Abstract: A closed nebulizing system for removing bubbles includes a first pump, a nebulizing module and a second pump. The first pump is for providing a fluid. The nebulizing module includes an outlet channel, an inlet channel connected with the first pump, and a plurality of nozzles for nebulizing and ejecting part of the fluid. The second pump is connected with the outlet channel for outputting non-nebulized fluid. The first pump, the nebulizing module and the second pump form a closed fluid loop, so that the fluid continuously contacts with the plurality of nozzles and bubbles generated during nebulization process are evacuated from the nebulizing module.

Abstract: The present disclosure relates to an integrated chip IC having transistors with structures separated by a flowable dielectric material, and a related method of formation. In some embodiments, an integrated chip has a semiconductor substrate and an embedded silicon germanium (SiGe) region extending as a positive relief from a location within the semiconductor substrate to a position above the semiconductor substrate. A first gate structure is located at a position that is separated from the embedded SiGe region by a first gap. A flowable dielectric material is disposed between the gate structure and the embedded SiGe region and a pre-metal dielectric (PMD) layer disposed above the flowable dielectric material. The flowable dielectric material provides for good gap fill capabilities that mitigate void formation during gap fill between the adjacent gate structures.

Abstract: A supplying system of adding gas into the polishing slurry and method thereof are described. The supplying system includes a slurry container, a gas-mixed container, an adjusting device, a first flow controller, and a second flow controller. The supplying system utilizes the adjusting device to mix the polishing slurry with gas for forming the gas-mixed polishing slurry. The supplying system of adding the gas into the polishing slurry and method thereof are capable of increasing the material removal rate of the surface of the substrate in order to improve the processing quality of the substrate.

Abstract: A color-changeable lamp includes a base, a control unit, a deformable lamp body, a color-sensing unit, a pressure-sensing unit and a light-emitting unit. The deformable lamp body is connected with the base and has a closed space. The control unit, the color-sensing unit and the light-emitting unit are disposed at the base. The pressure-sensing unit is disposed in the closed space. The color-sensing unit can sense a color of a target and generate a color signal corresponding to the color of the target, and the pressure-sensing unit can sense the air pressure in the closed space and send a pressure signal to the control unit when the deformable lamp body is deformed. When the pressure signal reaches a predetermined value, the control unit controls the light-emitting unit to emit the light corresponding to the color signal according to the color signal.

Abstract: The design and manufacture method of a silicon mass flow sensor made with silicon Micromachining MEMS, Micro Electro Mechanical Systems) process for applications of gas flow measurement with highly humidified or liquid vapors is disclosed in the present invention. The said silicon mass flow sensor operates with an embedded heater and an adjacent control temperature sensor beneath the integrated calorimetric and thermal dissipative sensing thermistors. When the condensation takes place at the surface of the said silicon mass flow sensor, the embedded heater shall be turned on to elevate the temperature of the supporting membrane or substrate for the sensing thermistors. The elevated temperature shall be adjusted to above the vaporization temperature with the feedback data of the adjacent temperature sensor such that the surface condensation due to the presence of the liquid vapors in a gas flow can be effectively eliminated.

Abstract: A switching power converting apparatus includes a coil unit, a bipolar junction transistor (BJT) controlling power transfer through the coil unit, and a current sensing resistor sensing a current flowing through the BJT so as to produce a sensed voltage thereacross. A switching controller includes a current source supplying a first current, a current generating module generating, based on an input voltage associated with the sensed voltage, a second current, which is proportional to the current flowing through the BJT, a multiplexing module selecting one of the first and second currents as an output current, and a driving module outputting, based on the output current, a driving current, which is proportional to the output current, to the BJT to thereby conduct the BJT.

Abstract: A vibratable culture apparatus includes a culture device and a vibrating device having a driving module and a vibrating module. The vibrating module has a working platform connected to the driving module, a plurality of lighting units installed on the working platform, and a plurality of positioning units. The working platform is vibratable in a plane by the driving module. Each lighting unit has a first LED set used and a second LED set. The positioning units are installed on the working platform and respectively arranged adjacent to the lighting units. The culture device is detachably disposed on the working platform and restricted by at least partial the positioning units for maintaining the relative position between the culture device and the working platform. The culture device is arranged above at least partial the lighting units that used for emitting light to penetrate into the culture device.

Abstract: An integrated circuit structure includes a semiconductor substrate and a dielectric layer over the semiconductor substrate. The integrated circuit structure further includes a conductive wiring in the dielectric layer. The integrated circuit structure also includes a first metallic capping layer over the conductive wiring and a second metallic capping layer over the first metallic capping layer. The second metallic capping layer has a width substantially the same as a width of the first metallic capping layer.

Abstract: A method includes forming a first photo resist layer over a base structure and a target feature over the base structure, performing an un-patterned exposure on the first photo resist layer, and developing the first photo resist layer. After the step of developing, a corner portion of the first photo resist layer remains at a corner between a top surface of the base structure and an edge of the target feature. A second photo resist layer is formed over the target feature, the base structure, and the corner portion of the first photo resist layer. The second photo resist layer is exposed using a patterned lithography mask. The second photo resist layer is patterned to form a patterned photo resist.

Abstract: This invention relates to a micromachined ESD protection device and its microfabrication method for light emitting diode (LEDs) chips. The LEDs is coupled to the ESD protection device in a shunt connection to absorb and eliminate the electrostatic charges induced by human contact or other voltage spike sources. The ESD protection circuit can prevent the LED from burning down and extend its lifespan. By using a thick polyimide layer as the dielectric film for capacitors in the micromachined ESD protection device at the current invention has the advantages with high breakdown voltage compared to other ESD protection circuits. And furthermore, the device in the current invention is easy for mass production with low manufacturing cost. Another embodiment of the present invention is that the multiple-array arrangement in current micromachined ESD protection device could greatly enhance the liability due to multiple-protection and thus to provide the possibility of multiple-times usage.

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.

Abstract: A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.

Abstract: The instant disclosure relates to a manufacturing method of cathode catalyst, comprising the following steps. Initially, mix an organic medium with an iron-based starting material and a nitrogen-based starting material to form a mixture. Followed by adding a carbon material to the mixture and subsequently executing a heating process to form a solid-state precursor. Then mill the solid-state precursor to form a precursory powder. Successively, calcinate the precursory powder in the presence of NH3 to form a cathode catalyst. The cathode catalyst can reduce the activation energy of hydrogen ion reacting with oxygen to make water. The instant disclosure further provides an ozone-generating device.

Abstract: A fuel cell module may include a membrane electrode assembly, two gas diffusion layers, two current collectors, two sealing members, a fluid flow plate assembly. The fluid flow plate assembly may include a first manifold, a second manifold, and a fluid flow channel. The membrane electrode assembly may include at least one membrane for fuel cell reactions. The two gas diffusion layers may be respectively coupled with two opposite sides of the membrane electrode assembly. The two current collectors respectively coupled with the two gas diffusion layers, and the two sealing members respectively coupled with the two current collectors.

Abstract: A display panel and a method for repairing signal lines thereof are disclosed. The display panel includes at least one shorting bar, switches, and auxiliary repair lines. The switches are electrically coupled respectively to signal lines and the at least one shorting bar. Both ends of each of the auxiliary repair lines overlap one of connections between the switches and the at least one shorting bar. When a signal line is damaged, the method for repairing includes: breaking off each of the connections between the switches and the at least one shorting bar by cutting; and welding both ends of one of the auxiliary repair lines which correspond to the damaged signal line with both sides of one of the connections which correspond to the damaged signal line.

Abstract: The present invention discloses a switching regulator, including: a power stage including at least one power transistor which switches according to a switch control signal to convert an input voltage to an output voltage; a pulse width modulation (PWM) signal generator generating a PWM signal according to the output voltage; an over current detection circuit comparing a current sensing signal with a reference signal to generate an over current signal indicating whether an over current is occurring; and a signal adjustment circuit adjusting the PWM signal or a clock signal to generate the switch control signal for controlling an ON time of the power transistor of the power stage.

Abstract: An electrical connector includes a housing member, a first contact group, a second contact group, a metallic shell and a grounding member. The housing member includes a first tongue plate and a second tongue plate to which the first contact group and the second contact group are respectively associated. The first contact group and the second contact group are compatible to USB 3.0 standard. The grounding member comprises a body portion located between the second mounting portions of the first contact group and the third mounting portions of the second contact group. The grounding member is electrically and mechanically connected to the metallic shell for cross-talk prevention.