Patents by Inventor Ikuo Morioka

Ikuo Morioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8084510
    Abstract: Expandable polystyrenic resin particles having superior resistance to cracking of a molded foam product, having superior retention of blowing agent and maintaining expandability over a long period of time, a production process thereof, and a molded foam product are provided.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: December 27, 2011
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Ikuo Morioka, Yasutaka Tsutsui, Hideyasu Matsumura
  • Patent number: 7683101
    Abstract: A pre-expanded beads of olefin-modified polystyrene-based resin comprising a pie-expanded beads of a polystyrene-based resin modified with a polyolefin-based resin, wherein a styrene-based monomer forming a polystyrene-based resin in the beads is used in the range of 100 to 1,000 parts by weight relative to 100 parts by weight of a polyolefin-based resin, a bulk density of each bead is 0.012 to 0.20 g/cm3, and an absorbance ratio at 698 cm?1 and 2850 cm?1 (D698/D2850) obtained from an infrared absorption spectrum of each bead surface measured by ATR method infrared spectroscopy is in the range of 0.1 to 2.5.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: March 23, 2010
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Naokuni Inada, Hideyasu Matsumura, Yasutaka Tsutsui, Ikuo Morioka
  • Publication number: 20100022674
    Abstract: Expandable polystyrenic resin particles having superior resistance to cracking of a molded foam product, having superior retention of blowing agent and maintaining expandability over a long period of time, a production process thereof, and a molded foam product are provided.
    Type: Application
    Filed: October 25, 2007
    Publication date: January 28, 2010
    Applicant: SEKISUI PLASTICS CO., LTD.
    Inventors: Ikuo Morioka, Yasutaka Tsutsui, Hideyasu Matsumura
  • Publication number: 20060217452
    Abstract: A pre-expanded beads of olefin-modified polystyrene-based resin comprising a pie-expanded beads of a polystyrene-based resin modified with a polyolefin-based resin, wherein a styrene-based monomer forming a polystyrene-based resin in the beads is used in the range of 100 to 1,000 parts by weight relative to 100 parts by weight of a polyolefin-based resin, a bulk density of each bead is 0.012 to 0.20 g/cm3, and an absorbance ratio at 698 cm?1 and 2850 cm?1 (D698/D2850) obtained from an infrared absorption spectrum of each bead surface measured by ATR method infrared spectroscopy is in the range of 0.1 to 2.5.
    Type: Application
    Filed: July 23, 2004
    Publication date: September 28, 2006
    Applicant: Sekisui Plastics Co., Ltd
    Inventors: Naokuni Inada, Hideyasu Matsumura, Yasutaka Tsutsui, Ikuo Morioka
  • Patent number: 6527993
    Abstract: The present invention provides a process for producing a molded foam article of a crystalline aromatic polyester resin. The process is characterized by heating the surface temperature of a mold for cavity-molding to the temperature within a range of from (td+35) to (Tg+57)°C. (Tg is a glass transition temperature of the crystalline aromatic polyester resin prepuffs), thereby to mold prepuffs, and cooling the surface of the mold to a temperature not lowered than Tg for at least 20 seconds.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: March 4, 2003
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Takaaki Hirai, Minoru Fujishima, Hiroyuki Ueno, Hideyasu Matsumura, Ikuo Morioka, Yukio Aramomi, Hiroyuki Yamagata
  • Patent number: 6034143
    Abstract: A foamed styrene resin material has a density .rho. of 0.02 to 0.008 and a melt tension of the styrene resin of 5 to 40 gf. The relation between an average cell diameter d (.mu.m) and the density .rho. is given by the expression: ##EQU1## and a relation between a thermal conductivity .lambda. (kcal/m.multidot.h.multidot..degree. C.) and the density .rho. given by the expression: ##EQU2## Accordingly, the foamed styrene resin material has a low thermal conductivity and excellent insulating property in spite of a low density (high expansion ratio foam) thereof.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: March 7, 2000
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Ikuo Morioka, Yukio Aramomi, Mutsuhiko Shimada
  • Patent number: 5683637
    Abstract: A foamed article of styrene type resin, in which base resin particles are styrene type resin particles obtainable by a graft polymerization of a cis-rich polybutadiene with a styrene type monomer, a blowing agent contains n-pentane as its main component and the foamed article shows a density of 0.015-0.040 g/cm.sup.3, an average foam diameter of 60-300 micrometers and a closed cell foam rate of not less than 50%.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: November 4, 1997
    Assignee: Sekisui Kaseihin Kogyo Kabushiki Kaisha
    Inventors: Ikuo Morioka, Hiroyuki Yamagata, Mutsuhiko Shimada
  • Patent number: 5580649
    Abstract: A foamed article of styrene type resin, in which base resin particles are styrene type resin particles obtainable by a graft polymerization of a cis-rich polybutadiene with a styrene type monomer, a blowing agent contains n-pentane as its main component and the foamed article shows a density of 0.015-0.040 g/cm.sup.3, an average foam diameter of 60-300 micrometers and a closed cell foam rate of not less than 50%.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: December 3, 1996
    Assignee: Sekisui Kaseihin Kogyo Kabushiki Kaisha
    Inventors: Ikuo Morioka, Hiroyuki Yamagata, Mutsuhiko Shimada