Abstract: An optical system includes a circular lens having a first set of electrodes arranged in a concentric pattern and a liquid crystal material in electrical communication with the first set of electrodes. The optical system also includes a first cylindrical lens having a vertical meridian and a second set of electrodes oriented along an axis parallel to the vertical meridian. The optical system additionally includes a second cylindrical lens having a third set of electrodes oriented at an angle with respect to the axis.

Abstract: The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

Abstract: The disclosure is directed to a system and method for reviewing a curved edge of a sample. A line scan detector is actuated along an actuation path defined by the edge of the sample to scan a plurality of locations along the sample edge. The scan data is assembled to generate at least one review image of at least a portion of the edge of the sample. In some embodiments a substantially normal angle of incidence is maintained between the sample edge and the scanning illumination. In some embodiments, brightfield and darkfield images may be collected utilizing a common objective with separately operable illumination sources directing illumination along a first and second illumination path to the sample edge for review.

Abstract: A system may include a support configured to rotatably support a wafer. The system may also include an imager for generating an image of a wafer, where the image includes a first coordinate reference. The system may also include a profiler for generating a profile of the wafer, where the profile includes a second coordinate reference. The system may further include control programming for locating at least one structural feature of an edge of the wafer recognizable by both the imager and the profiler for allowing the first coordinate reference to be mapped to the second coordinate reference. The wafer used in calibration may have discrete edge features detectable in an edge imager and in an edge profiler.

Abstract: The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

Abstract: An inspection system for creating images of a substrate. A light source directs an incident light onto the substrate, and a light source timing control controls a pulse timing of the incident light. A stage holds the substrate and moves the substrate under the incident light, so that the substrate reflects the incident light as a reflected light. A stage position sensor reports a position of the stage, and a stage position control controls the position of the stage. A time domain integration sensor receives the reflected light, and a time domain integration sensor timing control controls a line shift of the time domain integration sensor.

Abstract: A system may include a support configured to rotatably support a wafer. The system may also include an imager for generating an image of a wafer, where the image includes a first coordinate reference. The system may also include a profiler for generating a profile of the wafer, where the profile includes a second coordinate reference. The system may further include control programming for locating at least one structural feature of an edge of the wafer recognizable by both the imager and the profiler for allowing the first coordinate reference to be mapped to the second coordinate reference. The wafer used in calibration may have discrete edge features detectable in an edge imager and in an edge profiler.

Abstract: An inspection system for creating images of a substrate. A light source directs an incident light onto the substrate, and a light source timing control controls a pulse timing of the incident light. A stage holds the substrate and moves the substrate under the incident light, so that the substrate reflects the incident light as a reflected light. A stage position sensor reports a position of the stage, and a stage position control controls the position of the stage. A time domain integration sensor receives the reflected light, and a time domain integration sensor timing control controls a line shift of the time domain integration sensor.

Abstract: The present invention relates to a numerous user laser communications optical system. Numerous optical signals comprising a number of channels are simultaneously received and demultiplexed (and/or multiplexed and transmitted) at a numerous access communication device. The numerous access communication device may comprise multiple stages that each include a multiple order waveplate and a polarizing beam splitter. The multiple order waveplate is configured so that it retards a first electrical field component of signals corresponding to certain channels in a frequency grid in an integer multiple of wavelengths with respect to a second electrical field component, and retards a first electrical field component of signals corresponding to other channels in the frequency grid in an integer multiple of wavelengths plus one-half a wavelength with respect to a second electrical field component. Separation can then be performed on the basis of the resulting opposite polarization.

Abstract: A compact imaging spectrometer comprising an entrance slit for directing light, a first means for receiving the light and focusing the light, an immersed diffraction grating that receives the light from the first means and defracts the light, a second means for receiving the light from the immersed diffraction grating and focusing the light, and an image plane that receives the light from the second means

Abstract: A novel projection system includes an illumination source for emitting an illumination beam, a reflective display device for modulating the illumination beam to form a reflected imaging beam, a projection lens group having an optical axis, and a field lens group. The field lens group is de-centered with respect to the optical axis of the projection lens group and is disposed to redirect the illumination beam to illuminate the display device at a non-zero angle of incidence, and to redirect the reflected imaging beam along an optical path parallel to the optical path of the projection lens group. In a particular embodiment the display device is disposed on the optical axis of the projection lens group. In a more particular embodiment, the redirected portion of the optical path of the reflected imaging beam is coincident with the optical axis of the projection lens group.

Abstract: Disclosed are methods and apparatus for automatically filtering out physical defects from electrical defects that are found during a voltage contrast inspection of a test structure on a semiconductor device.

Abstract: The mechanism of and a solution to the problem of vertical banding in projection systems is disclosed. An offset lens array includes a plurality of lens elements arranged in a plurality of rows that are offset with respect to one another. The offset lens array is incorporated in an illuminator for a projection system. The asymmetrical arrangement of the rows of lens elements in the array with respect to a seam in a color separation element of the projection system substantially reduces the vertical banding in the projected image.

Abstract: Disclosed are methods and apparatus for automatically filtering out physical defects from electrical defects that are found during a voltage contrast inspection of a test structure on a semiconductor device. In general terms, the test structure is designed to include a plurality of features that will charge to specific voltage potentials when scanned with an electron beam during a voltage contrast inspection. Images of the scanned features are generated, and the relative brightness level of each feature depends on the corresponding potential on such feature. That is, some features are expected to appear dark, and other features are expected to appear bright. If there is no defect present in the scanned feature, the corresponding image will have the expected number of bright and dark features. However, if there is a defect present, the number of dark and bright features within the generated image will not match expected results.

Abstract: The mechanism of and a solution to the problem of vertical banding in projection systems is disclosed. An offset lens array includes a plurality of lens elements arranged in a plurality of rows that are offset with respect to one another. The offset lens array is incorporated in an illuminator for a projection system. The asymmetrical arrangement of the rows of lens elements in the array with respect to a seam in a color separation element of the projection system substantially reduces the vertical banding in the projected image.

Abstract: A novel projection system includes an illumination source for emitting an illumination beam, a reflective display device for modulating the illumination beam to form a reflected imaging beam, a projection lens group having an optical axis, and a field lens group. The field lens group is de-centered with respect to the optical axis of the projection lens group and is disposed to redirect the illumination beam to illuminate the display device at a non-zero angle of incidence, and to redirect the reflected imaging beam along an optical path parallel to the optical path of the projection lens group. In a particular embodiment the display device is disposed on the optical axis of the projection lens group. In a more particular embodiment, the redirected portion of the optical path of the reflected imaging beam is coincident with the optical axis of the projection lens group.