Patents by Inventor Jürgen Bostjancic

Jürgen Bostjancic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having alignment pads and method of manufacturing the same
    Patent number: 11616032
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: March 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: Daniel Maurer, Christof Altstaetter, Thomas Beyreder, Oliver Blank, Jürgen Bostjancic, Andreas Kleinbichler, Josef Liegl, Nicole Schulze-Ollmert
  • SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210242148
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.
    Type: Application
    Filed: January 20, 2021
    Publication date: August 5, 2021
    Inventors: Daniel Maurer, Christof Altstaetter, Thomas Beyreder, Oliver Blank, Jürgen Bostjancic, Andreas Kleinbichler, Josef Liegl, Nicole Schulze-Ollmert
  • Semiconductor Probe Test Card with Integrated Hall Measurement Features
    Publication number: 20180328981
    Abstract: A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and protruding away from the printed circuit board with a gap being disposed between ends of the pair of electrically conductive probes, and a coil affixed to and electrically connected to the printed circuit board and disposed directly over the gap. The probe test card is configured to generate a magnetic flux in the gap between the ends of the pair of electrically conductive probes upon the application of a current through the coil.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 15, 2018
    Inventors: Clemens Ostermaier, Juergen Bostjancic, Gerhard Raczynski, David Kammerlander, Gerhard Prechtl
  • Semiconductor probe test card with integrated hall measurement features
    Patent number: 10126355
    Abstract: A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and protruding away from the printed circuit board with a gap being disposed between ends of the pair of electrically conductive probes, and a coil affixed to and electrically connected to the printed circuit board and disposed directly over the gap. The probe test card is configured to generate a magnetic flux in the gap between the ends of the pair of electrically conductive probes upon the application of a current through the coil.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: November 13, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Clemens Ostermaier, Juergen Bostjancic, Gerhard Raczynski, David Kammerlander, Gerhard Prechtl