Patents by Inventor Ioan Pavelescu
Ioan Pavelescu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9985356Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.Type: GrantFiled: July 27, 2016Date of Patent: May 29, 2018Assignee: Honeywell International Inc.Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
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Publication number: 20160336658Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.Type: ApplicationFiled: July 27, 2016Publication date: November 17, 2016Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
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Patent number: 9437933Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.Type: GrantFiled: April 6, 2010Date of Patent: September 6, 2016Assignee: Honeywell International Inc.Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
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Patent number: 8317392Abstract: A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.Type: GrantFiled: January 13, 2009Date of Patent: November 27, 2012Assignee: Honeywell International Inc.Inventors: Cornel Cobianu, Ioan Pavelescu, Mihal Gologanu
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Publication number: 20110241959Abstract: An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.Type: ApplicationFiled: April 6, 2010Publication date: October 6, 2011Applicant: Honeywell International Inc.Inventors: Ion Georgescu, Dana E. Guran, Ioan Pavelescu, Cornel Cobianu
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Patent number: 7784344Abstract: Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. Sensing of the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.Type: GrantFiled: November 29, 2007Date of Patent: August 31, 2010Assignee: Honeywell International Inc.Inventors: Ioan Pavelescu, Ion Georgescu, Dana Elena Guran, Cornel P. Cobianu
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Publication number: 20100158071Abstract: A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.Type: ApplicationFiled: January 13, 2009Publication date: June 24, 2010Inventors: Cornel Cobianu, Ioan Pavelescu, Mihal Gologanu
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Patent number: 7651879Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.Type: GrantFiled: December 7, 2005Date of Patent: January 26, 2010Assignee: Honeywell International Inc.Inventors: Cornel P. Cobianu, Ioan Pavelescu, Viorel V. Avramescu, James D. Cook, Leonard J. McNally
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Publication number: 20090150029Abstract: Apparatus, methods, and systems for incorporating and reading a plurality of bridge sensors is disclosed. The bridge sensors may be capacitive bridge sensors located on the same substrate with a digital processor and signal processing circuits to read the outputs of the sensors. The bridge sensors are accessed by a switch network coupled to the plurality of bridge sensors to selectively provide an output from at least one of the plurality of bridge sensors. The switch network may be a multiplexer, which provides a periodically oscillating voltage to the sensors, to energize the sensors. The multiplexer may also provide output from the energized sensor to the digital processor.Type: ApplicationFiled: November 19, 2007Publication date: June 11, 2009Inventors: Ioan Pavelescu, Ion Georgescu, Cornel P. Cobianu, Dana Elena Guran
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Publication number: 20090139330Abstract: Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. The of sense the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.Type: ApplicationFiled: November 29, 2007Publication date: June 4, 2009Inventors: Ioan Pavelescu, Ion Georgescu, Dana Elena Guran, Cornel P. Cobianu
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Patent number: 7401525Abstract: A piezoresistive pressure and/or strain sensor micro-machined primarily from plastic and/or glass. In one illustrative embodiment, the piezoresistive pressure sensor is formed on a polymer substrate. A first selectively implanted region is provided in the polymer substrate to create a piezoresistive region in the polymer substrate. A second selectively implanted region is then provided in at least part of the first selectively implanted region to modulate the electrical conductivity of the first selectively implanted region. The illustrative sensor may be selectively implanted with, for example, nitrogen to create the piezoresistive region, and boron to modulate the electrical conductivity of the piezoresistive region. Phosphorus or any other suitable material may also be used to modulate the electrical conductivity of the piezoresistive region, as desired.Type: GrantFiled: March 23, 2005Date of Patent: July 22, 2008Assignee: Honeywell International Inc.Inventors: Cornel P. Cobianu, Mihai Gologanu, Ioan Pavelescu, Bogdan Catalin Serban
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Patent number: 7243547Abstract: Devices and methods for acoustically measuring temperature and pressure are disclosed. An illustrative SAW sensor can include an electrode structure that transmits and receives surface acoustic waves along a SAW delay line, a temperature sensor for measuring temperature along a first direction of the SAW delay line, and a pressure sensor for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna that wirelessly transmits and receives RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.Type: GrantFiled: October 13, 2004Date of Patent: July 17, 2007Assignee: Honeywell International Inc.Inventors: Cornel P. Cobianu, Ioan Pavelescu, James D. Cook
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Publication number: 20070126072Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.Type: ApplicationFiled: December 7, 2005Publication date: June 7, 2007Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Cornel Cobianu, Ioan Pavelescu, Viorel Avramescu, James Cook, Leonard McNally
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Patent number: 7198981Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.Type: GrantFiled: October 21, 2004Date of Patent: April 3, 2007Assignee: Honeywell International Inc.Inventors: Viorel V. Avramescu, Cornel P. Cobianu, Ioan Pavelescu
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Publication number: 20060213275Abstract: A piezoresistive pressure and/or strain sensor micro-machined primarily from plastic and/or glass. In one illustrative embodiment, the piezoresistive pressure sensor is formed on a polymer substrate. A first selectively implanted region is provided in the polymer substrate to create a piezoresistive region in the polymer substrate. A second selectively implanted region is then provided in at least part of the first selectively implanted region to modulate the electrical conductivity of the first selectively implanted region. The illustrative sensor may be selectively implanted with, for example, nitrogen to create the piezoresistive region, and boron to modulate the electrical conductivity of the piezoresistive region. Phosphorus or any other suitable material may also be used to modulate the electrical conductivity of the piezoresistive region, as desired.Type: ApplicationFiled: March 23, 2005Publication date: September 28, 2006Applicant: HONEYWELL INTERNATIONAL INCInventors: Cornel Cobianu, Mihai Gologanu, Ioan Pavelescu, Bogdan Serban
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Publication number: 20060086188Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.Type: ApplicationFiled: October 21, 2004Publication date: April 27, 2006Inventors: Viorel Avramescu, Cornel Cobianu, Ioan Pavelescu
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Publication number: 20060075820Abstract: Devices and methods for acoustically measuring temperature and pressure are disclosed. A SAW sensor in accordance with an illustrative embodiment can include an electrode structure adapted to transmit and receive surface acoustic waves along a SAW delay line, temperature sensing means for measuring temperature along a first direction of the SAW delay line, and pressure sensing means for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna adapted to wirelessly transmit and receive RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.Type: ApplicationFiled: October 13, 2004Publication date: April 13, 2006Inventors: Cornel Cobianu, Ioan Pavelescu, James Cook
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Patent number: 7000298Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.Type: GrantFiled: April 20, 2004Date of Patent: February 21, 2006Assignee: Honeywell International Inc.Inventors: James D. Cook, Cornel P. Cobianu, Vlad Buiculescu, Ioan Pavelescu, Brian D. Speldrich, James Z. Liu, Brian J. Marsh
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Publication number: 20050231067Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.Type: ApplicationFiled: April 20, 2004Publication date: October 20, 2005Inventors: James Cook, Cornel Cobianu, Vlad Buiculescu, Ioan Pavelescu, Brian Speldrich, James Liu, Brian Marsh