Patents by Inventor Jakob Schillinger

Jakob Schillinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10401196
    Abstract: A method for producing a coil as a measurement transmitter for a sensor, including: providing electrical connections and a magnetic core for the coil, forming a coil former around the magnetic core in such a way that the magnetic core is at least partially enclosed by the coil former and the electrical connections are held by the coil former, winding at least one coil wire onto the formed coil former, and connecting the wound coil wire to the electrical connections.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: September 3, 2019
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Dietmar Huber, Frank Grunwald, Hilmar Müller
  • Patent number: 10390435
    Abstract: A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.
    Type: Grant
    Filed: February 18, 2018
    Date of Patent: August 20, 2019
    Assignee: CONTINENTAL TEVES AG & CO. OHG
    Inventors: Jakob Schillinger, Dietmar Huber, Svenja Raukopf, Lothar Biebricher
  • Publication number: 20190113370
    Abstract: A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.
    Type: Application
    Filed: March 27, 2017
    Publication date: April 18, 2019
    Inventors: Lothar Biebricher, Marco Benner, Jakob Schillinger, Dietmar Huber, Thomas Fischer, Stefan Günthner, Michael Schulmeister
  • Patent number: 10260907
    Abstract: A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: April 16, 2019
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Dietmar Huber, Lothar Biebricher
  • Patent number: 10247585
    Abstract: A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including—a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface, —wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: April 2, 2019
    Assignee: Continental Teves AG & oHG
    Inventors: Svenja Raukopf, Jakob Schillinger, Michael Schulmeister
  • Publication number: 20190075670
    Abstract: A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.
    Type: Application
    Filed: October 26, 2018
    Publication date: March 7, 2019
    Inventors: Henryk Frenzel, Dietmar Huber, Jakob Schillinger, Joerg Moestl, Karl-Heinz Scherf, Georg Weber
  • Patent number: 10178781
    Abstract: An electronic device including: an electronic circuit accommodated in a circuit housing having a first thermal expansion coefficient, and a molded body which surrounds the circuit housing, the body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The molded body is fixed to the circuit housing at least at two different mutually spaced fixing points on the circuit housing.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: January 8, 2019
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Ulrich Schrader, Dietmar Huber
  • Patent number: 10136533
    Abstract: A method is provided for producing an electronic module that includes an electronic assembly with a conductor which is arranged in a housing, and which includes an electrical contact guided out through the housing wall. In the method, a protective layer is removed from an area of the conductor by ablation, and then a potting or casting compound is introduced into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: November 20, 2018
    Assignees: Continental Teves AG & Co. oHG, Continental Automotive GmbH
    Inventors: Henryk Frenzel, Dietmar Huber, Jakob Schillinger, Joerg Moestl, Karl-Heinz Scherf, Georg Weber
  • Publication number: 20180323134
    Abstract: A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.
    Type: Application
    Filed: September 29, 2016
    Publication date: November 8, 2018
    Inventors: Svenja Raukopf, Lothar Biebricher, Dietmar Huber, Jakob Schillinger
  • Publication number: 20180277393
    Abstract: The invention relates to a method for producing a connecting element, wherein electrical connections are defined by selective stamping-out. The invention further relates to a connecting element produced in this way and to a sensor arrangement having a connecting element of this kind.
    Type: Application
    Filed: May 30, 2018
    Publication date: September 27, 2018
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Dietmar Huber, Svenja Raukopf, Jakob Schillinger, Martin Throm
  • Publication number: 20180175573
    Abstract: A method for establishing a plug connection, and a method for strengthening a plug connection, wherein a connecting zone is welded with a laser beam which passes through a surrounding housing owing to transparency.
    Type: Application
    Filed: February 18, 2018
    Publication date: June 21, 2018
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Dietmar Huber, Svenja Raukopf, Jakob Schillinger
  • Publication number: 20180177053
    Abstract: A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.
    Type: Application
    Filed: February 18, 2018
    Publication date: June 21, 2018
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Dietmar Huber, Svenja Raukopf, Lothar Biebricher
  • Patent number: 9961779
    Abstract: A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: May 1, 2018
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Lothar Biebricher, Michael Schulmeister, Jakob Schillinger, Dietmar Huber, Thomas Fischer, Stefan Günthner, Waldemar Baumung
  • Publication number: 20180011124
    Abstract: A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, —wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.
    Type: Application
    Filed: January 26, 2016
    Publication date: January 11, 2018
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Svenja RAUKOPF, Jakob SCHILLINGER, Michael SCHULMEISTER
  • Publication number: 20170370750
    Abstract: A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including—a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface,—wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.
    Type: Application
    Filed: January 26, 2016
    Publication date: December 28, 2017
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Svenja Raukopf, Jakob Schillinger, Michael Schulmeister
  • Patent number: 9832892
    Abstract: A sensor for outputting an electrical signal on the basis of a detected physical variable, including: a measuring circuit accommodated in a circuit housing and capable of contacting an external circuit by an electric signal connection; and a protective body consisting of a protective compound with an opening, the compound surrounding the circuit housing and the opening exposing part of the circuit housing. The surface of the circuit housing has a moulded element which is surrounded by the protective compound.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: November 28, 2017
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Dietmar Huber, Lothar Biebricher, Manfred Goll, Marco Benner
  • Patent number: 9796348
    Abstract: The invention relates to a circuit for conducting an electric current, by an electrical component, between a vehicle battery and an electrical network component that can be connected to the vehicle battery. The circuit includes a first electrical line segment and a second line segment that is separated from the first line segment by a spacer. The line segments are connected to one another by the electrical component.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: October 24, 2017
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Dietmar Huber, Klaus Rink, Wolfgang Jöckel, Martin Haverkamp
  • Publication number: 20170165885
    Abstract: A method for producing a sensor which is equipped to detect a physical field as a function of a dimension to be measured using a measuring sensor and to emit an electrical output signal based on the detected physical field via a data cable, including:—placing the measuring sensor and the data cable on a mould defining the position of the measuring sensor and the data cable,—Coating the measuring sensor and the data cable positioned in the mould with a first material,—Removing the measuring sensor and data cable coated with the first material from the mould, and—Coating the measuring sensor and data cable removed from the mould and coated with the first material with a second material.
    Type: Application
    Filed: October 8, 2014
    Publication date: June 15, 2017
    Inventors: Manfred Goll, Ulrich Schrader, Jakob Schillinger, Gerhard Sticksel
  • Publication number: 20170164493
    Abstract: Production method for an electronic module, comprising a housing and at least one electronic assembly, wherein the electronic assembly is arranged, in particular at least partially, in an interior chamber of the housing, wherein, however, electrical contacts are guided through the housing wall, out of the interior chamber of the housing, to an outer face of the housing, wherein the interior chamber of the housing is filled with a casting compound at least in such a way that the casting compound covers passage points in the housing wall at which the electrical contacts are guided through the housing wall, wherein a layer of the at least one assembly is removed at least in the region of the passage points in the housing wall.
    Type: Application
    Filed: February 18, 2015
    Publication date: June 8, 2017
    Inventors: Henryk FRENZEL, Dietmar HUBER, Jakob SCHILLINGER, Joerg MOESTL, Karl-Heinz SCHERF, Georg WEBER
  • Publication number: 20170146345
    Abstract: A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.
    Type: Application
    Filed: June 25, 2015
    Publication date: May 25, 2017
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Thomas Fischer, Jakob Schillinger, Dietmar Huber, Stefan Günthner, Lothar Biebricher, Michael Schulmeister