Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.

Abstract: The present invention relates to a multiple output crystal oscillator having a plurality of output terminals for implementing multiple output and Integrated Circuit (IC) chips. More particularly, the crystal oscillator comprises a crystal resonator, a first IC chip having an oscillating circuit block and a frequency-adjusting circuit block, a second IC chip having an output-adjusting block, and a substrate structure for mounting said first and second IC chips, wherein said output terminals include a basic output terminal for outputting the oscillating signal from said first IC chip and at least one additional output terminal for outputting at least one wave form-adjusted oscillation signal from said second IC chip. In the present invention, said basic output terminal is placed on one of four underside corners of said substrate, and said additional output terminal is placed on the portion of the underside except the corners.

Abstract: The present invention relates to a multiple output crystal oscillator having a plurality of output terminals for implementing multiple output and Integrated Circuit (IC) chips. More particularly, the crystal oscillator comprises a crystal resonator, a first IC chip having an oscillating circuit block and a frequency-adjusting circuit block, a second IC chip having an output-adjusting block, and a substrate structure for mounting said first and second IC chips, wherein said output terminals include a basic output terminal for outputting the oscillating signal from said first IC chip and at least one additional output terminal for outputting at least one wave form-adjusted oscillation signal from said second IC chip. In the present invention, said basic output terminal is placed on one of four underside corners of said substrate, and said additional output terminal is placed on the portion of the underside except the corners.

Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.