Abstract: An antenna array includes four closely spaced, linearly arranged antenna columns. At least two of the columns, e.g., the center two columns, are dual-polarized. Spacing between neighboring columns is about ½?, where ? is the free space wavelength at the network carrier frequency. Each column includes a first vertical linear array of radiating elements or groups of elements (sub-arrays) connected to a port. The dual-polarized columns each further include a second linear array of radiating elements oriented at a different polarization than the first array. (For example, horizontal/vertical or slant 45°.) Array ports are connected with four RF feed cables using duplexers in such a way so as to provide two different antenna configurations for forward link and reverse link frequencies, namely, a four-column closely spaced beam-forming array at the forward link and a two-column dual-polarized array at the reverse link for 4-branch diversity reception.

Abstract: A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array (208) or a filter array (314) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g.

Abstract: A transceiver (100) comprises a stacked metal laminate assembly of a plurality of layers (104-112) inside an enclosure (102). A first layer (104) forms an antenna. A second layer (106) forms a ground plane for the antenna. A third layer (108) forms “front-end” filters (duplexer). A fourth layer (110) together with the second layer forms an electromagnetic isolation enclosure for the filters. A fifth layer (112) comprises a PC board with electronic circuits of the transceiver mounted thereon, and is both mounted to and electronically shielded by the fourth layer. Each of the first through fourth layers is preferably made from a single metal layer, such as a sheet of metal, by stamping. Each of the first through fourth layers is either bent along its periphery into a substantially “cake-pan” shape, or is flat and has a separate side wall (130) attached thereto.

Abstract: A high-frequency, e.g., microwave, antenna (100) is stamped from a single sheet (300) of electromagnetically conductive material, e.g., a metal plate. A manufacture comprising a frame (104), a plurality of radiator antenna elements (108), a plurality of first supports (112) each connecting a radiator antenna element to the frame, a feed network (110) connected to the radiator antenna elements, and a plurality of second supports (304) connecting the radiators and the feed network to each other and to the frame, are stamped out of the single sheet. A combiner (114) may be included in the manufacture as well. The second supports provide alignment and rigidity during manufacture and assembly. Preferably, a plurality of the manufactures are stamped out side-by-side from a single roll (400) for ease of automated manufacture and assembly.

Abstract: A resonant capacitive coupler (124) couples signals across a gap (126) between signal transmission lines (112, 118) of two printed wiring boards (100, 102). The coupler has a conductive contact member (202 or 302) that is either positioned in close proximity to one of the transmission lines (112) or is connected to the one transmission line via a dielectric (204 or 304), and forms a capacitor therewith. The coupler further has a conductive interconnect member (200 or 300) that is connected to the contact member, and also to the other transmission line (108) either directly (FIG. 3) or via a second conductive contact member (202) (FIG. 2). The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members.