Patents by Inventor Jae-Kuk PARK

Jae-Kuk PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11530000
    Abstract: A sandwich panel floor modular structure includes a sandwich panel configured to be fixed on a floor panel of a vehicle, a center rail embedded in the sandwich panel and configured to guide a console to move in a longitudinal direction of the vehicle, and seat rails embedded in the sandwich panel and spaced apart from both sides of the center rail, the seat rails configured to guide a seat to move in the longitudinal direction of the vehicle.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: December 20, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, KOLONGLOTECH. Inc
    Inventors: Woon Seok Noh, Hyun Ahn, Sun Yoon, Hyun Jun Na, Jun Soo Kim, Jae Kuk Park
  • Publication number: 20210179189
    Abstract: A sandwich panel floor modular structure includes a sandwich panel configured to be fixed on a floor panel of a vehicle, a center rail embedded in the sandwich panel and configured to guide a console to move in a longitudinal direction of the vehicle, and seat rails embedded in the sandwich panel and spaced apart from both sides of the center rail, the seat rails configured to guide a seat to move in the longitudinal direction of the vehicle.
    Type: Application
    Filed: August 5, 2020
    Publication date: June 17, 2021
    Inventors: Woon Seok Noh, Hyun Ahn, Sun Yoon, Hyun Jun Na, Jun Soo Kim, Jae Kuk Park
  • Publication number: 20200331245
    Abstract: An exterior panel for vehicles is provided and includes a core layer having a predetermined curved surface and skin layers disposed along the curved surface of the core layer. Additionally, mid layers are disposed between the core layer and the skin layers, or are disposed on surfaces of the skin layers.
    Type: Application
    Filed: January 13, 2020
    Publication date: October 22, 2020
    Inventors: Kyeong Bae Seo, Kyung Min Yu, Sang Sun Park, Jae Kuk Park, Sun Yoon, Woo Jin Jung, Dong Won Kim, Hye Ryong Jang, Dae Il Lee
  • Patent number: 10113091
    Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an epoxy resin, a modified urethane resin, an inorganic filler in nanoparticle form, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: October 30, 2018
    Assignee: KOLON GLOTECH, INC.
    Inventor: Jae-Kuk Park
  • Patent number: 9605190
    Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an modified epoxy resin, a urethane resin, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 28, 2017
    Assignee: KOLON GLOTECH, INC.
    Inventor: Jae-Kuk Park
  • Publication number: 20160160100
    Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an modified epoxy resin, a urethane resin, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 9, 2016
    Inventor: Jae-Kuk PARK
  • Publication number: 20160160099
    Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an epoxy resin, a modified urethane resin, an inorganic filler in nanoparticle form, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 9, 2016
    Inventor: Jae-Kuk PARK