Patents by Inventor Izuru Iseki

Izuru Iseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060113021
    Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
    Type: Application
    Filed: January 12, 2006
    Publication date: June 1, 2006
    Inventors: Tsutomu Ueyama, Izuru Iseki, Norio Sato, Katsuyuki Machida, Hakaru Kyuragi
  • Patent number: 7017637
    Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
    Type: Grant
    Filed: September 18, 2002
    Date of Patent: March 28, 2006
    Assignees: Dainippon Screen Mfg. Co. Ltd., Nippon Telegraph and Telephone Corporation
    Inventors: Tsutomu Ueyama, Izuru Iseki, Norio Sato, Katsuyuki Machida, Hakaru Kyuragi
  • Publication number: 20050230035
    Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.
    Type: Application
    Filed: May 12, 2005
    Publication date: October 20, 2005
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Patent number: 6926057
    Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: August 9, 2005
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Patent number: 6918421
    Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: July 19, 2005
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Publication number: 20050139313
    Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.
    Type: Application
    Filed: February 11, 2005
    Publication date: June 30, 2005
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Patent number: 6893805
    Abstract: A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: May 17, 2005
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Izuru Iseki, Tsutomu Ueyama
  • Publication number: 20030079829
    Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.
    Type: Application
    Filed: October 1, 2002
    Publication date: May 1, 2003
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Publication number: 20030064609
    Abstract: A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.
    Type: Application
    Filed: September 25, 2002
    Publication date: April 3, 2003
    Applicant: Dainippon Screen Mfg. Co. , Ltd.
    Inventors: Izuru Iseki, Tsutomu Ueyama
  • Publication number: 20030056890
    Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.
    Type: Application
    Filed: August 8, 2002
    Publication date: March 27, 2003
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tsutomu Ueyama, Izuru Iseki
  • Publication number: 20030056725
    Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
    Type: Application
    Filed: September 18, 2002
    Publication date: March 27, 2003
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tsutomu Ueyama, Izuru Iseki, Norio Sato, Katsuyuki Machida, Hakaru Kyuragi
  • Patent number: 6174371
    Abstract: A substrate treating method and apparatus are disclosed which are capable of heating a substrate in a stable atmosphere including the vapor of a treating liquid, without permitting the vapor of the treating liquid to condense on the substrate. The vapor of the treating liquid is mixed with a diluting gas to form a treating vapor mixture. At this time, the flow rate of the diluting gas is adjusted so that the partial pressure ratio of the vapor of the treating liquid in the treating vapor mixture increases with the passage of time. This treating vapor mixture is transmitted to a treating chamber. The treating chamber includes a substrate support table heated to a predetermined temperature.
    Type: Grant
    Filed: September 16, 1998
    Date of Patent: January 16, 2001
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Izuru Iseki, Tetsuro Yamashita
  • Patent number: 6074515
    Abstract: In a substrate processing apparatus receiving substrates held in a common carrier in a horizontal attitude, the substrates are transferred in the horizontal attitude from the common carrier to an exclusive carrier. The exclusive carrier is rotatable on a horizontal axis. By rotating the exclusive carrier, the substrates are turned from the horizontal attitude to a vertical attitude. Then, the substrates held in the vertical attitude are taken out of the exclusive carrier and transferred to a processing part for processing in the vertical attitude. This allows a simple and speedy turn of the plurality of substrates. Further, even the apparatus for processing the substrates in a vertical attitude can transfer the substrates into and out of the apparatus in the horizontal attitude by using the common carrier.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: June 13, 2000
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Izuru Iseki, Seiichiro Sato, Yusuke Muraoka
  • Patent number: 4925388
    Abstract: An apparatus for heat treating and quickly cooling substrates. The apparatus includes a cylindrical furnace core tube for containing substrates, a heater enclosing the furnace core tube, and outer cylinder enclosing and containing the furnace core tube and the heater, a blower for drafting cooling air to the space between the furnace core tube and the outer cylinder along the longitudinal direction of the furnace core tube, and a switching valve connected between the blower and both ends of the outer cylinder for switching the direction in which the cooling air travels. Since the direction of the cooling air is changed, the entire furnace core tube is uniformly cooled.
    Type: Grant
    Filed: September 22, 1989
    Date of Patent: May 15, 1990
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Izuru Iseki, Akihiro Higashi, Seihiro Sasaki