Patents by Inventor Ichiro Suehiro

Ichiro Suehiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190033226
    Abstract: Provided are a polarizing film imaging apparatus, a polarizing film inspection apparatus including the imaging apparatus, and a polarizing film inspection method using the imaging apparatus. The imaging apparatus includes: a light source that is configured to emit light toward a polarizing film to be inspected; an imaging unit that is arranged on an optical axis of the light source and on an opposite side to the light source with the polarizing film therebetween; and at least one of a circular polarizing plate arranged between the light source and the polarizing film, and a wavelength plate arranged between the polarizing film and the imaging unit.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 31, 2019
    Applicants: NITTO DENKO CORPORATION, UTSUNOMIYA UNIVERSITY
    Inventors: Shunsuke Sasaki, Ichiro Suehiro, Shuhei Shibata, David Ignacio Serrano Garcia, Yukitoshi Otani
  • Patent number: 8985818
    Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: March 24, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
  • Patent number: 8734964
    Abstract: An etching resist has a first heat-generating layer, a second heat-generating layer, and a metal compound layer including a metallic oxynitride layer containing a metallic oxynitride. The first heat-generating layer, the metallic oxynitride layer, and the second heat-generating layer are directly or indirectly laminated such that the metallic oxynitride layer is positioned between the first heat-generating layer and the second heat-generating layer.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: May 27, 2014
    Assignees: National Institute of Advanced Industrial Science and Technology, Nitto Denko Corporation
    Inventors: Kazuma Kurihara, Takashi Nakano, Takayuki Shima, Junji Tominaga, Kazuya Fujioka, Ichiro Suehiro
  • Patent number: 8558273
    Abstract: The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: October 15, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Hirokazu Matsuda, Ichiro Suehiro
  • Publication number: 20130029091
    Abstract: A method of producing a resin sheet includes the steps of arranging a resin sheet between a substrate and a die opposed to the substrate, and forming a through-hole in the resin sheet to pass through the resin sheet in a pressing direction by relatively pressing the die against the substrate. The die includes a first protrusion protruding toward a downstream side in the pressing direction. A second protrusion protruding toward the downstream side in the pressing direction is formed on a peripheral edge portion of an end portion of the first protrusion on the downstream side in the pressing direction. An end portion of the second protrusion on the downstream side in the pressing direction is formed at an acute angle in sectional view along the pressing direction.
    Type: Application
    Filed: July 11, 2012
    Publication date: January 31, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: Ichiro Suehiro
  • Publication number: 20120230043
    Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.
    Type: Application
    Filed: November 26, 2010
    Publication date: September 13, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Kitagawa, Yoshinari Takayama, Ichiro Suehiro, Hideyuki Usui, Takashi Oda
  • Publication number: 20110298004
    Abstract: The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 8, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hirokazu MATSUDA, Ichiro SUEHIRO
  • Patent number: 8021756
    Abstract: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: September 20, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Ichiro Suehiro, Hiroyuki Katayama, Kouji Akazawa, Hideyuki Usui
  • Patent number: 7781794
    Abstract: The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: August 24, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Ichiro Suehiro, Kouji Akazawa, Hideyuki Usui
  • Publication number: 20100209670
    Abstract: The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 19, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ichiro SUEHIRO, Kazuya FUJIOKA, Hirokazu MATSUDA, Koji AKAZAWA, Ryuichi KIMURA, Hideyuki USUI
  • Publication number: 20100167015
    Abstract: An etching resist containing a metallic oxynitride. The etching resist of the present invention can be suitably used, for example, in the production of a molded article for surface-working an optical member such as a microlens sheet, a light diffusing sheet, a non-reflective sheet, a sheet for encapsulating photosemiconductor elements, an optical waveguide, an optical disk, or a photosensor.
    Type: Application
    Filed: December 15, 2009
    Publication date: July 1, 2010
    Applicants: National Institute of Advanced Ind. Sci. and Tech., NITTO DENKO CORPORATION
    Inventors: Kazuma Kurihara, Takashi Nakano, Takayuki Shima, Junji Tominaga, Kazuya Fujioka, Ichiro Suehiro
  • Publication number: 20100053960
    Abstract: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.
    Type: Application
    Filed: August 25, 2009
    Publication date: March 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ichiro SUEHIRO, Hiroyuki KATAYAMA, Kouji AKAZAWA, Hideyuki USUI
  • Publication number: 20090242928
    Abstract: The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
    Type: Application
    Filed: March 24, 2009
    Publication date: October 1, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ichiro SUEHIRO, Kouji AKAZAWA, Hideyuki USUI
  • Patent number: 7559681
    Abstract: The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: July 14, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Ichiro Suehiro, Noriaki Harada, Yuji Hotta
  • Patent number: 7290902
    Abstract: The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: November 6, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Ichiro Suehiro, Yuji Hotta, Naoki Sadayori, Noriaki Harada, Kazuki Uawada
  • Patent number: 7231706
    Abstract: An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: June 19, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Miho Yamaguchi, Ichiro Suehiro, Fumiteru Asai, Yuji Hotta
  • Publication number: 20060119751
    Abstract: The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.
    Type: Application
    Filed: November 1, 2005
    Publication date: June 8, 2006
    Inventors: Ichiro Suehiro, Noriaki Harada, Yuji Hotta
  • Publication number: 20060118973
    Abstract: The present invention provides a sheet for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A that is to be brought into contact with one or more optical semiconductor elements; a light-diffusing layer formed on the layer A and containing light-diffusing particles; and a resin layer B formed on the light-diffusing layer and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.
    Type: Application
    Filed: November 15, 2005
    Publication date: June 8, 2006
    Inventors: Noriaki Harada, Yuji Hotta, Ichiro Suehiro, Naoki Sadayori
  • Patent number: 6961185
    Abstract: A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula: wherein R represents a diisocyanate residue; R1 represents a monoisocyanate residue; and n represents an integer of 1 to 100.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: November 1, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Ichiro Suehiro, Naoki Sadayori, Yuji Hotta
  • Publication number: 20050237765
    Abstract: The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 27, 2005
    Inventors: Ichiro Suehiro, Yuji Hotta, Naoki Sadayori, Noriaki Harada, Kazuki Uawada