Patents by Inventor Ioan Pavelescu

Ioan Pavelescu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9985356
    Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 29, 2018
    Assignee: Honeywell International Inc.
    Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
  • Publication number: 20160336658
    Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
    Type: Application
    Filed: July 27, 2016
    Publication date: November 17, 2016
    Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
  • Patent number: 9437933
    Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: September 6, 2016
    Assignee: Honeywell International Inc.
    Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
  • Patent number: 8317392
    Abstract: A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: November 27, 2012
    Assignee: Honeywell International Inc.
    Inventors: Cornel Cobianu, Ioan Pavelescu, Mihal Gologanu
  • Publication number: 20110241959
    Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 6, 2011
    Applicant: Honeywell International Inc.
    Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
  • Patent number: 7784344
    Abstract: Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. Sensing of the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: August 31, 2010
    Assignee: Honeywell International Inc.
    Inventors: Ioan Pavelescu, Ion Georgescu, Dana Elena Guran, Cornel P. Cobianu
  • Publication number: 20100158071
    Abstract: A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.
    Type: Application
    Filed: January 13, 2009
    Publication date: June 24, 2010
    Inventors: Cornel Cobianu, Ioan Pavelescu, Mihal Gologanu
  • Patent number: 7651879
    Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: January 26, 2010
    Assignee: Honeywell International Inc.
    Inventors: Cornel P. Cobianu, Ioan Pavelescu, Viorel V. Avramescu, James D. Cook, Leonard J. McNally
  • Publication number: 20090150029
    Abstract: Apparatus, methods, and systems for incorporating and reading a plurality of bridge sensors is disclosed. The bridge sensors may be capacitive bridge sensors located on the same substrate with a digital processor and signal processing circuits to read the outputs of the sensors. The bridge sensors are accessed by a switch network coupled to the plurality of bridge sensors to selectively provide an output from at least one of the plurality of bridge sensors. The switch network may be a multiplexer, which provides a periodically oscillating voltage to the sensors, to energize the sensors. The multiplexer may also provide output from the energized sensor to the digital processor.
    Type: Application
    Filed: November 19, 2007
    Publication date: June 11, 2009
    Inventors: Ioan Pavelescu, Ion Georgescu, Cornel P. Cobianu, Dana Elena Guran
  • Publication number: 20090139330
    Abstract: Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. The of sense the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 4, 2009
    Inventors: Ioan Pavelescu, Ion Georgescu, Dana Elena Guran, Cornel P. Cobianu
  • Patent number: 7401525
    Abstract: A piezoresistive pressure and/or strain sensor micro-machined primarily from plastic and/or glass. In one illustrative embodiment, the piezoresistive pressure sensor is formed on a polymer substrate. A first selectively implanted region is provided in the polymer substrate to create a piezoresistive region in the polymer substrate. A second selectively implanted region is then provided in at least part of the first selectively implanted region to modulate the electrical conductivity of the first selectively implanted region. The illustrative sensor may be selectively implanted with, for example, nitrogen to create the piezoresistive region, and boron to modulate the electrical conductivity of the piezoresistive region. Phosphorus or any other suitable material may also be used to modulate the electrical conductivity of the piezoresistive region, as desired.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: July 22, 2008
    Assignee: Honeywell International Inc.
    Inventors: Cornel P. Cobianu, Mihai Gologanu, Ioan Pavelescu, Bogdan Catalin Serban
  • Patent number: 7243547
    Abstract: Devices and methods for acoustically measuring temperature and pressure are disclosed. An illustrative SAW sensor can include an electrode structure that transmits and receives surface acoustic waves along a SAW delay line, a temperature sensor for measuring temperature along a first direction of the SAW delay line, and a pressure sensor for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna that wirelessly transmits and receives RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: July 17, 2007
    Assignee: Honeywell International Inc.
    Inventors: Cornel P. Cobianu, Ioan Pavelescu, James D. Cook
  • Publication number: 20070126072
    Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
    Type: Application
    Filed: December 7, 2005
    Publication date: June 7, 2007
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Cornel Cobianu, Ioan Pavelescu, Viorel Avramescu, James Cook, Leonard McNally
  • Patent number: 7198981
    Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: April 3, 2007
    Assignee: Honeywell International Inc.
    Inventors: Viorel V. Avramescu, Cornel P. Cobianu, Ioan Pavelescu
  • Publication number: 20060213275
    Abstract: A piezoresistive pressure and/or strain sensor micro-machined primarily from plastic and/or glass. In one illustrative embodiment, the piezoresistive pressure sensor is formed on a polymer substrate. A first selectively implanted region is provided in the polymer substrate to create a piezoresistive region in the polymer substrate. A second selectively implanted region is then provided in at least part of the first selectively implanted region to modulate the electrical conductivity of the first selectively implanted region. The illustrative sensor may be selectively implanted with, for example, nitrogen to create the piezoresistive region, and boron to modulate the electrical conductivity of the piezoresistive region. Phosphorus or any other suitable material may also be used to modulate the electrical conductivity of the piezoresistive region, as desired.
    Type: Application
    Filed: March 23, 2005
    Publication date: September 28, 2006
    Applicant: HONEYWELL INTERNATIONAL INC
    Inventors: Cornel Cobianu, Mihai Gologanu, Ioan Pavelescu, Bogdan Serban
  • Publication number: 20060086188
    Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.
    Type: Application
    Filed: October 21, 2004
    Publication date: April 27, 2006
    Inventors: Viorel Avramescu, Cornel Cobianu, Ioan Pavelescu
  • Publication number: 20060075820
    Abstract: Devices and methods for acoustically measuring temperature and pressure are disclosed. A SAW sensor in accordance with an illustrative embodiment can include an electrode structure adapted to transmit and receive surface acoustic waves along a SAW delay line, temperature sensing means for measuring temperature along a first direction of the SAW delay line, and pressure sensing means for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna adapted to wirelessly transmit and receive RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.
    Type: Application
    Filed: October 13, 2004
    Publication date: April 13, 2006
    Inventors: Cornel Cobianu, Ioan Pavelescu, James Cook
  • Patent number: 7000298
    Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: February 21, 2006
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Cornel P. Cobianu, Vlad Buiculescu, Ioan Pavelescu, Brian D. Speldrich, James Z. Liu, Brian J. Marsh
  • Publication number: 20050231067
    Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 20, 2005
    Inventors: James Cook, Cornel Cobianu, Vlad Buiculescu, Ioan Pavelescu, Brian Speldrich, James Liu, Brian Marsh