Patents by Inventor Jaesup N. Lee

Jaesup N. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5089878
    Abstract: A package for an integrated circuit is disclosed. The package includes a lead frame with an overlying dielectric layer. One or more conductive coupons are placed on the dielectric layer and act as multiple inductive paths for the power and ground lines. Decoupling capacitors may be attached between coupons.
    Type: Grant
    Filed: June 9, 1989
    Date of Patent: February 18, 1992
    Inventor: Jaesup N. Lee