Patents by Inventor Isamu Honda

Isamu Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11096285
    Abstract: Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: August 17, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kousuke Takase, Isamu Honda, Kiminori Muto, Yuka Tomaru
  • Publication number: 20200205290
    Abstract: Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.
    Type: Application
    Filed: June 1, 2018
    Publication date: June 25, 2020
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Kousuke TAKASE, Isamu HONDA, Kiminori MUTO, Yuka TOMARU
  • Patent number: 6760642
    Abstract: A parts placement calculation system comprises parts selection means 18 for selecting parts with the highest parts point value, store selection means 20 for selecting a store with the highest store point value, and placement determination means 22 for determining whether or not parts can be placed in a store based on a predetermined constraint condition for placing the parts. When the placement determination means 22 determines that parts cannot be placed in a store, the store is deleted from a list of placement possible stores, and then the store selection means 20 is activated again. When the placement determination means 22 determines that parts can be placed in a store, a parts area for placing the target parts are determined within the store. Then, after the parts are deleted from the list of parts to be placed, the parts selection means 18 is reactivated.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: July 6, 2004
    Assignees: Toyota Jidosha Kabushiki Kaisha, CRC Solutions Corp.
    Inventors: Kazunori Tsuruta, Masafumi Akiyama, Isamu Honda, Norifumi Kase
  • Publication number: 20030233626
    Abstract: A parts placement calculation system comprises parts selection means 18 for selecting parts with the highest parts point value, store selection means 20 for selecting a store with the highest store point value, and placement determination means 22 for determining whether or not parts can be placed in a store based on a predetermined constraint condition for placing the parts. When the placement determination means 22 determines that parts cannot be placed in a store, the store is deleted from a list of placement possible stores, and then the store selection means 20 is activated again. When the placement determination means 22 determines that parts can be placed in a store, a parts area for placing the target parts are determined within the store. Then, after the parts are deleted from the list of parts to be placed, the parts selection means 18 is reactivated.
    Type: Application
    Filed: June 10, 2003
    Publication date: December 18, 2003
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, CRC SOLUTIONS CORP.
    Inventors: Kazunori Tsuruta, Masafumi Akiyama, Isamu Honda, Norifumi Kase