Patents by Inventor In-Gann Chen
In-Gann Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11426793Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: GrantFiled: December 3, 2018Date of Patent: August 30, 2022Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Patent number: 11331723Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.Type: GrantFiled: April 25, 2018Date of Patent: May 17, 2022Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: Hung-Tao Chen, Chang-Shu Kuo, In-Gann Chen, Steve Lien-Chung Hsu, Chi-Wah Keong
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Patent number: 11215399Abstract: A high temperature reaction system includes a reaction tube including a heating space, a discharge unit, a cooling unit, a feeding unit and an observation and analysis unit. The discharge unit is disposed opposite to an inlet of the heating space and has a discharge space communicating the heating space, and an observation window and a discharge opening which communicate the discharge space. The cooling unit has a cooling space communicating the discharge opening. The feeding unit includes a carrier holding a sample, and a moving module for moving the carrier and the sample. The observation and analysis unit includes an image capture module and an analysis module for analyzing gas released by the sample.Type: GrantFiled: December 6, 2019Date of Patent: January 4, 2022Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Shih-Hsien Liu, Ke-Miao Lu, Chia-Ming Yang, Hao-Hsun Chang
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Publication number: 20210170354Abstract: A high temperature reaction system includes a reaction tube including a heating space, a discharge unit, a cooling unit, a feeding unit and an observation and analysis unit. The discharge unit is disposed opposite to an inlet of the heating space and has a discharge space communicating the heating space, and an observation window and a discharge opening which communicate the discharge space. The cooling unit has a cooling space communicating the discharge opening. The feeding unit includes a carrier holding a sample, and a moving module for moving the carrier and the sample. The observation and analysis unit includes an image capture module and an analysis module for analyzing gas released by the sample.Type: ApplicationFiled: December 6, 2019Publication date: June 10, 2021Inventors: In-Gann CHEN, Shih-Hsien LIU, Ke-Miao LU, Chia-Ming YANG, Hao-Hsun CHANG
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Patent number: 10685852Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.Type: GrantFiled: November 26, 2018Date of Patent: June 16, 2020Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Po-Tsung Hsieh, Chia-Ming Yang, In-Gann Chen, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang
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Publication number: 20200171578Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Publication number: 20200144078Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.Type: ApplicationFiled: November 26, 2018Publication date: May 7, 2020Inventors: Po-Tsung Hsieh, Chia-Ming Yang, In-Gann Chen, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang
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Publication number: 20190134714Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.Type: ApplicationFiled: April 25, 2018Publication date: May 9, 2019Inventors: Hung-Tao CHEN, Chang-Shu KUO, In-Gann CHEN, Steve Lien-Chung HSU, Chi-Wah KEONG
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Patent number: 9966168Abstract: A method of fabricating a conductive thin film includes the following steps: forming a polymer fiber made of a polymer and a metal precursor distributed in a surface layer near the surface of the polymer fiber; and applying a plasma treatment on the polymer fiber to concurrently etch the polymer and reduce the metal precursor in the surface layer of the polymer fiber. When the plasma treatment is completed, a metal membrane is formed on the surface of the polymer fiber.Type: GrantFiled: December 28, 2016Date of Patent: May 8, 2018Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Chang-Shu Kuo, In-Gann Chen, Hung-Tao Chen, Han-Hsuan Cheng
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Patent number: 9902862Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.Type: GrantFiled: July 6, 2016Date of Patent: February 27, 2018Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
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Publication number: 20180009998Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.Type: ApplicationFiled: July 6, 2016Publication date: January 11, 2018Inventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
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Patent number: 9506148Abstract: A method for forming a flexible transparent conductive film includes steps of: (a) electrospinning a first solution, which contains a polymer, a solvent and a metal ion-containing precursor, to form an polymeric fiber onto a soluble substrate; (b) providing energy to reduce the metal ion-containing precursor of the polymeric fiber, so as to form metal seeds on the polymeric fiber; and (c) placing the polymeric fiber together with the soluble substrate into a second solution, such that the soluble substrate dissolves in the second solution to form an electroless-plating bath and such that the polymeric fiber is subjected to electroless plating to form a metal coating from the metal seeds.Type: GrantFiled: August 5, 2014Date of Patent: November 29, 2016Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: In-Gann Chen, Chang-Shu Kuo, Hung-Tao Chen, Pei-Ying Hsieh
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Patent number: 9085733Abstract: The present invention relates to yttrium aluminum garnet phosphor, a method of preparing the same and a light-emitting diode containing the same. The yttrium aluminum garnet phosphor of the present invention is represented by the following formula (I): (Y3-aMa)Al5-bSibO12??(I) wherein, 0.01?a?0.2, 0<b?1.2, and M is at least one selected from the group consisting of Ce, Dy, Gd, Eu, Tb, La, Pr, Nd, and Sm.Type: GrantFiled: December 7, 2012Date of Patent: July 21, 2015Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Yung-Tang Nien, Heueh-Jung Lu, Chia-Wei Ma
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Publication number: 20150104565Abstract: A method for forming a flexible transparent conductive film includes steps of: (a) electrospinning a first solution, which contains a polymer, a solvent and a metal ion-containing precursor, to form an polymeric fiber onto a soluble substrate; (b) providing energy to reduce the metal ion-containing precursor of the polymeric fiber, so as to form metal seeds on the polymeric fiber; and (c) placing the polymeric fiber together with the soluble substrate into a second solution, such that the soluble substrate dissolves in the second solution to form an electroless-plating bath and such that the polymeric fiber is subjected to electroless plating to form a metal coating from the metal seeds.Type: ApplicationFiled: August 5, 2014Publication date: April 16, 2015Inventors: In-Gann CHEN, Chang-Shu KUO, Hung-Tao CHEN, Pei-Ying HSIEH
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Publication number: 20140021501Abstract: The present invention provides a light emitting diode device with enhanced heat dissipation, and the method of preparing the same. By forming the heat dissipating holes and trenches on the phosphor layer, and filling the heat dissipating holes and trenches on the phosphor layer with thermal conducting materials, the service life of the light emitting diode can be longer by reducing the thermal effect and improving the heat dissipation.Type: ApplicationFiled: July 19, 2013Publication date: January 23, 2014Inventors: In-Gann CHEN, Yung-Tang NIEN, Chia-Wei MA
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Publication number: 20120172232Abstract: The present invention relates to a nanorod-containing precursor powder, a nanorod-containing superconductor bulk and a method for manufacturing the same. The method for manufacturing a nanorod-containing precursor powder includes the following steps: providing a precursor powder; and forming a plurality of nanorods on particle surfaces of the precursor powder. Accordingly, the present invention can significantly enhance critical current density and pinning force.Type: ApplicationFiled: July 6, 2011Publication date: July 5, 2012Applicant: National Cheng Kung UniversityInventors: In-Gann Chen, Chun-Chih Wang, Shih-Hsun Huang
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Publication number: 20120085976Abstract: The present invention relates to a sintering composition and a sintering method. The sintering composition includes: a plurality of sintering raw materials; and an energetic reagent of which decomposition temperature ranges from 50° C. to 400° C. Accordingly, the present invention can reduce the sintering temperature by adding the energetic reagent in an appropriate amount.Type: ApplicationFiled: March 9, 2011Publication date: April 12, 2012Applicant: National Cheng Kung UniversityInventors: Chang-Shu Kuo, In-Gann Chen
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Patent number: 8007864Abstract: A method for forming well-aligned metallic nanowires includes: (a) providing a substrate formed with a crystal layer thereon; (b) disposing the substrate in such a manner that the crystal layer faces downwardly; (c) applying a metal salt solution, which contains metal ions therein, to the crystal layer on the substrate; and (d) subjecting the metal ions in the metal salt solution on the crystal of TiO2 layer to a reduction treatment, thereby resulting in reduced metal that grows downward toward earth's gravity.Type: GrantFiled: January 4, 2008Date of Patent: August 30, 2011Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Jenn-Ming Song, Hsien-Tse Tung
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Publication number: 20100285215Abstract: A method for forming well-aligned metallic nanowires includes: (a) providing a substrate formed with a crystal layer thereon; (b) disposing the substrate in such a manner that the crystal layer faces downwardly; (c) applying a metal salt solution, which contains metal ions therein, to the crystal layer on the substrate; and (d) subjecting the metal ions in the metal salt solution on the crystal of TiO2 layer to a reduction treatment, thereby resulting in reduced metal that grows downward toward earth's gravity.Type: ApplicationFiled: January 4, 2008Publication date: November 11, 2010Applicant: NATIONAL CHENG KUNG UNIVERSITYInventors: In-Gann CHEN, Jenn-Ming SONG, Hsien-Tse TUNG
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Patent number: 6869544Abstract: The present invention pertains to a process for synthesizing nano-scale yttrium aluminum garnet (YAG) fluorescent powders having formula (I): (Y3?xR1x)(Al5?yR2y)O12??(I) wherein R1 and R2 are independently selected from the elements consisting of rare earth metals and transition metals, and each of x and y is independently a value between 0 and 1.Type: GrantFiled: October 31, 2002Date of Patent: March 22, 2005Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Yu-Lin Chen, Chii-Shyang Hwang