Abstract: Hermaphroditic electrical connector comprises a dielectric housing having terminals therein with resilient contact tongues and shunt means fixed to a dielectric carrier which moves relative to housing in response to mating with a like connector as tongues engage respective like tongues. The shunt means engage portions of the terminals remote from the contact tongues to electrically connect alternate terminals when the connector is in an unmated conditon, the shunt means being in unmated relation with the terminals when the connector is mated.

Abstract: A protective carrier (2) has a flexible circuit (6) attached thereto, the protective carrier (2) protecting the circuit (6) during transportation and handling thereof. The flexible circuit (6) is attached to the protective carrier (2) in such a manner as to ensure proper registration and to maintain the center of all components in coincidence as dimensional change occurs due to the different temperature coefficient of expansion of each component. The protective carrier (2) can be used to orient, position, and install an integrated circuit chip carrier (8) and lead frame (4) on an interposer socket (30). As the lead frame (4) has a large number of contact zones positioned thereon, contact force is required between the interposer socket (30) and the lead frame (4).

Abstract: The invention is directed to an electrical connector (2) for electrically connecting contact surfaces (74) of a daughter board (18) to contact areas (46) of mother board (34). The connector (2) has contacts (36) positioned therein, the connector (2) having posts (38) which extend from the connector (2) and make electrical engagement with contact areas (46) of the mother board (34). The daughter board (18) is then inserted into the connector (2) under reduced or zero insertion force conditions and rotated to its operating position. As this rotation occurs, contact projections (60, 72) of the contacts (36) engage the contact surfaces (74) of the daughter board (18). The rotation is translated into a positive wiping action between the contact projections (60, 72) and the contact surfaces (74), thereby ensuring that a positive electrical connection is effected. The resilient nature of the contacts (36) ensures that this wiping action occurs under normal force conditions. The configuration and characteristics, i.

Abstract: Chip carrier connector comprises a housing having a base and walls extending normally therefrom. The housing is movable relative to terminals between a first position and a second position. When the housing is moved to the second position, the terminals are moved inwardly thereby pressing the contact portions of the terminals against contact pads on the chip carrier. As this occurs, the terminals provide a wiping action on the contact pad to ensure that positive electrical contact is effected. The housing may also cam the terminals outwardly to permit placement of the chip carrier in the recess under zero insertion force conditions.

Abstract: Connector for a substrate such as an IC chip carrier comprises a housing assembly which in turn comprises a housing frame and a plurality of contact modules on the frame. Each module has a group of contact members therein. The contact members are located in predetermined positions in the frame and within predetermined dimensional tolerances. The housing frame and the substrate have substrate locating means for locating the substrate so that contact pads on the substrate will be in registry with the contact positions. Module locating means are also provided for locating the modules in the frame so that the contact members in the modules will be located in the predetermined positions. Each module has its own locating means which is directly related to the substrate locating means. The contact members in each module are thereby located within cumulative dimensional tolerances which are limited to the respective modules and are not cumulative beyond the individual modules.

Abstract: A multicontact electrical connector comprises an insulating housing having a substrate-receiving face. A trough-like opening extends into the face for reception of a substrate. In the housing are spaced-apart terminals having free ends which are proximate to the substrate-receiving face and fixed ends which are proximate to an inner end of the opening. Contact surfaces are on the free ends for contacting spaced-apart terminal pads on the substrate. Contact engagement camming means are provided for flexing the terminals and moving the free ends from the opening allowing the substrate to be placed in the opening under reduced insertion force conditions. As the free ends of the terminals are subsequently moved, the contact surfaces of the free ends will be resiliently biased against the terminal pads. Contact wipe camming means are provided to move the contact surfaces across the terminal pads as normal force occurs permitting a wiping action to take place.

Abstract: A contact socket having ends and an intermediate portion for receiving a contact pin. The intermediate portion has a plurality of resilient beams which are designed to provide the necessary contact force while maintaining the insertion force at a low level. The beams are also designed to allow for improper insertion of the pin into the contact socket without damaging the resilient beams so that no permanent set of the beams takes place.

Abstract: Chip carrier comprising a square chip carrier body as slots extending inwardly from its side surfaces midway between its corners. These slots function as keyways for keys that are contained in the chip carrier socket. The keys are located midway between the corners of the chip carrier receiving recess and each key is in the row of contact terminals which are positioned in the socket body in surrounding relationship to the recess. By virtue of this system of positioning the chip carrier in the chip carrier socket, the effects of differential thermal expansion of the chip carrier relative to the chip carrier socket are minimized.

Abstract: 44A tool and method are described for removing a chip carrier socket housing from terminals which are received in the housing and which are mounted on a substrate. The tool comprises a yoke having pulling arms pivoted thereto which have free ends that engage the housing at the corners thereof. A central axial opening extends through the yoke and a slide is slidable in the opening. The slide has a reaction plate on its end which is shaped to engage the upper free ends of the terminals. A locking cam is provided which locks the pulling arms in their engaged positions with the housing. An actuating means causes the yoke and the pulling arms to move upwardly (relative to the substrate on which the terminals are mounted) with respect to the reaction plate. The housing is thus pulled by the arms upwardly and from the terminals.

Abstract: Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.

Abstract: Apparatus for feeding a strip of articles and severing the leading article from the strip comprises a cylindrical surface having a helical feeding thread thereon which is dimensioned to enter gaps in the strip of articles being fed. The strip is fed along a strip feed path to an operating zone adjacent to which one end of the cylindrical surface is located. The cylindrical surface has movable shearing blades thereon at the one end which are cooperable with fixed shearing blades to shear the leading article from the strip in the operating zone.

Abstract: Chip carrier socket 2 comprises a socket body 24 having a rectangular base 30 and walls 34 extending normally from the edges 32 of the base. The walls can be pivotally moved inwardly of the recess which is defined by the walls after a chip carrier 12 has been placed in the recess. A frame 28 is provided in surrounding relationship to the walls 34 and is movable relative thereto between a first position and a second position. When the frame 28 is moved to the second position, the walls 34 are moved inwardly thereby to move the contact terminals 26 in the walls against terminal pads 20 on the leadless chip carrier 12. The frame 28 also may have an ejector means integral therewith which will eject the chip carrier from the socket when the frame is moved from a second position to the first position. The frame may also cam the walls outwardly to permit placement of the chip carrier in the recess under ZIF conditions.

Abstract: A device for optically coupling a fiber to a solid state laser is taught. Briefly stated, a fiber is held by a pedestal or holder and, after alignment between the fiber and the laser, the holder is attached to the same mounting platform upon which the laser is also mounted. The holding or attachment material exhibits the same thermal properties as the base material, thereby minimizing any thermal expansion or contraction which would cause misalignment between the fiber and the laser.

Abstract: A LIF or ZIF connector having improved contact wiping is disclosed herein. Briefly stated, a connector having contacts therein is provided with the contacts moving into or out of engagement with traces disposed on a daughter board. At the time of, or immediately after engagement of the contacts of the connector with the traces on the daughter board, a wiping cam causes the daughter board to be moved with respect to the contacts thereby causing a wiping action between the traces and the contacts.

Abstract: Hermaphroditic electrical connector comprises a dielectric housing having terminals therein with resilient contact tongues and shunt means fixed to a dielectric carrier which moves relative to housing in response to mating with a like connector as tongues engage respective like tongues. The shunt means engage portions of the terminals remote from the contact tongues to electrically connect alternate terminals when the connector is in an unmated condition, the shunt means being in unmated relation with the terminals when the connector is mated.

Abstract: A modular connector housing of relatively short length and having a coupling feature, such as a tab at one end and a recess at the other end, is connected with other similar connector housings. A filler material having a melting point lower than that of the particular soldering method chosen is then inserted into that portion where two housings are joined thereby forming a relatively rigid long connector housing. A hot-melt adhesive preform is then placed on the bottom of the connector housing with the entire connector housing assembly aligned with and attached to a printed circuit board. The hot-melt adhesive bonds the connector housing to the substrate while the filler material melts away from the filler openings, allowing the short incremental housing lengths to move relatively free with respect to each other.

Abstract: A chip carrier socket and contact which provides high contact mating forces and short circuit path length is taught. Briefly stated, a chip carrier socket housing is comprised of a base portion having contacts disposed therein with a retainer portion being placed thereon. A chip carrier having conductive leads is placed between the base and the retainer. The retainer has a spring carrier piece contained therein with the spring carrier acting on fingers which are part of the retainer. The retainer fingers urge the conductive leads of the chip carrier into electrical contact with the contact thereby utilizing the contacts as points of electrical communication only and not for exerting contact mating force.

Abstract: A device for connecting leadless integrated circuit packages to a chip carrier housing or socket and then to a printed circuit board is taught. Briefly stated, a mask is selectively disposed on a printed circuit board. Locating ribs are correspondently disposed on a chip carrier housing so as to cooperatively engage the slots created by the absence of the mask on the printed circuit board. Additionally, barriers for separating contacts contained in the chip carrier housing are maintained at the interior and the exterior portion of the chip carrier housing walls with no material disposed therebetween thereby minimizing capacitive as well as inductive effects which may come about.

Abstract: An electrical contact for use with high density, high frequency electrical signals is taught. Briefly stated, an electrical contact which is generally "U"-shaped having at the end of one leg an outer beam portion perpendicularly attached at the end thereof. A second generally "U"-shaped bent portion is perpendicularly disposed at the end of the other leg in overlapping relationship with the outer beam with the free leg of the second "U"-shaped portion resiliently biased against the lower portion of the outer beam.

Abstract: A high speed socket housing having a relatively simple manner of contact inspection and/or replacement is taught. Briefly stated, the device includes a chip carrier housing having a portion which is removable therefrom and which thereby exposes the contacts contained in slots or partitions in the housing. Thereby, upon removal of a portion of the housing an inspection, replacement, and/or testing of individual contacts may be accomplished without disturbing the remainder of the contacts or removal of the entire chip carrier housing from a printed circuit board.