Abstract: A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and -encapsulating the electronic component with the encapsulation material.

Abstract: A method for producing a coil as a measurement transmitter for a sensor, including: providing electrical connections and a magnetic core for the coil, forming a coil former around the magnetic core in such a way that the magnetic core is at least partially enclosed by the coil former and the electrical connections are held by the coil former, winding at least one coil wire onto the formed coil former, and connecting the wound coil wire to the electrical connections.

Abstract: An electronic device including: an electronic unit accommodated in a circuit housing and a moulded body which surrounds the circuit housing. The moulding compound has a cut-out that exposes the circuit housing, in which cut-out an identification that characterizes the electronic circuit is arranged.

Abstract: The sensor for detecting the position of a generator element which outputs a position-dependent physical variable, the sensor includes a transducer for converting the physical variable into an electric generator signal, a circuit on a wiring support for receiving the generator signal from the transducer and outputting a measurement signal that corresponds to the generator signal and a protective compound which at least partially surrounds the transducer and the wiring support, thus retaining the transducer on the wiring support.

Abstract: A sensor for outputting an electrical signal on the basis of a detected physical variable, including: a measuring circuit accommodated in a circuit housing and capable of contacting an external circuit by an electric signal connection; and a protective body consisting of a protective compound with an opening, the compound surrounding the circuit housing and the opening exposing part of the circuit housing. The surface of the circuit housing has a moulded element which is surrounded by the protective compound.

Abstract: A wiring device for wiring an electronic apparatus including an interface, a conductor track and a component fitting island that is connected to the interface via the conductor track that is set up to carry an electronic component and to make electrical contact with the interface via the electrical conductor track, wherein the component fitting island is free of a web element that is set up to hold the component fitting island on a support element during a housing process housing the component fitting island.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method is specified for producing a strain gauge arrangement (14) on a surface of a machine element (2), particularly a bearing ring (3) or a shaft (17), wherein a deformation-sensitive measurement layer (6) and a protective layer (8) situated thereabove are applied to the surface. The protective layer (8) is locally removed by laser processing and the exposed measurement layer (6) is contacted electrically. A machine element (2), particularly a bearing ring (3) or a shaft (17), with a strain gauge arrangement (14) produced according to the method is also provided.

Abstract: A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.

Abstract: The invention relates to a circuit for conducting an electric current, by an electrical component, between a vehicle battery and an electrical network component that can be connected to the vehicle battery. The circuit includes a first electrical line segment and a second line segment that is separated from the first line segment by a spacer. The line segments are connected to one another by the electrical component.

Abstract: A sensor having at least one sensor element (1), at least one signal processing element (2), and a housing (7) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected to the carrier means. The carrier means (4) is also at least electrically connected to the electrical interface.

Abstract: The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A piezoresistive pressure sensor that uses a protective gel to protect the piezoresistive device is susceptible to lead wire failure by vibration-induced waves in the protective gel. Such waves can be reduced and the device made more robust by the use of three-dimensional structures in the gel, which are configured to reduce and/or re-direct vibration-induced pressure waves in the gel. The structures are referred to as “breakwaters” in that they protect lead wires and lead wire connections from wave fronts and the damage that wave-induced pressure on the lead wires causes.

Abstract: An electronic chip, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.

Abstract: A piezoresistive pressure sensor that uses a protective gel to protect the piezoresistive device is susceptible to lead wire failure by vibration-induced waves in the protective gel. Such waves can be reduced and the device made more robust by the use of three-dimensional structures in the gel, which are configured to reduce and/or re-direct vibration-induced pressure waves in the gel. The structures are referred to as “breakwaters” in that they protect lead wires and lead wire connections from wave fronts and the damage that wave-induced pressure on the lead wires causes.

Abstract: The procedure and the facility are used for wireless transmission between a wheel module (9) arranged in a tire (2) and an external control device (3). A first transmission signal is transmitted from an antenna (6) of the control device (3) to an antenna (11) of the wheel module (9). Data is transmitted via a second transmission signal from the wheel module (9) to the control device (3), whereby the first transmission signal has a different frequency from the second transmission signal. The first transmission signal is received by the antenna (11) of the wheel module (9) during a coupling period, within which while the tires (2) are rotating, an area of influence (15) of the antenna (11) of the wheel module (9) which also rotates, and a stationary area of influence (14) of the antenna (6) of the control device (3) overlap. After the beginning of the coupling period is recognised, the data transmission is started from the wheel module (9) to the control device (3).

Abstract: Disclosed is a vehicle sensor (4) for detecting impact sound, including a measured-value sensor (4.1) for detecting an impact sound. The measured-value sensor (4.1) includes several individual, separate measured-value sensing elements (4.1.x), each of which is coupled to a vehicle structure (5) in such a way that impact sound waves are transmitted by the vehicle structure (5) to the measured-value sensing elements (4.1.x).