Patents by Inventor Jae-in Lee

Jae-in Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959819
    Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: April 16, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Su Jae Lee, Seong Hyun Kim, Chan Woo Park, Jae Bon Koo, Bock Soon Na, Ji-Young Oh
  • Patent number: 11961463
    Abstract: A pixel connected to a first scan line includes a light-emitting element including an anode and a cathode, a first transistor including a first electrode, a second electrode, and a gate electrode connected to a first node, a first capacitor connected between the first node and a second node, a second transistor connected between the second electrode of the first transistor and the first node including a gate electrode connected to the first scan line, a third transistor including a first electrode, a second electrode connected to the second node, and a gate electrode connected to the first scan line, and a fourth transistor including a first electrode connected to a first driving voltage line, a second electrode connected to the first electrode of the first transistor, and a gate electrode connected to the first scan line.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin-Wook Yang, Yu-Chol Kim, Donggyu Lee, Jaekeun Lim, Jae-Hyeon Jeon
  • Patent number: 11958438
    Abstract: A system and method for managing a tractor-trailer and a method are provided. The system includes: a control server to manage a position of a trailer, identification information on the trailer, and identification information on a tractor matched to the trailer with respect to each hub; a trailer to authenticate the tractor by comparing the identification information, which is received from the control server, on the tractor, with identification information received from the tractor, and to release an electronic parking brake (EPB) when an authentication result for the tractor is correct; and a tractor to authenticate the trailer by comparing the identification information, which is received from the control server, on the trailer with identification information received from the trailer to authenticate the trailer, and to be coupled to the trailer, when an authentication result for the trailer is correct.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Joo Han Nam, Jong Su Lim, Ki Beom Lee, Sang Hyu Lee, Hyun Jae Bang
  • Patent number: 11963351
    Abstract: The present disclosure relates to a semiconductor memory device and a manufacturing method of the semiconductor memory device. A semiconductor memory device includes a gate stacked structure, a channel layer passing through the gate stacked structure in a vertical direction, a memory layer disposed between the channel layer and the gate stacked structure, a dummy stacked structure extended toward the gate stacked structure, a first dummy pattern passing through the dummy stacked structure in the vertical direction, and a gap arranged in the first dummy pattern.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: April 16, 2024
    Assignee: SK hynix Inc.
    Inventor: Nam Jae Lee
  • Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11960022
    Abstract: The present invention relates to a spatial coordinate positioning system, particularly to a spatial coordinate positioning system which is capable of measuring a position of spatial positioning target in high-precision by calculating spatial coordinates of assistant point stations at a predetermined interval on the basis of a coordinate of a ground base point station and distance information between the assistant point stations in a space where the plurality of assistant point stations are installed of which coordinates were unknown.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: April 16, 2024
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventor: Ho-Jae Lee
  • Patent number: 11958750
    Abstract: Provided are a negative electrode active material which includes negative electrode active material particles which includes a silicon oxide (SiOx, 0<x?2); and at least one lithium silicate selected from Li2SiO3, Li2Si2O5, and Li4SiO4 in at least a part of the silicon oxide. The negative electrode active material particles have a maximum peak position by a Raman spectrum of more than 460 cm?1 and less than 500 cm?1. Also provided are a method of preparing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: April 16, 2024
    Assignee: SK On Co., Ltd.
    Inventors: Eunjun Park, Joon-Sup Kim, Gwi Ok Park, Jeongbae Yoon, Suk Chin Lee, Hansu Kim, Donghan Youn, Dong Jae Chung
  • Patent number: 11960855
    Abstract: Disclosed is an apparatus and method for performing deep learning operations. The apparatus includes a systolic array comprising multiplier accumulator (MAC) units, and a control circuit configured to control an operation of a multiplexer connected to at least one of the MAC units and operations of the MAC units according to a plurality of operation modes.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: April 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Dal Kwon, Hanmin Park, Seungwook Lee, Jae-Eon Jo
  • Patent number: 11961551
    Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soo Bong Chang, Young-Il Lim, Bok-Yeon Won, Seok Jae Lee, Dong Geon Kim, Myeong Sik Ryu, In Seok Baek, Kyoung Min Kim, Sang Wook Park
  • Patent number: 11962001
    Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Industry Academy Cooperation Foundation of Sejong University
    Inventors: Seung Min Oh, Jun Ki Rhee, Yoon Sung Lee, Ji Eun Lee, Sung Ho Ban, Ko Eun Kim, Woo Young Jin, Sang Mok Park, Sang Hun Lee, Seung Taek Myung, Hee Jae Kim, Min Young Shin
  • Publication number: 20240116044
    Abstract: An atomic layer deposition method for manufacturing a platinum-based alloy catalyst includes applying a support in a reactor and depositing an alloy of platinum and a non-platinum metal on the support through a super cycle comprising a first sub-cycle and a second sub-cycle.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 11, 2024
    Inventors: Jung Yeon Park, Woong Pyo Hong, Seung Jeong Oh, Se Hun Kwon, Susanta Bera, Hyun Jae Woo, Woo Jae Lee
  • Publication number: 20240116398
    Abstract: An electrified vehicle includes: a battery; a motor drive device configured to drive a motor through an inverter, based on a voltage of the battery; and a battery controller configured to determine whether to perform output limiting on the battery, based on whether a ratio of regenerative braking is less than or equal to a preset ratio, wherein the ratio of regenerative braking is varied according to an amount of charging of the battery and an amount of discharging of the battery within a preset time interval, and adjust, based on the output limiting being performed on the battery, a derate ratio associated with a battery output limit value.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 11, 2024
    Inventors: Yong Jae Kim, Ki Seung Baek, Jong Gu Lee, Gun Goo Lee, Jeong Han Park
  • Publication number: 20240116399
    Abstract: A power plant thermal-management-system control method for controlling thermal management systems in PMCs is provided. The thermal management systems are operated based on coolant temperatures of the PMCs of a power plant of a fuel cell vehicle to prevent the temperatures of the PMCs from deviating from a reference range, which in turn prevents degradation of fuel cells.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Jae Lee, Yei Sik Jeon
  • Publication number: 20240120019
    Abstract: Disclosed is a method for programming a storage device including a nonvolatile memory device and a storage controller for storing multi-bit data, programming, by the storage controller, the multi-bit data into the nonvolatile memory device based on a pre-programming operation, reading state group data of the multi-bit data generated in the nonvolatile memory device based on a program result of the pre-programming operation, and performing, by the storage controller, error correction decoding on the state group data.
    Type: Application
    Filed: March 20, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co, Ltd.
    Inventors: Hyeonwu KIM, Hojun Jo, Jihwan Mun, Yoonjin Lee, Jae Hun Jang
  • Publication number: 20240118149
    Abstract: A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Gae Hwang LEE, Youngjun YUN, Jong Won CHUNG, Yeongjun LEE, Won-Jae JOO, Yasutaka KUZUMOTO
  • Publication number: 20240120211
    Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 11, 2024
    Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
  • Publication number: 20240120427
    Abstract: Disclosed is a single photon detection device that comprises a first well, a heavily doped region provided on the first well, a guard ring provided on a side surface of the heavily doped region, and an insulating pattern inserted into the guard ring. The first well has a first conductivity type. The heavily doped region and the guard ring have a second conductivity type different from the first conductivity type.
    Type: Application
    Filed: April 26, 2023
    Publication date: April 11, 2024
    Inventor: Myung-Jae LEE
  • Publication number: 20240120213
    Abstract: A method of fabricating a semiconductor device is provided. The method includes: loading a substrate into a substrate processing apparatus; and processing the substrate, using the substrate processing apparatus. The processing the substrate includes: providing a process gas; generating a process etchant from the process gas, using plasma ignition, the process etchant including a first etchant and a second etchant; processing the substrate, using the process etchant; identifying a composition rate of the process etchant; and controlling the processing of the substrate based on a process result according to the composition rate of the process etchant.
    Type: Application
    Filed: August 30, 2023
    Publication date: April 11, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo Rim LEE, Myoung Jae SEO, Sung Gil KANG, Hyun Ho DOH, Sung Yong PARK, In Hye JEONG
  • Publication number: 20240117168
    Abstract: The present invention relates to a semiconductive resin composition for a high voltage power cable. Specifically, the present invention relates to a semiconductive resin composition comprising a base resin in which ethylene butyl acrylates having different melting indices are mixed, carbon black, an antioxidant, and a crosslinking agent. In addition, the present invention relates to a semiconductive resin composition for a high voltage power cable, the composition having excellent scorch stability and processability and low volume resistance even at a high temperature.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 11, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: In Jun LEE, Jae Yun LIM, Kisik KIM, Jeong Hyun PARK, Sang Kyu PARK