Patents by Inventor Ikuhei Kimura
Ikuhei Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7997501Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: August 16, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20110127337Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: February 8, 2011Publication date: June 2, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Patent number: 7905421Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: March 15, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20100308118Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.Type: ApplicationFiled: August 24, 2010Publication date: December 9, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA, Koji SHIROKI, Yuya DOKAI
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Patent number: 7830311Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.Type: GrantFiled: September 7, 2007Date of Patent: November 9, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura
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Publication number: 20100103058Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: ApplicationFiled: January 15, 2010Publication date: April 29, 2010Applicant: Murata Manufacturing Co., Ltd.Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
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Publication number: 20090266900Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: July 15, 2009Publication date: October 29, 2009Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Publication number: 20090080296Abstract: An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.Type: ApplicationFiled: December 3, 2008Publication date: March 26, 2009Applicant: Murata Manufacturing Co., Ltd.Inventors: Yuya DOKAI, Noboru KATO, Ikuhei KIMURA
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Publication number: 20090052360Abstract: An information terminal device includes a casing, a wireless board, and an antenna arranged to utilize a plurality of radio systems. The antenna includes a power feeding terminal and a plurality of resonant circuits. The plurality of resonant circuits are arranged to radiate radio waves. The plurality of resonant circuits further define a matching circuit that provides impedance matching between an impedance on a power feeding side as viewed from the power feeding terminal and a radiation impedance of a free space.Type: ApplicationFiled: November 10, 2008Publication date: February 26, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Harufumi MANDAI, Ikuhei KIMURA
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Publication number: 20090034595Abstract: A data coupler includes an antenna substrate that is not electrically connected in a DC arrangement to an electric power line, is arranged adjacent to the electric power line, and is connected to a modem. A resonant circuit including an inductance element and a capacitance element is provided in the antenna substrate. In the resonant circuit, the inductance element is magnetically coupled to the electric power line. The resonant circuit transmits a radio-frequency signal superimposed on the electric power line to the modem. The resonant circuit also transmits a transmission signal from the modem to the electric power line.Type: ApplicationFiled: October 16, 2008Publication date: February 5, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Ikuhei KIMURA
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Publication number: 20090021446Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.Type: ApplicationFiled: September 7, 2007Publication date: January 22, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA
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Publication number: 20090021352Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.Type: ApplicationFiled: September 23, 2008Publication date: January 22, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA, Yuya DOKAI
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Publication number: 20090009007Abstract: A product includes a power supply circuit board, which includes a power supply circuit having a stable frequency characteristic which enables communication among various products to be obtained. The product includes a power supply circuit board including a power supply circuit arranged thereon having an inductance element, and a wireless communication circuit board electrically connected to the power supply circuit. The wireless communication circuit board is mounted on the power supply circuit board. The product further includes a radiation plate which emits a transmission signal which is supplied from the power supply circuit through electromagnetic field coupling and which has a frequency substantially determined in accordance with a resonant frequency of the power supply circuit, and which is used to supply a reception signal to the power supply circuit through electromagnetic field coupling.Type: ApplicationFiled: September 22, 2008Publication date: January 8, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru Kato, Ikuhei Kimura
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Publication number: 20070252703Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.Type: ApplicationFiled: April 26, 2007Publication date: November 1, 2007Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Ikuhei KIMURA, Kimikazu IWASAKI, Satoshi ISHINO