Patents by Inventor Jörg TRODLER
Jörg TRODLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10456871Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.Type: GrantFiled: August 21, 2015Date of Patent: October 29, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Sebastian Fritzsche, Jürgen Schulze, Jörg Trodler
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Patent number: 10456870Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.Type: GrantFiled: August 21, 2015Date of Patent: October 29, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Sebastian Fritzsche, Jürgen Schulze, Jörg Trodler
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Publication number: 20170252869Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.Type: ApplicationFiled: August 21, 2015Publication date: September 7, 2017Inventors: Sebastian FRITZSCHE, Jürgen SCHULZE, Jörg TRODLER
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Publication number: 20170252873Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.Type: ApplicationFiled: August 21, 2015Publication date: September 7, 2017Inventors: Sebastian FRITZSCHE, Jürgen SCHULZE, Jörg TRODLER
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Publication number: 20120119392Abstract: A simple method is provided for firmly-bonded connection of an electronic component to a substrate, which dispenses with the use of lead-containing paste solders and leads to a contact layer featuring sufficiently high resistance to heat fatigue in an environment characterized by incessant periodical temperature variations, and featuring high thermal and electrical conductivity.Type: ApplicationFiled: July 21, 2010Publication date: May 17, 2012Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KGInventors: Frank Breer, Wolfgang Schmitt, Jöerg Trodler, Karl-Heinz Schaller
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Patent number: 7926700Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.Type: GrantFiled: October 20, 2006Date of Patent: April 19, 2011Assignee: W.C. Heraeus GmbHInventors: Wolfgang Schmitt, Christian Loosz, Frank Breer, Jurgen Hornung, Thomas Krebs, Joerg Trodler
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Publication number: 20100084050Abstract: Lead-free solders based on an Sn—In—Ag solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium.Type: ApplicationFiled: October 5, 2007Publication date: April 8, 2010Applicant: W.C. HERAEUS GMBHInventors: Winfried Kraemer, Joerg Trodler
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Publication number: 20090152331Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.Type: ApplicationFiled: October 20, 2006Publication date: June 18, 2009Applicant: W.C. Heraeus GmbHInventors: Wolfgang Schmitt, Christian Loosz, Frank Breer, Jürgen Hornung, Thomas Krebs, Joerg Trodler