Abstract: A display apparatus includes a display panel, an afterimage compensator and a data driver. The display panel displays an image. The afterimage compensator writes first stress data of input image data corresponding to a first area to a first memory area in a first block size and second stress data of the input image data corresponding to a second area to a second memory area in a second block size different from the first block size and compensates a grayscale value of the input image data based on the first stress data and the second stress data. The data driver generates a data voltage based on a compensated grayscale value and outputs the data voltage to the display panel.

Abstract: A method of producing a layer structure includes forming a first organic layer by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer through a curing process.

Abstract: Methods of forming a hardmask material film are provided.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: Methods of forming a hardmask material film are provided.

Abstract: Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Abstract: A method of producing a layer structure includes forming a first organic layer by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer through a curing process.

Abstract: Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

Abstract: A positive photosensitive resin composition includes (A) an alkali soluble resin including a repeating unit represented by the following Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the detailed description; (B) a photosensitive diazoquinone compound; and (C) a solvent, a photosensitive resin film, and a display device including the same.

Abstract: Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Abstract: Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.