Patents by Inventor Jae Hyun Lee

Jae Hyun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200177213
    Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively. Each of the first and second carrier receivers may further include a digital mixer for further translating the frequencies of the receive signal in the digital domain.
    Type: Application
    Filed: February 3, 2020
    Publication date: June 4, 2020
    Inventors: SEUNG-HYUN OH, Chilun Lo, Barosaim Sung, Jae-hoon Lee, Jong-woo Lee
  • Patent number: 10669450
    Abstract: A flexible display device of the present invention comprises a photoelectric element part; a first adhesive film formed on the photoelectric element part; a touch function part formed on the first adhesive film; a second adhesive film formed on the touch function part; and a window film formed on the second adhesive film; wherein the first adhesive film or the second adhesive film has an average slope of about ?9.9 to about 0 at ?20° C. to 80° C. based on x-axis for the distribution of storage modulus versus temperature in the function of x-axis of temperature (° C.) and y-axis of storage modulus (KPa) and wherein the first adhesive film or the second adhesive film has a storage modulus of about 10 KPa or more at 80° C.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: June 2, 2020
    Assignees: Samsung SDI Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Hyung Rang Moon, Ji Ho Kim, Il Jin Kim, Byeong Do Kwak, Jee Hee Kim, Sung Hyun Mun, Seon Hee Shin, Gwang Hwan Lee, Woo Jin Lee, Eun Hwa Lee, Ik Hwan Cho, Jae Hyun Han
  • Patent number: 10673036
    Abstract: Provided is a battery pack. The battery pack according to an embodiment of the present disclosure includes: a battery module including a plurality of battery cells; a case accommodating a plurality of the battery modules; and a handle rod embedded in the case.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: June 2, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Hyeon-Kyu Kim, Jae-Jung Seol, Bum-Hyun Lee, In-Jae Gang
  • Patent number: 10669527
    Abstract: An artificial skin culture container according to the present invention can solve the problems of the contraction of the dermal layer of artificial skin and the detachment thereof from the culture container, which result from an interaction between collagen and fibroblasts existing in the dermal layer of artificial skin during the production of the artificial skin, by using agar and hydrophobically modifying a portion of the agar. Therefore, the use of the culture container enables to stably culture artificial skin and produce artificial skin similar to the human skin. In addition, the artificial skin culture container of the present invention comprises agar, and thus a culture solution can be supplied through a side portion as well as a lower portion of the culture container, which allows to effectively culture artificial skin.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: June 2, 2020
    Assignees: AMOREPACIFIC CORPORATION, SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK
    Inventors: Dae Jin Min, Sung Hoon Lee, Hae Kwang Lee, Jae Hyun Jeong, Hee Wook Ryu, Hee Jin Kim
  • Patent number: 10672209
    Abstract: Provided are door lock control apparatus and method having enhanced security and being capable of providing improved convenience to a user, the door lock control method including: requesting a server for security information set in a door lock; receiving first security information from the server; unlocking the door lock by using the first security information; and setting second security information different from the first security information, in the door lock.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: June 2, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang-min Lee, Seung-eok Choi, Jae-eun Kang, Chang-han Kim, Jong-youb Ryu, Chang-hyun Lee
  • Patent number: 10672357
    Abstract: A stage of a gate driving circuit includes: a first control transistor diode-connected between a first input end of the stage and a first node, biased by a first input signal, and back-biased by a second input signal; a second control transistor including a control end which receives a third input signal, a first end connected to the first node, and a second end connected to a first voltage, and back-biased by a fourth input signal; a first output transistor including a control end connected to the first node, a first end connected to a clock input end of the stage, and a second end connected to a first output end of the stage; and a capacitor connected between the control and second ends of the first output transistor. The second input signal and the fourth input signal have enable levels during different periods.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 2, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae Hoon Lee, Soo-Yeon Lee, Seok Ha Hong, Bong Hyun You, Jai-Hyun Koh
  • Patent number: 10672539
    Abstract: A power cable includes a conductor; an inner semi-conductive layer covering the conductor; an insulating layer covering the inner semi-conductive layer, the insulating layer being impregnated with an insulating oil; an outer semi-conductive layer covering the insulating layer; a metal sheath layer covering the outer semi-conductive layer; and a cable protection layer covering the metal sheath layer. The insulating layer is formed by cross-winding insulating paper and impregnating the insulating paper with the insulating oil. The inner semi-conductive layer and the outer semi-conductive layer are formed by cross-winding semi-conductive paper and impregnating the semi-conductive paper with the insulating oil. A thickness of the outer semi-conductive layer is 7.5 to 15% of a total thickness of the inner semi-conductive layer, the insulating layer, and the outer semi-conductive layer.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: June 2, 2020
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Ji Sung Kim, Weon Bae Kim, Kyoung Ro Ko, Su Kil Lee, Joon Keun Lee, Soon Il Sohn, Kum Hwan Cha, Jae Cheol Gwag, Tae Hyun Kim
  • Patent number: 10673156
    Abstract: A connecting device is provided that includes a movable part contacting an external contact terminal, and an elastic part connected to the movable part and configured to provide an elastic force enabling movement of the movable part. The connecting device also includes a support connected to the elastic part, and at least one protecting wall connected to the support and configured to protect the movable part from external forces. The connecting device further includes an extension extending from the at least one protecting wall in a direction along which the movable part moves and configured to bring the movable part close to the external contact terminal, and a base part provided within the extension and configured to reinforce the support.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 2, 2020
    Assignees: Samsung Electronics Co., Ltd, Hyupjinconnector Co., Ltd
    Inventors: Jang-Won Hur, Jae-Woon Lee, Jung-Hyun Cho, Seon-Tae Kim, Jin-Woo Park, Chang-Su Park, Yoon-Jae Jung, Kyung-Bin Han
  • Publication number: 20200166563
    Abstract: In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.
    Type: Application
    Filed: June 11, 2019
    Publication date: May 28, 2020
    Inventors: Mee-Hyun LIM, Sung-Yeol KIM, Seong-Keun CHO, Won-Don JOO, Jae-Hong KIM, Taek-Jin KIM, Kyung-Min LEE, Sang-Min LEE
  • Publication number: 20200164791
    Abstract: A system and method control a vehicular headlamp for preventing a shadow area between a low beam and a high beam of a headlamp using a camera unit. The method includes periodically determining whether a high beam of the vehicular headlamp is lit or illuminated. Upon determining that the high beam is illuminated, the method includes determining whether a darkness cell is formed in front image data of the vehicle, which is transmitted from a camera unit. Upon determining that the darkness cell is formed, the method includes changing a leveling motor to be directed upward by 1 step and storing a changed number of steps. Upon determining that the darkness cell is not formed, the method includes driving the leveling motor by the pre-stored number of steps.
    Type: Application
    Filed: June 18, 2019
    Publication date: May 28, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jei Hyun Baek, Jae Woong Lee
  • Publication number: 20200168522
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.
    Type: Application
    Filed: August 1, 2019
    Publication date: May 28, 2020
    Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha
  • Publication number: 20200168591
    Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.
    Type: Application
    Filed: June 27, 2019
    Publication date: May 28, 2020
    Inventors: Chul Kyu KIM, Dae Hyun PARK, Jung Ho SHIM, Jae Hyun LIM, Mi Ja HAN, Sang Jong LEE, Han KIM
  • Publication number: 20200168558
    Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
    Type: Application
    Filed: June 6, 2019
    Publication date: May 28, 2020
    Inventors: Yoon Seok SEO, Dae Hyun PARK, Sang Jong LEE, Chul Kyu KIM, Jae Hyun LIM
  • Patent number: 10660336
    Abstract: A method for controlling plant viruses comprising treating plant or soil with a composition for controlling plant viruses comprising Trichodermin wherein the composition has antiviral activity against plant viruses when applied to a plant or to soil. In some embodiments, the Trichodermin is isolated from a Trichoderma albolutescens strain.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: May 26, 2020
    Assignees: SEOUL WOMEN'S UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Dong Ho Lee, Jae Jin Kim, Ki Hyun Ryu, Beom Seok Kim, Seung Mok Ryu
  • Publication number: 20200157386
    Abstract: Provided are an adhesive film, an optical member including the same, and an optical display device including the same, the adhesive film being formed from a monomer mixture comprising an alkyl group-containing acrylate and a hydroxyl group-containing acrylate, wherein the adhesive film has a modulus of 80 kPa or less at ?20° C., and the adhesive film has a value of 40% to 140% in equation 1 at 25° C.
    Type: Application
    Filed: May 14, 2018
    Publication date: May 21, 2020
    Inventors: Ji Ho KIM, Ji Won KANG, Jin Young LEE, Jae Hyun HAN, Byeong Do KWAK, Il Jin KIM, Sung Hyun MUN, Gwang Hwan LEE, Ik Hwan CHO, In Chul HWANG
  • Patent number: 10655801
    Abstract: A light emitting device and a vehicular lamp are provided. The light emitting device comprises: a first light emitting unit; a second light emitting unit separated from the first light emitting unit; and a sidewall surrounding side surfaces of the first and second light emitting units while adjoining the side surfaces of the first and second light emitting units, wherein the first light emitting unit and the second light emitting unit emit light have different peak wavelengths.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: May 19, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Yoon Seop Lee, Da Hye Kim, Sang Hong Lee, Byoung Kyu Park, Dae Wook Kim, Jae Hyun Park
  • Patent number: 10657875
    Abstract: A display driving device including: a gate driver configured to provide a first gate selection signal to a first gate line of a display panel to select the first gate line; a source driver configured to provide an image signal corresponding to the first gate line to a source line; an Electrostatic Discharge (ESD) detection circuit configured to receive a power supply voltage, determine whether there is an ESD in the power supply voltage and, when the ESD is detected, generate a first detection signal; and a controller configured to receive the first detection signal to generate a masking signal, wherein the gate driver is configured to receive the masking signal and not provide a second gate selection signal to select a second gate line.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-Hoon Chung, Won Sik Kang, Jae Sung Kang, Hyeok Chul Kwon, Si Woo Kim, Su Hyun Yun, Sang Kyu Lee, Ji Hyun Lee, Seng-Sub Chun, Jong Han Choi
  • Patent number: 10658440
    Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: May 19, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Dae-Jung Choi, Jae-Ki Lee, Ki-Soub Yang, Hwang-Un Seo, Hong-Myeong Jeon, Seung-Ryul Choi, A-Ryoung Lee, Han-Hee Kim, Geum-Young Lee, Kang-Hyun Kim
  • Patent number: 10657902
    Abstract: Disclosed is a sensing circuit of a display device for external compensation of an OLED. The sensing circuit includes a current receiving unit configured to receive a pixel current containing a leakage current, convert the pixel current at a preset current ratio, and output the converted pixel current; a current source unit; a current sinking unit; a current detection unit; and a detection signal output unit configured to sample an offset voltage corresponding to the leakage current using the detected current.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 19, 2020
    Assignee: Silicon Works Co., Ltd.
    Inventors: Jae Kwan Lee, Dong Hyun Hwang, Hyun Ho Kim
  • Patent number: RE48012
    Abstract: Provided is a display device. The display device includes a circuit substrate, a light source electrically connected to the circuit substrate, the light source being disposed under the circuit substrate, and a light conversion member disposed on a light emitting surface of the light source and a side of the circuit substrate, the light conversion member converting a wavelength of light emitted from the light source. Here, the light conversion member is disposed also on a side surface of the circuit substrate and converts a wavelength of light emitted from the light source. Since the light conversion member is disposed on the side surface of the circuit substrate, the light conversion member may be aligned with the light source without interfering with the circuit substrate. Thus, the display device may effectively convert the wavelength of the light emitted from the light source to realize improved brightness and color impression.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: May 26, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Mok Lee, Jae Hyun Jin