Abstract: A composite contains substrate fibers, and an activated organic coating, on the substrate fibers. The activated organic coating is formed at a low temperature, making possible the use of substrate fibers have a softening or decomposition temperature of at most 500° C.

Abstract: A composite, contains substrate fibers, and carbon ion exchanger, on the substrate fibers. The fiber provides a support to the carbon ion exchanger, resulting in excellent mechanical properties, compared to carbon fiber ion exchangers.

Abstract: Fiber material for adsorbing contaminants is prepared according to the steps of preparing coating a glass or mineral fiber substrate with a resin, cross-linking the resin, heating the coated fiber substrate and resin to carbonize the resin, and exposing the coated fiber substrate to an etchant to activate the coated fiber substrate.

Abstract: Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.

Abstract: This invention provides crosslinked copolyester adhesives, rigid foams, protective coating, matrices for composites and dielectric for electrical circuits, and methods for making crosslinked copolyester adhesives, rigid foams, protective coatings, matrices for composites and dielectrics for electrical circuits. Two or more adherends may be bonded together using a crosslinked copolyester adhesive by first combining at least one oligomer having carboxylic acid end groups with at least one oligomer having ester end groups, where at least one of the oligomers is branched, to form a mixture. Then, the mixture is applied to the adherends to be bonded and the mixture on the adherends is cured. Next, the adherends are positioned such that the cured mixtures contact and the contacted mixtures heated to form a bond between the cured mixtures.

Abstract: Borazine oligomers in liquid form are produced and used to create composites of fibers bonded to boron nitride as a matrix and also to coat or increase the density of various fiber composites.

Abstract: Hot roll fusers are made with a matrix resin which is an elastomer having a glass transition between 90.degree. C. and 160.degree. C. and a structure represented by the formula X--Ar--Y--Ar--X wherein Ar is an aromatic ring structure, Y is O, S, C.dbd.O, SO.sub.2, C(CH.sub.3).sub.2, C(CF.sub.3).sub.2, CH.sub.2 or (CF.sub.2).sub.n and X is --O--C.tbd.N, --C.tbd.

Abstract: Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and O to about 75 mole percent of recurring Units II wherein ##STR1## wherein each R and R.sub.2 is arylene or cycloalkylene or alkylene or alkylidene.

Abstract: A process for generating a capacitive servo pattern on a magnetic storage disk, comprising the steps of: (1) coating the disk with a solution of noble metal compound to form a film of the compound on the disk, (2) exposing said film to radiation through a mask to generate an image on the film, and (3) plating the disk on the areas exposed to radiation.

Abstract: An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein D is ##STR2## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR3## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein x is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer wtih the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.

Abstract: A process for making a polymer with ultra-high mechanical properties by subjecting to compression and rotation in a contained geometry at a viscosity in the range of from 50 to 10.sup.4 poise an aromatic liquid crystalline copolyester.

Abstract: An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR2## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein X is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.

Abstract: A method for modifying the surface properties of a material which applies a deformational force which exceeds the elastic limit of the material at the surface so that a plastic deformation of the surface occurs without modifying the bulk properties of the material.

Abstract: A process for producing an extremely smooth or planarized layer of material employs a polymeric material which, when melted has a viscosity enabling it to flow into all crevices and voids on the treated surface. Subsequent heating cures the polymer to form a planarized layer.

Abstract: A method for improving the durability, surface finish, and magnetic properties of a magnetic recording disk, the recording disk having a magnetic coating material with load bearing particles therein, by applying thereto a deformational force which exceeds the elastic limit of the coating material.

Abstract: A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.

Abstract: The sensitivity of a positive working electron beam resist is increased by using as the resist material a resin which is a condensation product of formaldehyde with a phenol or a cresol having a chloro substituent ortho to the hydroxyl group on its aromatic ring.

Abstract: The present invention is concerned with enhancement of resist development. In particular it is concerned with obtaining high solubility rate ratio between the exposed and the unexposed regions of a resist and also obtaining shorter development time. These objectives are achieved by treating the resist with a liquid trialkylamine having from two to eight carbon atoms in each alkyl group.

Abstract: The resistance of a resist of plasma etching is enhanced by first cross-linking the resist and then contacting it with an aqueous solution of NaOH or KOH. The process is useful to form microcircuits having increased density of geometry.

Abstract: Soluble, polymerizable oligomers having a number average molecular weight of from about 200 to about 10,000, are obtained by treating triethynylbenzene with an oxygen-carrying, amine-basic cupric salt complex catalyst in the presence of a molar excess over the monomer of an aromatic monacetylenic capping agent. The oligomers are used to form polymers which are adhesives and coatings.