Patents by Inventor Jae Hong Lee

Jae Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967462
    Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 23, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Sung Kang, Su Yeon Lee, Won Jun Na, Byung Kun Kim, Yu Hong Oh, Sun Hwa Kim, Jae Eun Heo, Hoe Chul Jung
  • Publication number: 20240126043
    Abstract: A lens actuating unit is provided. The lens actuating unit includes: a bobbin configured to accommodate a lens module at an inner side of the bobbin; a first coil unit disposed at the bobbin; a housing disposed at an outer side of the bobbin; and a magnet unit configured to move the first coil unit through electromagnetic interaction with the first coil unit, wherein the housing includes a hole formed by being recessed from an inner side to an outer side to accommodate the magnet unit.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Inventors: Jae Hong CHO, Sang Hee LEE, In Jae YEO, Jin Suk HAN
  • Patent number: 11957669
    Abstract: One aspect of the present disclosure is a pharmaceutical composition which includes (R)—N-[1-(3,5-difluoro-4-methansulfonylamino-phenyl)-ethyl]-3-(2-propyl-6-trifluoromethyl-pyridin-3-yl)-acrylamide as a first component and a cellulosic polymer as a second component, wherein the composition of one aspect of the present disclosure has a formulation characteristic in which crystal formation is delayed for a long time.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 16, 2024
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Joon Ho Choi, Won Kyung Cho, Kwang-Hyun Shin, Byoung Young Woo, Ki-Wha Lee, Min-Soo Kim, Jong Hwa Roh, Mi Young Park, Young-Ho Park, Eun Sil Park, Jae Hong Park
  • Patent number: 11954626
    Abstract: Disclosed are a refrigerator and a method for displaying a user interface on the refrigerator, a user terminal, and a method for performing a function in the user terminal. The refrigerator according to the present disclosure may include: a storage chamber storing food therein; a temperature detection unit configured to detect the internal temperature of the storage chamber; a cooling unit configured to supply cold air to the storage chamber; a camera configured to photograph food in the storage chamber; a communication unit configured to communicate with a user terminal; a display; at least one processor electrically connected to the temperature detection unit, the camera, the cooling unit, and the communication unit; and a memory electrically connected to the at least one processor.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-hong Kim, Myung-jin Eom, Ik-soo Kim, Sang-kyung Lee, Hee-won Jin
  • Publication number: 20240114638
    Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: Yusuf CINAR, Jae Hong PARK, Han Hong LEE, Seon Gyun BAEK, Won-Gi HONG
  • Patent number: 11948752
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Jong Hyun Cho, Ji Hong Jo, Hang Kyu Cho, Jae Shik Shim, Yong In Kim, Sang Roc Lee
  • Publication number: 20240106441
    Abstract: A phase locked loop circuit and a semiconductor device are provided. The phased locked loop circuit includes a reference current generator configured to generate a summed compensation current in which at least one of a process change, a temperature change or a power supply voltage change are compensated and output the summed compensation current as a reference current, a current digital-to-analog converter configured to convert the reference current into a control current in accordance with a digital code and a voltage control oscillator configured to generate a signal based on the control current, wherein the summed compensation current is based on weighted-averaging a first type compensation current and a second type compensation current in response to at least one of the process change, the temperature change or the power supply voltage change.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyung Min LEE, Gyu Sik KIM, Seung Jin KIM, Jae Hong JUNG
  • Publication number: 20240103958
    Abstract: A method performed by a managing server includes: receiving, from an electronic device, operation data of the electronic device; identifying, by using artificial intelligence (AI), a device usage pattern of the electronic device; identifying, by using the AI, information related to a failure or an abnormal operation of the electronic device and a solution to the failure or the abnormal operation based on the device usage pattern and the operation data received from the electronic device; and transmitting, to a user terminal, the information related to the failure or the abnormal operation of the electronic device and the solution to the failure or the abnormal operation.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun LEE, Myung-Sun KIM, Ayush JAIN, Tae-Ho SWANG, Jae-Hong KIM, Hye-Jung CHO
  • Publication number: 20240091767
    Abstract: A gene amplification chip includes a chamber layer, a cover layer, a bottom layer, an inlet, and an outlet. The chamber layer has a first passage and through holes which are formed on one side of the first passage. The cover layer is disposed on one side of the chamber layer and has a cover channel formed to communicate with the first passage and the through holes, wherein the cover channel, the first passage and the through holes allow passage of liquids in a divided manner. The bottom layer is disposed on another side of the chamber layer and has a bottom channel formed to communicate with the first passage and the through holes. The inlet is formed in the cover layer and communicates with the cover channel. The outlet communicates with any one of the cover channel and the bottom channel.
    Type: Application
    Filed: December 15, 2022
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Jae Hong LEE, Won Jong JUNG, Kak NAMKOONG, Hyeong Seok JANG, Jin Ha KIM, Hyung Jun YOUN
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Patent number: 11935701
    Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Publication number: 20240084171
    Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
  • Patent number: 11925021
    Abstract: A semiconductor device, and method of manufacturing a semiconductor device, includes second conductive patterns separated from each other above a first stack structure which is penetrated by first channel structures and enclosing second channel structures coupled to the first channel structures, respectively. Each of the second conductive patterns includes electrode portions stacked in a first direction and at least one connecting portion extending in the first direction to be coupled to the electrode portions.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: March 5, 2024
    Assignee: SK hynix Inc.
    Inventors: Young Geun Jang, Wan Sup Shin, Ki Hong Lee, Jae Jung Lee
  • Patent number: 11857339
    Abstract: Disclosed is a headgear-type device for hazardous air quality warning and air quality improvement, wherein the device can collect biometric information of a worker, wired and wireless communications, and information about the quality of outside air around the worker so as to warn the worker of a hazard or improve air quality at the site.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: January 2, 2024
    Assignee: LEESTECH SYSTEM CO., LTD.
    Inventors: Jae Hong Lee, Soon Wi Kim, Won Sik Lee, Hyun Sik Lee, Na Young Lee, Soon Hyang Lee
  • Publication number: 20230381960
    Abstract: Disclosed is an integral self-monitoring soft actuator including a body portion configured to be driven by deformation due to stimulation; a first limiter integrally formed with respect to the longitudinal direction of the body portion to limit deformation of the body portion in the longitudinal direction; a second limiter that limits deformation of the body portion in the radial direction by including at least a pair of electrodes in a spiral shape integrally provided on the outer surface of the body portion; and a controller for controlling motion of the body portion, wherein the controller self-monitors deformation of the body portion by self-sensing changes in the intervals between the electrodes according to deformation of the body portion. According to the above configuration, deformation of the body portion may be self-detected in real time using the second limiter integrally provided with the body portion, thereby improving control efficiency.
    Type: Application
    Filed: December 13, 2021
    Publication date: November 30, 2023
    Applicant: Daegu Gyeongbuk Institute of Science and Technology
    Inventors: Jae Hong LEE, Hwa Joong KIM
  • Publication number: 20230381772
    Abstract: A gene amplification chip may include: a cover layer having a solution inlet through which a sample solution to be injected; a chamber layer disposed on one surface of the cover layer, and having a chamber to receive the sample solution when the sample solution is injected through the solution inlet such that an amplification reaction of the sample solution occurs in the chamber; a bottom layer disposed on another surface of the chamber layer; and a photothermal film attached to an outer surface of the bottom layer, and configured to convert light into heat to heat the sample solution received in the chamber.
    Type: Application
    Filed: September 28, 2022
    Publication date: November 30, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hong LEE, Kak NAMKOONG, Hyeong Seok JANG, Won Jong JUNG, Hyung Jun YOUN
  • Publication number: 20230334825
    Abstract: A device and a method for detecting an object includes a camera configured for obtaining an image frame for an external environment of a vehicle, storage configured for storing a class classification model of the image frame, and a processor. The processor extracts a class for distinguishing the object in the image frame, determines class confidences for each of pixels of the image frame, generates a distribution of confidences for grayscales of pixels belonging to a class of interest based on the class confidences, generates a critical range for determining a grayscale of the class of interest based on the distribution of the confidences for the grayscales, and generates a mask based on the critical range.
    Type: Application
    Filed: September 22, 2022
    Publication date: October 19, 2023
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation
    Inventor: Jae Hong LEE
  • Publication number: 20230302447
    Abstract: An apparatus and method for bio-particle detection are provided. The apparatus for bio-particle detection includes: a bio-particle detection chip including a substrate having a plurality of through-hole groups, each through-hole group of the plurality of through-hole groups including through-holes which pass through the substrate from a first surface of the substrate toward an second surface of the substrate opposite to the first surface, and which are configured to accommodate a sample solution loaded therein; and a processor configured to determine a number of through-holes, among the through holes of at least one through-hole group of the plurality of through-hole groups, having a target material encapsulated therein, based on at least one of an electrical signal and an optical signal corresponding to the through-holes of the at least one through-hole group, and to estimate a concentration of the target material based on the determined number.
    Type: Application
    Filed: August 16, 2022
    Publication date: September 28, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won Jong JUNG, Hyeong Seok JANG, Kak NAMKOONG, Hyung Jun YOUN, Jae Hong LEE
  • Patent number: 11726406
    Abstract: In a method of coating a photoresist, the photoresist may be provided to an upper surface of a rotating wafer. A hovering solution may be injected to an edge portion of the photoresist under a condition that the hovering solution may be hovered with respect to the edge portion of the photoresist with an air layer being interposed between the hovering solution and the edge portion of the photoresist to limit and/or prevent a bead of the photoresist from being formed on an edge portion of the upper surface of the wafer. Thus, the photoresist having a uniform thickness may be coated on the upper surface of the wafer to improve a yield of a semiconductor device by increasing an effective area of the edge portion of the wafer.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: August 15, 2023
    Assignees: Samsung Electronics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Sunghwan Kim, Ho-Young Kim, Seok Heo, Dongwook Kim, Sungjin Kim, Chaehung Lim, Jaekyung Park, Jae Hong Lee, Junyoung Lee
  • Publication number: 20230145041
    Abstract: The present disclosure relates to an apparatus and method for gene amplification. The apparatus for gene amplification may include: an upper main body comprising a first inlet to receive a sealing solution, a second inlet to receive a sample solution, and an upper passage that allows the sample solution and the sealing solution to move by capillary action; a lower main body disposed to oppose the upper main body, and having a lower passage through which the sealing solution moves by capillary action after being injected from the first inlet of the upper main body; a gene amplification chip configured to be inserted between the upper main body and the lower main body; and a porous medium configured to be inserted between the upper main body and the lower main body.
    Type: Application
    Filed: March 2, 2022
    Publication date: May 11, 2023
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Won Jong JUNG, Ho-Young Kim, Hyeong Seok Jang, Kak Namkoong, Tae Jeong Kim, Jae Hong Lee, Sohyun Jung