Patents by Inventor Jürgen Moosburger

Jürgen Moosburger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10939136
    Abstract: A method for operating a display device is disclosed. In an embodiment, a method for displaying images or films via a display device includes emitting, for each radiation direction, a partial image composed of sub-pixels of all pixels belonging to this radiation direction and receiving control data for at least some of the sub-pixels at the display device by a data compression algorithm, wherein the data compression algorithm comprises a delta coding, wherein the delta coding includes an initial value, wherein the initial value includes one of the partial images defined as a main image, wherein at least some of the remaining partial images are received as deviations from the main image, and wherein edges of a three-dimensional object to be displayed are excluded from data compression when merging surfaces enclose a real angle of 135° or less.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 2, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Juergen Moosburger, Hubert Halbritter, Peter Brick, Mikko Perälä
  • Patent number: 10903392
    Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: January 26, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Patent number: 10797026
    Abstract: A video wall module includes a plurality of light emitting diode chips, each including first contact electrodes and second contact electrodes arranged at a contact side, wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and the contact electrodes electrically conductively connect to a first metallization layer arranged at the top side of the circuit board.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 6, 2020
    Assignee: OSRAM OLED GmbH
    Inventor: Jürgen Moosburger
  • Patent number: 10763396
    Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: September 1, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Publication number: 20200169755
    Abstract: A method for operating a display device is disclosed. In an embodiment, a method for displaying images or films via a display device includes emitting, for each radiation direction, a partial image composed of sub-pixels of all pixels belonging to this radiation direction and receiving control data for at least some of the sub-pixels at the display device by a data compression algorithm, wherein the data compression algorithm comprises a delta coding, wherein the delta coding includes an initial value, wherein the initial value includes one of the partial images defined as a main image, wherein at least some of the remaining partial images are received as deviations from the main image, and wherein edges of a three-dimensional object to be displayed are excluded from data compression when merging surfaces enclose a real angle of 135° or less.
    Type: Application
    Filed: July 24, 2018
    Publication date: May 28, 2020
    Inventors: Juergen Moosburger, Hubert Halbritter, Peter Brick, Mikko Perälä
  • Patent number: 10629781
    Abstract: A method for producing a component may include providing a composite including a semiconductor layer stack, a first connection layer and a second connection layer, wherein the first and second connection layers are arranged on the semiconductor layer stack, are assigned to different electrical polarities and are configured for the electrical contacting of the component to be produced, applying a molded body material on the composite for forming a molded body, such that in a plan view of the semiconductor layer stack the molded body covers the first connection layer and the second connection layer, forming a first cutout and a second cutout through the molded body for exposing the connection layers in places, and filling the first and second cutouts with an electrically conductive material for forming through contacts which are electrically conductively connected to the connection layers and extend through the molded body in the vertical direction.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: April 21, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Juergen Moosburger, Lutz Hoeppel
  • Patent number: 10607969
    Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: March 31, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Jürgen Moosburger, Frank Singer, Thomas Schwarz, Alexander Martin
  • Patent number: 10586788
    Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 10, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Lutz Höppel, Norwin von Malm
  • Patent number: 10546987
    Abstract: A method for producing a component may include providing a composite containing a semiconductor stack layer, a first exposed connection layer and a second exposed connection layer, where the connection layers are arranged on the semiconductor stack, assigned to different electrical polarities and are configured to electrically contact the component to be produced; forming a first through contact exposed in lateral directions on the first connection layer and a second through contact exposed in lateral directions on the second connection layer, where the through contacts are formed from an electrically conductive connection material; and applying a molded body material on the composite for forming a molded body, where each of the through contacts are fully and circumferentially enclosed by the molded body at least in the lateral directions, such that the molded body and the through contacts form a permanently continuous carrier which mechanically carries the component to be produced.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: January 28, 2020
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Juergen Moosburger, Lutz Hoeppel
  • Patent number: 10483444
    Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier including two metal layers, wherein the metal layers are detachable from one another, securing an optoelectronic semiconductor chip on the first metal layer of the carrier, and mechanically detaching the second metal layer from the first metal layer.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: November 19, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Harald Jäger, Jürgen Moosburger, Herbert Brunner
  • Patent number: 10483256
    Abstract: An optoelectronic semiconductor device and an apparatus with an optoelectronic semiconductor device are disclosed. In an embodiment the optoelectronic semiconductor component has an emission region including a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer, and an active region arranged between the first semiconductor layer and the second semiconductor layer for generating radiation, and a protection diode region. The semiconductor component has a contact for electrically contacting the semiconductor component externally. The contact has a first contact region that is connected to the emission region in an electrically conductive manner. The contact has further a second contact region that is spaced apart from the first contact region and connected to the protection diode region in an electrically conductive manner. The first contact region and the second contact region can be electrically contacted externally by a mutual end of a connecting line.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: November 19, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Juergen Moosburger, Andreas Ploessl
  • Patent number: 10396260
    Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact b
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: August 27, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Matthias Sabathil, Jürgen Moosburger, Frank Singer
  • Patent number: 10396259
    Abstract: A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. The component further includes a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, wherein the thermal connector extends to the rear side of the semiconductor chip, wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: August 27, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Matthias Sperl, Frank Singer, Jürgen Moosburger
  • Publication number: 20190252350
    Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier
    Type: Application
    Filed: October 25, 2017
    Publication date: August 15, 2019
    Inventors: Thomas Schwarz, Jürgen Moosburger, Frank Singer
  • Publication number: 20190237443
    Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the
    Type: Application
    Filed: July 13, 2017
    Publication date: August 1, 2019
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Thomas Schwarz, Alexander Martin, Jürgen Moosburger, Karl Engl
  • Patent number: 10355174
    Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: July 16, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Markus Maute, Lutz Höppel, Jürgen Moosburger, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov, Johannes Baur
  • Publication number: 20190189598
    Abstract: A multi-chip module is disclosed. In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.
    Type: Application
    Filed: August 1, 2017
    Publication date: June 20, 2019
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Frank Singer, Jürgen Moosburger, Thomas Schwarz, Lutz Hoeppel, Matthias Sabathil
  • Publication number: 20190180654
    Abstract: A module for a video wall has at least one device including at least one light-emitting component arranged on a carrier, a film is arranged on the device, the film includes an optical element, the optical element is configured to influence light irradiation onto the devices and/or light emission of the devices, the devices are arranged in a grid, interspaces in the form of a lattice structure are provided between the devices, the film includes a covering structure, the covering structure includes at least one part of the lattice structure of the interspaces, the covering structure is arranged above the interspaces and covers the interspaces from above, and the film is laminated thereon.
    Type: Application
    Filed: May 11, 2017
    Publication date: June 13, 2019
    Inventors: Jürgen MOOSBURGER, Frank SINGER, Thomas SCHWARZ, Alexander MARTIN
  • Publication number: 20190157247
    Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.
    Type: Application
    Filed: May 9, 2017
    Publication date: May 23, 2019
    Applicants: OSRAM Opto Semiconductors GmbH, OSRAM Opto Semiconductors GmbH
    Inventors: Jürgen Moosburger, Frank Singer, Thomas Schwarz, Alexander Martin
  • Publication number: 20190155564
    Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.
    Type: Application
    Filed: June 30, 2017
    Publication date: May 23, 2019
    Inventors: Thomas Schwarz, Frank Singer, Jürgen Moosburger, Karl Engl, Alexander Martin