Abstract: To provide an optical connector which enables heat generated by an optical interface module arranged on the lower surface of the optical connector to be efficiently dissipated from the upper surface of the optical connector. The optical connector includes an optical transmission path 101 including a 45-degree mirror 106 at an end section thereof, wherein, in the optical transmission path 101, the lower surface on which an optical input/output section 102 is provided, and the upper surface facing the lower surface are sandwiched by metal patterns 107 and 108 having a heat conductivity higher than that of the optical transmission path 101, and wherein the metal patterns 107 and 108 are physically connected to each other by heat dissipation vias 103 having a heat conductivity higher than that of the optical transmission path 101.

Abstract: An optical connector fitted upon a tip end portion of an optical fiber ribbon and disposed to face an optical input and output terminators which are installed upon a substrate, and which optically connects between optical fibers of the optical fiber ribbon and each of the optical input and output terminators. The optical connector includes a block shaped connector main body which is disposed to face the optical input and output terminators.

Abstract: A connection structure includes housing (10) having insertion/removal openings (11a, 12a) into which and from which a plurality of CPU cards (6), in which electronic parts are mounted on a circuit board, and switch cards (7) are inserted and removed, back plane (13) to which cards (6, 7) are electrically connected, and optical circuit board (14) that is optically connected to optical connectors (16) which are arranged on cards (6, 7) so as to be exposed to the outside of housing (10) from insertion/removal openings (11a, 12a) with cards (6, 7) connected to back plane (13).

Abstract: To provide an optical connector which enables heat generated by an optical interface module arranged on the lower surface of the optical connector to be efficiently dissipated from the upper surface of the optical connector. The optical connector includes an optical transmission path 101 including a 45-degree mirror 106 at an end section thereof, wherein, in the optical transmission path 101, the lower surface on which an optical input/output section 102 is provided, and the upper surface facing the lower surface are sandwiched by metal patterns 107 and 108 having a heat conductivity higher than that of the optical transmission path 101, and wherein the metal patterns 107 and 108 are physically connected to each other by heat dissipation vias 103 having a heat conductivity higher than that of the optical transmission path 101.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.

Abstract: An optical transceiver 10 includes an optical device 16 which is provided upon a substrate 11, an optical connector 14 which is connected to an optical fiber 15a, and a connector holder 13 for optically connecting together the optical device and the optical connector 14. The connector holder 13 includes an engagement means 13c which holds the optical connector 14. The engagement means 13c holds the optical connector 14 when the optical connector 14 is pressed in towards the substrate. The optical connector 14 supports the optical fiber 15a so that the optical axis of the optical fiber 15a subtends a fixed angle with respect to the optical axis of the optical device 16. And the optical connector 14 includes a mirror 14g for optically connecting between the optical device 16 and the optical fiber 15a.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: An optical transceiver 10 includes an optical device 16 which is provided upon a substrate 11, an optical connector 14 which is connected to an optical fiber 15a, and a connector holder 13 for optically connecting together the optical device and the optical connector 14. The connector holder 13 includes an engagement means 13c which holds the optical connector 14. The engagement means 13c holds the optical connector 14 when the optical connector 14 is pressed in towards the substrate. The optical connector 14 supports the optical fiber 15a so that the optical axis of the optical fiber 15a subtends a fixed angle with respect to the optical axis of the optical device 16. And the optical connector 14 includes a mirror 14g for optically connecting between the optical device 16 and the optical fiber 15a.

Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.

Abstract: An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.

Abstract: An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.

Abstract: An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).

Abstract: An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.

Abstract: A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.

Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.

Abstract: An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.

Abstract: An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.