Patents by Inventor Jürgen Portmann

Jürgen Portmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190164892
    Abstract: The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.
    Type: Application
    Filed: December 2, 2016
    Publication date: May 30, 2019
    Applicant: SNAPTRACK, INC.
    Inventors: Andreas FRANZ, Jürgen PORTMANN, Claus REITLINGER, Stefan KIEFL, Oliver FREUDENBERG, Karl WEIDNER
  • Patent number: 10164166
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: December 25, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Patent number: 10154582
    Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 11, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Wolfgang Pahl, Jürgen Portmann
  • Patent number: 10136226
    Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: November 20, 2018
    Assignee: TDK CORPORATION
    Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
  • Publication number: 20180097172
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Application
    Filed: November 22, 2017
    Publication date: April 5, 2018
    Inventors: Hans KRÜGER, Alois STELZL, Christian BAUER, Jürgen PORTMANN, Wolfgang PAHL
  • Publication number: 20180054886
    Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.
    Type: Application
    Filed: October 27, 2017
    Publication date: February 22, 2018
    Inventors: Wolfgang PAHL, Jürgen PORTMANN
  • Publication number: 20180013055
    Abstract: A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.
    Type: Application
    Filed: December 18, 2015
    Publication date: January 11, 2018
    Inventors: Thomas METZGER, Jürgen PORTMANN
  • Patent number: 9853204
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: December 26, 2017
    Assignee: SnapTrack, Inc.
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Patent number: 9844128
    Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: December 12, 2017
    Assignee: SnapTrack, Inc.
    Inventors: Wolfgang Pahl, Jürgen Portmann
  • Publication number: 20170272855
    Abstract: The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.
    Type: Application
    Filed: October 19, 2015
    Publication date: September 21, 2017
    Inventors: Christian BAUER, Hans KRÜEGER, Jürgen PORTMANN, Alois STELZL, Wolfgang PAHL
  • Patent number: 9647196
    Abstract: A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: May 9, 2017
    Assignee: SNAPTRACK, INC.
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Wolfgang Pahl, Robert Koch
  • Patent number: 9382110
    Abstract: A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: July 5, 2016
    Assignee: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Patent number: 9278854
    Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
  • Publication number: 20150325780
    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
    Type: Application
    Filed: October 14, 2013
    Publication date: November 12, 2015
    Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
  • Publication number: 20150326979
    Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
    Type: Application
    Filed: December 18, 2012
    Publication date: November 12, 2015
    Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
  • Patent number: 9006868
    Abstract: The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: April 14, 2015
    Assignee: EPCOS AG
    Inventors: Christian Bauer, Hans Krüger, Jürgen Portmann, Alois Stelzl
  • Publication number: 20150056725
    Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
    Type: Application
    Filed: February 8, 2013
    Publication date: February 26, 2015
    Inventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
  • Publication number: 20140226285
    Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 14, 2014
    Applicant: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Alexander Schmajew
  • Patent number: 8759677
    Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Publication number: 20140111062
    Abstract: A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
    Type: Application
    Filed: March 28, 2012
    Publication date: April 24, 2014
    Applicant: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Wolfgang Pahl, Robert Koch