Patents by Inventor Itai M. Pines

Itai M. Pines has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic substrate for alternate package functionality
    Patent number: 9961769
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: May 1, 2018
    Assignee: INTEL CORPORATION
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY
    Publication number: 20140133075
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • Microelectronic substrate for alternate package functionality
    Patent number: 8674235
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: March 18, 2014
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly
  • MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY
    Publication number: 20120305303
    Abstract: The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 6, 2012
    Inventors: Md Altaf Hossain, Cliff C. Lee, David W. Browning, Itai M. Pines, Brian P. Kelly