Patents by Inventor Ic Seob Kim
Ic Seob Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230343514Abstract: A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt% or more and 0.35 wt% or less with respect to a total content of the Cu particles.Type: ApplicationFiled: December 1, 2022Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Ho KOO, San KYEONG, Soung Jin KIM, Young Soo YI, Ho Yeol LEE, Ic Seob KIM, Kyung Ryul LEE, Chang Hak CHOI
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Patent number: 10839994Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.Type: GrantFiled: September 13, 2019Date of Patent: November 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ic Seob Kim, Jung Il Kim, Yong Sung Kim, Hae In Kim
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Patent number: 10706994Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.Type: GrantFiled: August 8, 2019Date of Patent: July 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ic Seob Kim, Jung Il Kim, Yong Sung Kim, Eun Ju Oh, Su Rim Bae, Hae In Kim
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Publication number: 20200168373Abstract: A varistor includes a substrate, a varistor body disposed on one surface of the substrate, first and second electrodes disposed on the varistor body and spaced apart from each other, an insulating layer disposed on at least two of the first and second electrodes and the varistor body, and first and second terminals disposed on first and second sides of the substrate opposing each other, electrically connected to the first and second electrodes, respectively, and spaced apart from each other. The substrate has mechanical strength greater than that of the varistor body.Type: ApplicationFiled: September 16, 2019Publication date: May 28, 2020Inventors: Ic Seob KIM, Jung Il Kim, Hae In Kim, Yong Sung Kim
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Publication number: 20200168372Abstract: A varistor includes a substrate; first and second electrodes disposed on an upper side and a lower side of the substrate, respectively; a core varistor body surrounded by the substrate and disposed between the first and second electrodes; first and second terminals having at least portions disposed on one side and the other side of the substrate, respectively, and electrically connected to the first and second electrodes, respectively; and a cover varistor body covering the core varistor body and disposed in a level higher than an upper surface of the substrate or disposed in a level lower than a lower surface of the substrate.Type: ApplicationFiled: September 13, 2019Publication date: May 28, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ic Seob KIM, Jung Il KIM, Yong Sung KIM, Hae In KIM
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Publication number: 20200105444Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.Type: ApplicationFiled: August 8, 2019Publication date: April 2, 2020Inventors: Ic Seob KIM, Jung Il KIM, Yong Sung KIM, Eun Ju OH, Su Rim BAE, Hae In KIM
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Patent number: 10236104Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).Type: GrantFiled: May 7, 2014Date of Patent: March 19, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Il Lee, Byeong Cheol Moon, So Yeon Song, Ic Seob Kim, Soo Hwan Son
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Patent number: 9894768Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.Type: GrantFiled: May 28, 2014Date of Patent: February 13, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO, LTD.Inventors: Ic Seob Kim, Soo Hwan Son, Yu Jin Choi, Ho Yoon Kim, Myeong Gi Kim, So Yeon Song, Min Kyoung Cheon, Byeong Cheol Moon, Young Il Lee
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Publication number: 20170200549Abstract: Disclosed herein are a metal-polymer complex film for an inductor and a method for manufacturing an inductor, the inductor being manufactured by using the metal-polymer complex film for an inductor, including: a metal powder; and an amorphous epoxy resin, wherein the metal-polymer complex film is made in a film type by using a mixture where a weight ratio of the metal powder is 75˜98 wt %, so that a plurality of inductors can be simultaneously manufactured to thereby improve production efficiency and characteristic values of the inductor can be also improved.Type: ApplicationFiled: March 27, 2017Publication date: July 13, 2017Inventors: Moon Soo PARK, Ic Seob KIM, Hwan Soo LEE, Dong Hyeok CHOI, Hye Yeon CHA
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Publication number: 20160225512Abstract: A power inductor includes: a body including a coil support layer, a coil disposed on both surfaces of the coil support layer, a sealing part embedding the coil therein, and a cover part disposed on the sealing part and including a plurality of metal thin plates; and external electrodes disposed on both end surfaces of the body. The plurality of metal thin plates are arranged perpendicularly with respect to an upper surface of the coil.Type: ApplicationFiled: December 16, 2015Publication date: August 4, 2016Inventor: Ic Seob KIM
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Patent number: 9378884Abstract: There are provided a multilayer electronic component and a method of manufacturing the same. More particularly, there are provided a multilayer electronic component capable of maintaining high inductance at a high frequency due to excellent magnetic properties and having excellent DC bias properties and a dense fine structure to thereby improve strength, and a method of manufacturing the same.Type: GrantFiled: March 7, 2014Date of Patent: June 28, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ic Seob Kim, Ho Yoon Kim, Myeong Gi Kim
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Patent number: 9349512Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 ?m?Tg?7 ?m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.Type: GrantFiled: October 2, 2012Date of Patent: May 24, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Woo Hahn, Myeong Gi Kim, Sung Yong An, Ic Seob Kim, Byeong Cheol Moon
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Patent number: 9123460Abstract: Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFe12O19 is substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920° C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.Type: GrantFiled: October 3, 2011Date of Patent: September 1, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Yong An, Jin Woo Hahn, Jeong Wook Kim, Sung Lyoung Kim, So Yeon Song, Soo Hwan Son, Ic Seob Kim
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Publication number: 20150162124Abstract: There are provided a multilayer electronic component and a method of manufacturing the same. More particularly, there are provided a multilayer electronic component capable of maintaining high inductance at a high frequency due to excellent magnetic properties and having excellent DC bias properties and a dense fine structure to thereby improve strength, and a method of manufacturing the same.Type: ApplicationFiled: March 7, 2014Publication date: June 11, 2015Applicant: SAMSUNG ELECTRO-MECHANIS CO., LTD.Inventors: Ic Seob KIM, Ho Yoon Kim, Myeong Gi Kim
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Publication number: 20150155084Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.Type: ApplicationFiled: May 28, 2014Publication date: June 4, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ic Seob KIM, Soo Hwan SON, Yu Jin CHOI, Ho Yoon KIM, Myeong Gi KIM, So Yeon SONG, Min Kyoung CHEON, Byeong Cheol MOON, Young Il LEE
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Publication number: 20150022305Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).Type: ApplicationFiled: May 7, 2014Publication date: January 22, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young II Lee, Byeong Cheol Moon, So Yeon Song, Ic Seob Kim, Soo Hwan Son
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Publication number: 20140239219Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.Type: ApplicationFiled: May 8, 2014Publication date: August 28, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Yong AN, Myeong Gi KIM, Ic Seob KIM
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Publication number: 20140240078Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.Type: ApplicationFiled: May 5, 2014Publication date: August 28, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Yong An, Myeong Gi Kim, Ic Seob Kim
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Patent number: 8729999Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.Type: GrantFiled: October 25, 2012Date of Patent: May 20, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Woo Hahn, Sung Yong An, Soo Hwan Son, Ic Seob Kim, Byeong Cheol Moon
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Patent number: 8679362Abstract: Disclosed herein are a nickel-zinc-copper (NiZnCu) based ferrite composition containing 0.001 to 0.3 parts by weight of bivalent metal, 0.001 to 0.3 parts by weight of trivalent metal, and 0.001 to 0.5 parts by weight of tetravalent metal based on 100 parts by weight of main component containing 47.0 to 50.0 mol % of Fe2O3, 15.0 to 27.0 mol % of NiO, 18.0 to 25.0 mol % of ZnO, and 7.0 to 13.0 mol % of CuO, and a multilayered chip device and a toroidal core using the same. According to exemplary embodiments of the present invention, a bivalent metal, a trivalent metal, and a tetravalent are contained in a NiZuCu ferrite, thereby making it possible to provide a ferrite composition having excellent quality factor (Q) characteristics. Moreover, it is possible to provide a toroidal core and a multilayered chip device having excellent sinterability, permittivity, and quality factor (Q) characteristics using the ferrite composition.Type: GrantFiled: September 6, 2012Date of Patent: March 25, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Gi Kim, Sung Yong An, Ic Seob Kim