2013Applicants: King Abdulaziz City for Science and Technology, International Business Machines CorporationInventors: Stephen W. Bedell, Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa Cortes, Ning Li, Ibrahim Alhomoudi
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Publication number: 20130082357Abstract: A base layer of a semiconductor material is formed with a naturally textured surface. The base layer may be incorporated within a photovoltaic structure. A controlled spalling technique, in which substrate fracture is propagated in a selected direction to cause the formation of facets, is employed. Spalling in the [110] directions of a (001) silicon substrate results in the formation of such facets of the resulting base layer, providing a natural surface texture.Type: ApplicationFiled: October 4, 2011Publication date: April 4, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ibrahim Alhomoudi, Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Ning Li, Devendra K. Sadana, Davood Shahrjerdi
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Publication number: 20100043881Abstract: A method for producing a thin film titanium dioxide is disclosed. The disclosed method for producing the thin film titanium dioxide includes performing a magnetron reactive sputtering process to vaporize at least portions of a titanium source in a sputtering chamber that is supplied with gaseous oxygen. The vaporized titanium reacts with the oxygen to form anatase titanium dioxide, which is deposited on a substrate within the sputtering chamber.Type: ApplicationFiled: November 5, 2009Publication date: February 25, 2010Applicant: WAYNE STATE UNIVERSITYInventors: Ibrahim Abdullah Ibrahim AlHomoudi, Golam Newaz, Gregory W. Auner
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Publication number: 20070281419Abstract: A thin film titanium dioxide and method for producing the same are disclosed. The thin film titanium dioxide may be produced to have a thickness in the range of 100-1000 nm. The disclosed method for producing the thin film titanium dioxide includes performing a magnetron reactive sputtering process to vaporize at least portions of a titanium source in a sputtering chamber that is supplied with gaseous oxygen. The vaporized titanium reacts with the oxygen to form titanium dioxide, which is deposited on a substrate within the sputtering chamber. A solar cell and a carbon monoxide sensor utilizing the thin film titanium dioxide of the present invention are also disclosed.Type: ApplicationFiled: June 1, 2007Publication date: December 6, 2007Inventors: Ibrahim Abdullah Ibrahim Alhomoudi, Golam Newaz, Gregory W. Auner