Patents by Inventor Ioan Sauciuc

Ioan Sauciuc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9943931
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 17, 2018
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • Patent number: 9612060
    Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: April 4, 2017
    Assignee: Intel Corporation
    Inventor: Ioan Sauciuc
  • Patent number: 9588554
    Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: March 7, 2017
    Assignee: Dell Products, LP
    Inventors: Charles D. Hood, III, Ioan Sauciuc, Mohammed Tantoush
  • Publication number: 20170014957
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Application
    Filed: July 27, 2016
    Publication date: January 19, 2017
    Applicant: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • Patent number: 9448278
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: September 20, 2016
    Assignee: INTEL CORPORATION
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish Gupta
  • Patent number: 9434029
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: September 6, 2016
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • Patent number: 9347987
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: May 24, 2016
    Assignee: INTEL CORPORATION
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
  • Patent number: 9293428
    Abstract: Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: March 22, 2016
    Assignee: Intel Corporation
    Inventor: Ioan Sauciuc
  • Patent number: 9207274
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: December 8, 2015
    Assignee: INTEL CORPORATION
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
  • Publication number: 20150285857
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Application
    Filed: June 22, 2015
    Publication date: October 8, 2015
    Inventors: Christopher R. SCHROEDER, Christopher W. ACKERMAN, James C. SHIPLEY, Tolga ACIKALIN, Ioan SAUCIUC, Michael L. RUTIGLIANO, James G. MAVEETY, Ashish GUPTA
  • Patent number: 9142482
    Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: September 22, 2015
    Assignee: Intel Corporation
    Inventors: Sandeep Ahuja, Ioan Sauciuc, Susan F. Smith
  • Publication number: 20140281590
    Abstract: In one embodiment a controller comprises logic to receive a temperature indicator for an electronic device to be coupled to a first battery and implement a selected power management routine when a temperature parameter derived from the temperature indicator is below a threshold. Other embodiments may be described.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: IOAN SAUCIUC, LOUIE Y. LIU, ROBERT F. KWASNICK, SURINDER K. TULI
  • Publication number: 20140160673
    Abstract: Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.
    Type: Application
    Filed: December 6, 2012
    Publication date: June 12, 2014
    Inventor: Ioan Sauciuc
  • Publication number: 20130329358
    Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units.
    Type: Application
    Filed: December 27, 2011
    Publication date: December 12, 2013
    Inventors: Sandeep Ahuja, Ioan Sauciuc, Susan F. Smith
  • Publication number: 20130299133
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Application
    Filed: December 20, 2011
    Publication date: November 14, 2013
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • Publication number: 20130248153
    Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.
    Type: Application
    Filed: December 30, 2011
    Publication date: September 26, 2013
    Applicant: Breville Pty Limited
    Inventor: Ioan Sauciuc
  • Publication number: 20130232995
    Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
    Type: Application
    Filed: May 3, 2013
    Publication date: September 12, 2013
    Applicant: Dell Products, LP
    Inventors: Charles D. Hood, III, Ioan Sauciuc, Mohammed Tantoush
  • Patent number: 8453467
    Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: June 4, 2013
    Assignee: Dell Products, LP
    Inventors: Charles D. Hood, III, Ioan Sauciuc, Mohammed Tantoush
  • Patent number: 8333569
    Abstract: A method and apparatus for removing vapor inside a liquid pump at the start up operation of the pump. In addition, a method and apparatus for removing liquid inside a compressor at the start up operation of the compressor. The pump and compressor each include a sensor attached to them that determines the physical state (i.e., liquid or vapor) of a material inside the pump or compressor. If vapor is detected inside the pump, a thermoelectric module connected to the pump is powered to condense the vapor into a liquid. Likewise, if liquid is detected inside the compressor a heater connected to the compressor is powered to evaporate the liquid into a vapor. After the state of the material inside the pump or compressor is changed, the pump or compressor is powered up for operation in a cooling system.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: December 18, 2012
    Assignee: Intel Corporation
    Inventors: Ioan Sauciuc, Gregory M. Chrysler
  • Publication number: 20110109335
    Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta