Patents by Inventor Jae-Sik Choi
Jae-Sik Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128517Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.Type: ApplicationFiled: January 19, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
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Publication number: 20240128123Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.Type: ApplicationFiled: December 18, 2023Publication date: April 18, 2024Applicant: MagnaChip Semiconductor, Ltd.Inventors: Jin Won JEONG, Jang Hee LEE, Young Hun JUN, Jong Woon LEE, Jae Sik CHOI
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Patent number: 11957706Abstract: The present disclosure relates to a composition for preventing or treating fibrosis including an inhibitor of cyclin-dependent kinase 17 (CDK17) expression or activity. According to the present disclosure, the inhibitor of CDK17 expression or activity significantly reduces collagen production and cell activity and viability in activated hepatic stellate cells (liver fibrosis cell model), renal tubular epithelial cells (renal fibrosis cell model) in which fibrosis is induced by TGF-? treatment, and alveolar epithelial cells (lung fibrosis cell model) in which fibrosis is induced by TGF-? treatment, indicating that the composition of the present disclosure has an excellent effect in preventing or treating fibrosis.Type: GrantFiled: May 31, 2022Date of Patent: April 16, 2024Assignee: Korea University Research and Business FoundationInventors: Young Sik Lee, Do Hoon Lee, Min Seok Choi, Jae Sang Hong
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Publication number: 20240092141Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.Type: ApplicationFiled: March 8, 2023Publication date: March 21, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.Inventors: Kwang Ok Han, Young Tae Song, Yong Chul Kim, Gee Young Shin, Su Yeon Kang, Jae Sik Choi, Dae Hee Lee, Byeong Moo Jang, Ung Hwi Kim, Jae Won Cha, Won Jun Joung, Byung Guk An
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Publication number: 20240097174Abstract: The present disclosure relates to a secondary battery manufacturing system having a multi-packaging unit, in which multiple packaging units of a secondary battery manufacturing facility are provided and a transfer box on which an electrode assembly is accommodated is transferred to each packaging unit by a transfer unit, wherein the secondary battery manufacturing system includes: an electrode supply unit equipped with a plurality of stacking devices for supplying an electrode assembly in which a plurality of battery cells are stacked; a tab-welding unit; at least one packaging unit; at least one temporary buffer; and a transfer unit.Type: ApplicationFiled: September 14, 2023Publication date: March 21, 2024Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
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Publication number: 20240090328Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.Type: ApplicationFiled: October 26, 2023Publication date: March 14, 2024Inventors: Hee-Choon AHN, Young-Kwang KIM, Su-Hyun LEE, Ji-Song JUN, Seon-Woo LEE, Chi-Sik KIM, Kyoung-Jin PARK, Nam-Kyun KIM, Kyung-Hoon CHOI, Jae-Hoon SHIM, Young-Jun CHO, Kyung-Joo LEE
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Patent number: 11926882Abstract: A method for producing an aqueous solution containing nickel or cobalt includes: (A) a leaching step, which includes a first atmospheric pressure heating leaching step and a second atmospheric pressure heating leaching step, in which a raw material is heated and leached under an atmospheric pressure to form a leachate solution containing nickel, cobalt, and impurities; (B) a first extraction step of separating the leachate solution into a first filtrate containing nickel and impurities and a first organic layer containing cobalt and impurities by adding a first solvent extractant to the leachate solution; (C-i) a precipitation removal step of precipitating and removing impurities including magnesium, calcium, or a mixture thereof by adding a precipitating agent to the first filtrate; and (D-i) a target material precipitation step of selectively precipitating a nickel cake containing nickel by adding a neutralizing agent to the first filtrate.Type: GrantFiled: March 28, 2023Date of Patent: March 12, 2024Assignees: KOREA ZINC CO., LTD., KEMCOInventors: Heon Sik Choi, Jae Hoon Joo, Chang Young Choi
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Publication number: 20240079630Abstract: The present disclosure relates to a secondary battery manufacturing system in which a packaging unit of a secondary battery manufacturing facility are configured to have multiple packaging units, and having a multipackaging unit such that a transfer box in which an electrode assembly is seated is transferred to each of the packaging units by a transfer unit, and including an electrode supply unit having a plurality of stacking devices supplying an electrode assembly in which a plurality of battery cells are stacked, a tab welding unit, at least one packaging unit, at least one temporary buffer, and a transfer unit.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
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Publication number: 20240068091Abstract: Disclosed is a method of forming an area-selective thin film, the method comprising supplying a nuclear growth retardant to the inside of the chamber in which the substrate is placed, so that the nuclear growth retardant is adsorbed to a non-growth region of the substrate; purging the interior of the chamber; supplying a precursor to the inside of the chamber, so that the precursor is adsorbed to a growth region of the substrate; purging the interior of the chamber; and supplying a reaction material to the inside of the chamber, so that the reaction material reacts with the adsorbed precursor to form the thin film.Type: ApplicationFiled: January 5, 2022Publication date: February 29, 2024Applicant: EGTM Co., Ltd.Inventors: Jae Min KIM, Ha Na KIM, Woong Jin CHOI, Ji Yeon HAN, Ju Hwan JEONG, Hyeon Sik CHO
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Patent number: 11901322Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: GrantFiled: May 18, 2022Date of Patent: February 13, 2024Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jae Sik Choi, Byeung Soo Song
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Patent number: 11887892Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.Type: GrantFiled: April 15, 2021Date of Patent: January 30, 2024Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jang Hee Lee, Young Hun Jun, Jong Woon Lee, Jae Sik Choi
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Publication number: 20230382189Abstract: The present disclosure provides a split heater apparatus and a method of manufacturing the same, the split heater apparatus being capable of dividing a heating region into zones, heating the zones individually, and having components capable of being simply assembled, such that the number of components and the number of assembly processes are reduced.Type: ApplicationFiled: October 24, 2022Publication date: November 30, 2023Inventors: Jae Sik Choi, Young Tae Song, Byeong Moo Jang, Dong Won Yeon, Sung Hwan Kim, Sung Young Lee, Byung Guk An
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Patent number: 11829861Abstract: Disclosed is a method and apparatus for extracting data in a deep learning model. The method includes receiving an input query, determining a first decision boundary set being a subset of a decision boundary set corresponding to a target layer of the deep learning model, extracting a decision region including the input query based on the first decision boundary set, and extracting data included in the decision region.Type: GrantFiled: August 30, 2019Date of Patent: November 28, 2023Assignees: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY), INEEJIInventors: Jae Sik Choi, Hae Dong Jeong, Gi Young Jeon
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Publication number: 20230331059Abstract: An embodiment vehicle air conditioner includes an air conditioning device connected to a blower device to receive air supplied from the blower device, a heat exchange core provided in the air conditioning device and disposed in parallel with a flow direction of the air supplied from the blower device, a partition wall disposed to divide the heat exchange core into a first core part disposed to be close in distance to the blower device and a second core part disposed to be distant from the blower device, such that the air supplied from the blower device is distributed and supplied to the first core part and the second core part, and an air guide provided in a connection portion between the blower device and the air conditioning device and configured to guide the air to be supplied to the second core part of the heat exchange core.Type: ApplicationFiled: November 1, 2022Publication date: October 19, 2023Inventors: Jae Sik Choi, Byeong Moo Jang, Yun A Choi, Young Tae Song, Sung Been Cheon, Jin Uk Kim, Jong Su Kim, In Keun Kang, Sang Chul Byun
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Publication number: 20230331071Abstract: A vehicle air-conditioning apparatus includes a filter case configured to accommodate a filter, and a filter cover configured to couple to an open upper end of the filter case. The filter case defines an inner space configured to accommodate the filter therein and having the open upper end to receive and discharge the filter therethrough. The inner space is inclined with respect to a vertical direction to allow the filter to be received into and discharged from the filter case in an inclined state. The filter cover includes a fixing protrusion protruding from a lower surface of the filter cover facing the inner space of the filter case and being configured to press and fix the filter in the inner space.Type: ApplicationFiled: November 1, 2022Publication date: October 19, 2023Inventors: Jae Sik CHOI, Byeong Moo JANG, Young Tae SONG, Sung Been CHEON, Jin Uk KIM, Jong Su KIM, In Keun KANG, Sang Chul BYUN
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Publication number: 20230278401Abstract: An embodiment air conditioner for a vehicle includes a blower unit on an outer surface of a dash panel, the outer surface being opposite an inner surface facing an interior space of the vehicle, the blower unit including a blower fan and a filter, an air conditioning unit on the outer surface of the dash panel and coupled to a side of the blower unit between the blower unit and the interior space of the vehicle, and a distribution unit disposed on the inner surface of the dash panel and located between the air conditioning unit and air conditioning ducts provided in the interior space of the vehicle, wherein each of the blower unit, the air conditioning unit, and the distribution unit is coupled to be individually detachable.Type: ApplicationFiled: August 26, 2022Publication date: September 7, 2023Inventors: Byeong Moo Jang, Young Tae Song, Jae Sik Choi, Yun Chang Kim
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Publication number: 20230278388Abstract: An air conditioner for a vehicle, includes a blower unit, having a blower fan and a filter, disposed on an outer surface opposite to an interior space in a dash panel of the vehicle. The air conditioner includes a HVAC unit disposed on the outer surface opposite to the interior space to introduce air from the blower unit. The HVAC unit has a cooler and a heater therein to divide the air introduced from the blower unit into cold air and hot air through the cooler and the heater and to discharge the air and has a distribution unit disposed on an inner surface facing the interior space to introduce the cold air and the hot air generated by the HVAC unit. The distribution unit has front and rear seat doors configured to adjust a degree of mixing of the cold air and the hot air.Type: ApplicationFiled: September 20, 2022Publication date: September 7, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Byeong Moo Jang, Young Tae Song, Jae Sik Choi
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Publication number: 20220278064Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: ApplicationFiled: May 18, 2022Publication date: September 1, 2022Applicant: MagnaChip Semiconductor, Ltd.Inventors: Jin Won JEONG, Jae Sik CHOI, Byeung Soo SONG
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Patent number: 11380640Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: GrantFiled: July 21, 2020Date of Patent: July 5, 2022Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jae Sik Choi, Byeung Soo Song
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Patent number: 11292315Abstract: An air conditioning device for a vehicle and a method of controlling the same are provided. The air conditioning device includes a touch input unit which is configured to be touched, rotated by 360 degrees, and dragged by a user. A touch sensor unit includes three channel regions formed by trisecting a rotational region of 360 degrees and is configured to detect capacitance in accordance with touch areas of a first channel, a second channel, and a third channel at predetermined positions in the three channel regions. Three channel signal output units output signals from the respective channels in accordance with the recognized capacitance.Type: GrantFiled: November 27, 2019Date of Patent: April 5, 2022Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Jae-Won Heo, Jae-Sik Choi, Jin-Han Kim