Abstract: A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly. The method includes aligning the laser assembly with the carrier and laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner.

Abstract: A diversity receiver includes a plurality of receiver circuits that are configured to receive and process the received radio frequency signals. A channel estimator is coupled to at least one of the plurality of receiver circuits and is configured to determine at least one channel estimation value for the received radio frequency signals. A controller is coupled to the channel estimator and to at least one of the plurality of receiver circuits and is configured to selectively activate or deactivate the at least one of the plurality of receiver circuits based on the determined at least one channel estimation value.