Patents by Inventor Ingrid B. Peterson
Ingrid B. Peterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8213704Abstract: Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.Type: GrantFiled: May 7, 2008Date of Patent: July 3, 2012Assignee: KLA-Tencor Corp.Inventors: Ingrid B. Peterson, Ed Yum
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Patent number: 8111900Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.Type: GrantFiled: May 15, 2010Date of Patent: February 7, 2012Assignee: KLA-Tencor Technologies Corp.Inventors: Kenong Wu, David Randall, Kourosh Nafisi, Ramon Ynzunza, Ingrid B. Peterson, Ariel Tribble, Michal Kowalski, Lisheng Gao, Ashok Kulkarni
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Patent number: 8078304Abstract: Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).Type: GrantFiled: July 20, 2008Date of Patent: December 13, 2011Assignee: Applied Materials, Inc.Inventors: Michael R. Rice, Jeffrey C. Hudgens, Todd J. Egan, Ingrid B. Peterson
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Publication number: 20100226562Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.Type: ApplicationFiled: May 15, 2010Publication date: September 9, 2010Applicant: KLA-TENCOR TECHNOLOGIES CORPORATIONInventors: Kenong Wu, David Randall, Kourosh Nafisi, Ramon Ynzunza, Ingrid B. Peterson, Ariel Tribble, Michal Kowalski, Lisheng Gao, Ashok Kulkami
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Patent number: 7769225Abstract: Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.Type: GrantFiled: December 20, 2005Date of Patent: August 3, 2010Assignee: KLA-Tencor Technologies Corp.Inventors: Sagar A. Kekare, Ingrid B. Peterson, Moshe E. Preil
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Patent number: 7729529Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.Type: GrantFiled: December 7, 2004Date of Patent: June 1, 2010Assignee: KLA-Tencor Technologies Corp.Inventors: Kenong Wu, David Randall, Kourosh Nafisi, Ramon Ynzunza, Ingrid B. Peterson, Ariel Tribble, Michal Kowalski, Lisheng Gao, Ashok Kulkarni
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Publication number: 20090130821Abstract: A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques.Type: ApplicationFiled: October 10, 2008Publication date: May 21, 2009Applicant: Applied Materials, Inc.Inventors: Damon K. Cox, Todd J. Egan, Michael X. Yang, Jeffrey C. Hudgens, Ingrid B. Peterson, Michael R. Rice
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Publication number: 20090024241Abstract: Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).Type: ApplicationFiled: July 20, 2008Publication date: January 22, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Michael R. Rice, Jeffrey C. Hudgens, Todd J. Egan, Ingrid B. Peterson
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Publication number: 20090016595Abstract: Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.Type: ApplicationFiled: May 7, 2008Publication date: January 15, 2009Inventors: Ingrid B. Peterson, Ed Yum
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Patent number: 7418124Abstract: Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images corresponding to at least two of the different values. A different method includes comparing at least one pair of the aerial images corresponding to at least two of the different values and determining an area on the reticle where a lithography process using the reticle is most susceptible to failure based on the results of the comparison. Another embodiment includes determining a presence of transient repeating defects on the reticle by subtracting non-transient defects from the aerial images and comparing at least one pair of the aerial images corresponding to at least two of the different values.Type: GrantFiled: July 15, 2003Date of Patent: August 26, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Ingrid B. Peterson, Mike Von den Hoff, Jim Wiley
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Patent number: 6902855Abstract: The invention is a method of determining the presence of an anomaly in qualifying a pattern, patterning process, or patterning apparatus used in the fabrication of microlithographic patterns. A preferred implementation of the method qualifies incoming reticles and process conditions on test wafers to maximize the available usable process window for a given reticle exposure tool combination. Practicing this method on test wafers enables the identification of spatial areas where a process will fail first and candidate regions for carrying out defect inspection and metrology. Other preferred implementations of the method qualify masks, reticles, or other patterns characterized by data bases on which are stored image data acquired by practice of aerial image measurement system (AIMS) or design rule checking (DRC) techniques.Type: GrantFiled: August 2, 2002Date of Patent: June 7, 2005Assignee: KLA-Tencor TechnologiesInventors: Ingrid B. Peterson, Mike Von den Hoff
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Publication number: 20040091142Abstract: Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images corresponding to at least two of the different values. A different method includes comparing at least one pair of the aerial images corresponding to at least two of the different values and determining an area on the reticle where a lithography process using the reticle is most susceptible to failure based on the results of the comparison. Another embodiment includes determining a presence of transient repeating defects on the reticle by subtracting non-transient defects from the aerial images and comparing at least one pair of the aerial images corresponding to at least two of the different values.Type: ApplicationFiled: July 15, 2003Publication date: May 13, 2004Inventors: Ingrid B. Peterson, Mike Von den Hoff, Jim Wiley
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Publication number: 20040009416Abstract: The invention is a method of determining the presence of an anomaly in qualifying a pattern, patterning process, or patterning apparatus used in the fabrication of microlithographic patterns. A preferred implementation of the method qualifies incoming reticles and process conditions on test wafers to maximize the available usable process window for a given reticle exposure tool combination. Practicing this method on test wafers enables the identification of spatial areas where a process will fail first and candidate regions for carrying out defect inspection and metrology. Other preferred implementations of the method qualify masks, reticles, or other patterns characterized by data bases on which are stored image data acquired by practice of aerial image measurement system (AIMS) or design rule checking (DRC) techniques.Type: ApplicationFiled: August 2, 2002Publication date: January 15, 2004Inventors: Ingrid B. Peterson, Mike Von den Hoff