Patents by Inventor Ivor G. Barber
Ivor G. Barber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10529645Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.Type: GrantFiled: June 8, 2017Date of Patent: January 7, 2020Assignee: XILINX, INC.Inventors: Jaspreet Singh Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez, Ivor G. Barber, Suresh Ramalingam
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Patent number: 10527670Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.Type: GrantFiled: March 28, 2017Date of Patent: January 7, 2020Assignee: XILINX, INC.Inventors: Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet Singh Gandhi, Tien-Yu Lee, Henley Liu, David M. Mahoney, Mohsen H. Mardi
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Patent number: 10319606Abstract: An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is provided that includes a package substrate having a plurality of solder balls coupled to a plurality of contact pads. The package substrate includes a solder mask having a plurality of stepped openings, a plurality of contact pads, and circuitry disposed in the package substrate and coupled to the plurality of contact pads. The solder mask defines a top side of the package substrate. The stepped openings expose the contact pads through solder mask.Type: GrantFiled: November 14, 2017Date of Patent: June 11, 2019Assignee: XILINX, INC.Inventors: Jaspreet Singh Gandhi, Tien-Yu Lee, Henley Liu, Ivor G. Barber, Suresh Ramalingam
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Publication number: 20180358280Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.Type: ApplicationFiled: June 8, 2017Publication date: December 13, 2018Applicant: Xilinx, Inc.Inventors: Jaspreet Singh Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez, Ivor G. Barber, Suresh Ramalingam
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Patent number: 10096502Abstract: An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.Type: GrantFiled: November 23, 2016Date of Patent: October 9, 2018Assignee: XILINX, INC.Inventors: Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang, Jaspreet Singh Gandhi
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Publication number: 20180284187Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.Type: ApplicationFiled: March 28, 2017Publication date: October 4, 2018Applicant: Xilinx, Inc.Inventors: Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet Singh Gandhi, Tien-Yu Lee, Henley Liu, David M. Mahoney, Mohsen H. Mardi
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Patent number: 10043730Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.Type: GrantFiled: September 28, 2015Date of Patent: August 7, 2018Assignee: XILINX, INC.Inventors: Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh, Nael Zohni
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Publication number: 20180144963Abstract: An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.Type: ApplicationFiled: November 23, 2016Publication date: May 24, 2018Applicant: Xilinx, Inc.Inventors: Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang, Jaspreet Singh Gandhi
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Publication number: 20170092619Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.Type: ApplicationFiled: September 28, 2015Publication date: March 30, 2017Applicant: Xilinx, Inc.Inventors: Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh, Nael Zohni
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Publication number: 20140191403Abstract: A multi-die semiconductor package and various methods of manufacturing the same. In one embodiment, the semiconductor package includes: (1) a substrate, (2) a first die coupled to the substrate, the first die having a first set of terminals located along a first edge and bearing a first integrated circuit (IC) that substantially occupies an area of the first die, (3) a second die coupled to the substrate, the second die having a second set of terminals and bearing a second IC that substantially occupies an area of the second die, the first and second ICS being mirror-images of one another and (4) interconnects coupling corresponding terminals of the first and second sets together.Type: ApplicationFiled: January 7, 2013Publication date: July 10, 2014Applicant: LSI CORPORATIONInventor: Ivor G. Barber
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Publication number: 20090285261Abstract: A temperature monitoring circuit for an integrated circuit on a monolithic chip, the temperature monitoring circuit comprising a temperature sensor disposed on the monolithic chip, a system monitor disposed on the monolithic chip, and electrically conductive traces for electrically connecting the temperature sensor to the system monitor. In this manner, the temperature on the monolithic chip can be monitored by the integrated circuit itself, and appropriate action can be programmed to occur upon attaining various set points or conditions.Type: ApplicationFiled: May 17, 2008Publication date: November 19, 2009Applicant: LSI CORPORATIONInventors: Michael J. Casey, Ivor G. Barber, Gregory S. Winn, Julie L. Beatty, Daniel G. Deisz
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Patent number: 6943446Abstract: An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to no more than 0.8 microns. In this manner, stresses such as those that press down upon the top surface of the integrated circuit can be absorbed by the large vias and transferred past fragile layers, such as low k layers, so that the fragile layers are not damaged by the stresses.Type: GrantFiled: November 8, 2002Date of Patent: September 13, 2005Assignee: LSI Logic CorporationInventors: John P. McCormick, Ivor G. Barber, Kumar Nagarajan
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Publication number: 20040089953Abstract: An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to no more than 0.8 microns. In this manner, stresses such as those that press down upon the top surface of the integrated circuit can be absorbed by the large vias and transferred past fragile layers, such as low k layers, so that the fragile layers are not damaged by the stresses.Type: ApplicationFiled: November 8, 2002Publication date: May 13, 2004Inventors: John P. McCormick, Ivor G. Barber, Kumar Nagarajan
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Patent number: 6673708Abstract: An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.Type: GrantFiled: March 25, 2003Date of Patent: January 6, 2004Assignee: LSI Logic CorporationInventors: Ivor G. Barber, Zafer S. Kutlu
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Patent number: 6590292Abstract: An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.Type: GrantFiled: June 1, 2001Date of Patent: July 8, 2003Assignee: LSI Logic CorporationInventors: Ivor G. Barber, Zafer S. Kutlu
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Patent number: 5801072Abstract: A method of assembling flip chips in a package. Solder bumps are attached to a first flip chip and to a second flip chip. A package substrate having first and second opposing sides is provided, and the first flip chip is electrically connected to the first side of the package substrate using the solder bumps attached to the first flip chip. The second flip chip is also electrically connected to the second side of the package substrate using the solder bumps attached to the second flip chip. The position of the second flip chip is substantially opposed to and aligned with the position of the first flip chip. The first and second flip chips are under filled with a heat conductive epoxy. The first flip chip is encapsulated against the first side of the package substrate, and the second flip chip is encapsulated against the second side of the package substrate. Solder balls are attached to the first side of the package insert.Type: GrantFiled: March 14, 1996Date of Patent: September 1, 1998Assignee: LSI Logic CorporationInventor: Ivor G. Barber
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Patent number: 5723369Abstract: To assemble a flip chip in a package, the back of the flip chip is coated with a heat conductive material and a heat conductive substrate is attached to the heat conductive material. Solder bumps are attached to the front of the flip chip and to a package substrate to mount the flip chip on the package, leaving a space between the flip chip and the package substrate. The space between the flip chip and the package substrate is under filled with a heat conductive media, and the flip chip is encapsulated against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed. A final package is formed by electrical connectors attached to the package substrate.Type: GrantFiled: March 14, 1996Date of Patent: March 3, 1998Assignee: LSI Logic CorporationInventor: Ivor G. Barber
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Patent number: 5700723Abstract: A method of packaging an integrated circuit. The integrated circuit is connected to a substrate, and a mold is applied to the substrate. The mold and the substrate define a cavity and at least one covered chase, and the integrated circuit is disposed within the cavity. A compound is injected into the cavity through one of the covered chases, underfilling and encapsulating the integrated circuit. In one embodiment the mold is then removed from the substrate. In an alternate embodiment the mold is fixedly applied to the substrate.Type: GrantFiled: May 15, 1996Date of Patent: December 23, 1997Assignee: LSI Logic CorporationInventor: Ivor G. Barber