Patents by Inventor Isao Miyatani

Isao Miyatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200291509
    Abstract: A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.
    Type: Application
    Filed: April 22, 2020
    Publication date: September 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Daigo AOKI, Masato USHIKUSA, Yoshinori MURATA, Hideyuki OKAMOTO
  • Patent number: 10731261
    Abstract: The object of the present invention is to provide a metal plate having an excellent transportability. A maximum value of a steepness degree at a central area in a width direction of the metal plate is not more than 0.4%. In addition, the maximum value of the steepness degree at the central area is not more than a steepness degree at one end side area, and is not more than a steepness degree at the other end side area. Further, a difference between the maximum value of the steepness degree at the one end side area and the maximum value of the steepness degree at the other end side area is not more than 0.4%.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: August 4, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Isao Miyatani
  • Patent number: 10233546
    Abstract: The object of the present invention is to provide a metal plate having an excellent transportability. A maximum value of a steepness degree at a central area in a width direction of the metal plate is not more than 0.4%. In addition, the maximum value of the steepness degree at the central area is not more than a steepness degree at one end side area, and is not more than a steepness degree at the other end side area. Further, a difference between the maximum value of the steepness degree at the one end side area and the maximum value of the steepness degree at the other end side area is not more than 0.4%.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: March 19, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Isao Miyatani
  • Patent number: 9828665
    Abstract: The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than ?10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: November 28, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Isao Miyatani
  • Publication number: 20160237546
    Abstract: The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than ?10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.
    Type: Application
    Filed: September 24, 2014
    Publication date: August 18, 2016
    Inventors: Chikao IKENAGA, Isao MIYATANI
  • Publication number: 20160208392
    Abstract: The object of the present invention is to provide a metal plate having an excellent transportability. A maximum value of a steepness degree at a central area in a width direction of the metal plate is not more than 0.4%. In addition, the maximum value of the steepness degree at the central area is not more than a steepness degree at one end side area, and is not more than a steepness degree at the other end side area. Further, a difference between the maximum value of the steepness degree at the one end side area and the maximum value of the steepness degree at the other end side area is not more than 0.4%.
    Type: Application
    Filed: September 12, 2014
    Publication date: July 21, 2016
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Chikao IKENAGA, Isao MIYATANI
  • Patent number: 6663946
    Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: December 16, 2003
    Assignee: Kyocera Corporation
    Inventors: Takuji Seri, Katsura Hayashi, Tadashi Nagasawa, Kenji Kume, Takahiro Matsunaga, Isao Miyatani
  • Publication number: 20020172021
    Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.
    Type: Application
    Filed: February 28, 2002
    Publication date: November 21, 2002
    Inventors: Takuji Seri, Katsura Hayashi, Tadashi Nagasawa, Kenji Kume, Takahiro Matsunaga, Isao Miyatani