Patents by Inventor Jae Bong Shin

Jae Bong Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157645
    Abstract: Provided is a support unit for supporting a substrate, the support unit including: a heating member configured to transmit thermal energy to a supported substrate; a reflective plate disposed under the heating member and configured to reflect thermal energy generated by the heating member to the substrate; a cooling plate disposed under the reflective plate and formed with a cooling flow path in which a cooling fluid flows; and a gas supply line configured to supply gas to a space between the reflective plate and the cooling plate.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 19, 2022
    Inventors: SOO HAN SONG, CHUL GOO KIM, JUNG BONG CHOI, CHEOL-YONG SHIN, JAE-YOUL KIM
  • Patent number: 10058952
    Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: August 28, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Dae Seok, Sang Yoon Kim, Hui Jae Kim, Jae Bong Shin, Byung Joon Lee
  • Publication number: 20170136570
    Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 18, 2017
    Inventors: Seung Dae Seok, Sang Yoon Kim, Hui Jae KIM, Jae Bong SHIN, Byung Joon LEE
  • Patent number: 9508577
    Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: November 29, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung Joon Lee, Masato Kajinami, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim, Byeong-Kuk Park, Seung Dae Seok, Jae Bong Shin, Byeong Kap Choi
  • Patent number: 9431365
    Abstract: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: August 30, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-dae Seok, Sang-yoon Kim, Hui-jae Kim, Jae-bong Shin
  • Publication number: 20160079199
    Abstract: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
    Type: Application
    Filed: April 30, 2015
    Publication date: March 17, 2016
    Inventors: Seung-dae SEOK, Sang-yoon KIM, Hui-jae KIM, Jae-bong SHIN
  • Publication number: 20150155210
    Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.
    Type: Application
    Filed: July 22, 2014
    Publication date: June 4, 2015
    Inventors: Byung Joon LEE, Masato KAJINAMI, Yoshiaki YUKIMORI, Sang-Yoon KIM, Hui-Jae KIM, Byeong-Kuk PARK, Seung Dae SEOK, Jae Bong SHIN, Byeong Kap CHOI
  • Publication number: 20130248114
    Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 26, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Dae SEOK, Kyoungran KIM, Jae Bong SHIN, Hyung Sok YEO, Byung Joon LEE, Il Young HAN
  • Publication number: 20120118876
    Abstract: According to example embodiments, a flip chip bonding apparatus includes a metal chamber, a stage in the metal chamber, and a planar antenna in the chamber. The stage may be configured to receive a circuit board having flip chips arranged thereon. The antenna may be configured to bond the flip chips to the circuit board by inductively heating the flip chips on the circuit board.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 17, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Hyun Cho, Yury Tolmachev, Sang Jean Jeon, Byung Joon Lee, Jae Bong Shin, Hyungjoon Kim, Moon Seok Kim
  • Publication number: 20100071847
    Abstract: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 25, 2010
    Inventors: Jae Bong Shin, Byung Joon Lee, Seung Dae Seok, Seung Woo Choi, Jung Hyeon Kim, Sang il Hong
  • Patent number: 7650687
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: January 26, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Patent number: 7294204
    Abstract: An apparatus for painting traffic marks on a road surface without requiring any professional painting skills. The apparatus having: a first support and second support being parallel to each other and a coupling unit to couple the supports. There is also a gantry unit, having: at least one Y-axial gantry coupled to and being movable along the first and second support, and an X-axial gantry coupled to the Y-axial gantry to be movable in a direction perpendicular to the first support and second support. The apparatus further includes: a jet unit coupled to the X-axial gantry, with a jet nozzle to spray paint downwards; a feeding device, having a first feeding unit to move the Y-axial gantry and a second feeding unit to move the X-axial gantry. There may be a third feeding unit to move the jet unit. There is also a control unit to control operation of the apparatus.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: November 13, 2007
    Assignee: Korea Joongang Hak Wonco., Ltd
    Inventors: Daehie Hong, Jung Yup Kim, Hyun Ho Shin, Jae Bong Shin, Woo Chang Lee, In Ju Hwang, Tae Hyung-Kim
  • Publication number: 20060048381
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 9, 2006
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko