Abstract: A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.

Abstract: An electronic module includes a substrate having a first main surface and a second main surface, first electronic components on the first main surface, second electronic components on the second main surface, a first sealing resin portion, and a second sealing resin portion. Through holes are formed so as to extend through the substrate and the first sealing resin portion. A third electronic component is placed in the through holes. An area between the through holes and the third electronic component is filled with the second sealing resin portion, and the second sealing resin portion is formed to be exposed at a surface of the first sealing resin portion. When viewed in a direction perpendicular to the first main surface, the second sealing resin portion surrounds the third electronic component. The first sealing resin portion and the second sealing resin portion are made of different types of resins.

Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.

Abstract: A ceramic electronic component according to the present disclosure includes a ceramic insulator and conductor portions including inner conductors disposed inside the ceramic insulator and outer conductors disposed outside the ceramic insulator, wherein each conductor portion has a surface and a back surface opposite to the surface, and at least one of the conductor portions includes a flat portion in which the conductor thickness is constant, surface corner portions having a round-chamfered shape in the direction from the surface toward the back surface of the inner conductor or the outer conductor, and back surface corner portions having a round-chamfered shape in the direction from the back surface toward the surface of the inner conductor or the outer conductor.

Abstract: A ceramic electronic component according to the present disclosure includes a wiring formation layer including a ceramic insulation layer containing a low-temperature co-fired ceramic material and a wiring pattern formed on the ceramic insulation layer. The wiring formation layer further has a plurality of dummy patterns formed on a portion of the ceramic insulation layer where the wiring pattern is not formed. The wiring width of the dummy patterns is less than the minimum value of the wiring width of the wiring pattern.

Abstract: A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

Abstract: A module with high reliability is provided by inhibiting occurrences of air bubbles caused with rise in flow resistance of resin when a sealing resin layer is formed using a die. A module includes a wiring board, components mounted over an upper face of the wiring board, and a sealing resin layer laminated over the upper face. On the upper face, the sealing resin layer includes a high-level region with a long distance from the upper face of the wiring board, a low-level region with a short distance from the upper face, and a level difference region. In a portion included in the wiring board and corresponding to the low-level region and the level difference region, a thin portion is formed so as to be thinner than the remaining portion and overlaps the low-level region at least partially in a plan view.

Abstract: The present disclosure is intended to reduce connection resistance between a shield film and a ground electrode, and to improve characteristics of the shield film. A high frequency component 1a includes a ceramic substrate 2, a ground electrode 3a disposed inside the ceramic substrate 2, a shield film 4 covering an upper surface 2a and lateral surfaces 2c of the ceramic substrate 2, and connecting portions 6a connecting the ground electrode 3a and the shield film 4, wherein the ground electrode 3a is formed using a conductive paste that contains a metal ingredient, powder, and a material constituting the ceramic substrate 2, and a weight rate of a metal ingredient in the connecting portions 6a is higher than that of the metal ingredient in the ground electrode 3a.

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

Abstract: A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

Abstract: A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.

Abstract: The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2.

Abstract: A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.

Abstract: A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

Abstract: In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.

Abstract: In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.